Pressure measuring device for protection of pressure sensor from thermomechanical stress

US10768069B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10768069-B2
Application numberUS-201515537900-A
CountryUS
Kind codeB2
Filing dateNov 18, 2015
Priority dateDec 22, 2014
Publication dateSep 8, 2020
Grant dateSep 8, 2020

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  1. Title

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  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A pressure measuring device comprises a carrier, a base which is connected to the carrier, and a pressure sensor which is mounted on the base, wherein a bottom base area of the pressure sensor is greater than a top base area of the base, the pressure sensor being protected against thermomechanical stresses by an end of the base, which is facing away from the pressure sensor, the end being adhesively bonded into a recess in the support by an adhesive bond.

First claim

Opening claim text (preview).

The invention claimed is: 1. Pressure measuring device, having: a carrier made of a metal; a base connected to said carrier; a centering device for centering said base; a pressure sensor mounted on said base wherein a bottom base surface of said pressure sensor is larger than a top base surface of said base, wherein the pressure sensor is mounted onto the top base surface of said base, wherein: a recess is provided in said carrier; said recess has a floor surface; an end, oriented away from said pressure sensor, of said base is glued into said recess in said carrier by means of an adhesive bond; a bottom base surface of said base is placed on said floor surface of said recess; said centering device is formed by an inner side surface of said recess, said inner side surface of said recess tapering towards said floor surface of said recess, such that a base area of said recess at said floor surface corresponds to a base area of said bottom base surface of said base; and said adhesive bond between said carrier and said base extends over an external jacket surface of the end of said base running in said recess, the end of said base is placed on the floor surface of said recess. 2. The pressure measuring device, according to claim 1 , wherein: said carrier is made of stainless steel. 3. The pressure measuring device according to claim 1 , wherein: said base has an overall length of from 3 mm to 7.5 mm; and said end of said base running in said recess has a length greater than or equal to 2.5 mm; and said end of the base protruding from said recess and bearing said pressure sensor has a length on the order of 0.5 mm. 4. The pressure measuring device according to claim 1 , wherein: said adhesive bond between said carrier and said base extends over an end surface of said base oriented towards the floor surface of said recess. 5. The pressure measuring device according to claim 4 , wherein: said base has an overall length on the order of 0.5 to 3 mm. 6. The pressure measuring device according to claim 1 , wherein: said adhesive bond between said carrier and said base extends over the external circumferential surface of said end of said base running in said recess and an end surface of said base oriented towards the floor surface of said recess. 7. The pressure measuring device according to claim 1 , wherein: said base is made of stainless steel, Invar, or Kovar, of silicon carbide, or of a ceramic of aluminum oxide, silicon nitride, or aluminum nitride, or of borosilicate glass. 8. The pressure measuring device according to claim 1 , wherein: said adhesive bond between said base and said carrier comprises an adhesive bond upon epoxy resin, a thermoplastic adhesive, or a silicon rubber. 9. The pressure measuring device according to claim 1 , wherein: the pressure measuring device is a differential pressure measuring device or an absolute or relative pressure measuring device for measuring pressures greater than or equal to 4 MPa (40 bar); and said base is made of a stainless steel, Invar, Kovar, or ceramic, aluminum oxide, silicon nitride, silicon carbide, or aluminum nitride having a modulus of elasticity greater than or equal to 200,000 MPa. 10. The pressure measuring device according to claim 1 , wherein: said base is made of a material that has a coefficient of thermal expansion matched to the coefficient of thermal expansion of said pressure sensor. 11. The pressure measuring device according to claim 1 , wherein: said base has a length in the range of 0.5 mm to 7.5 mm, an outer diameter in the range of 0.5 mm to 7 mm, and is bar-shaped, or has an inner diameter in the range of 0.25 mm to 4 mm.

Assignees

Inventors

Classifications

  • G01L19/145Primary

    with stress relieving means · CPC title

  • Means for compensating for effects of changes of temperature {, i.e. other than electric compensation} · CPC title

  • Details about the mounting of the sensor to support or covering means · CPC title

  • G01L19/146Primary

    using flexible element between the transducer and the support · CPC title

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Frequently asked questions

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What does patent US10768069B2 cover?
A pressure measuring device comprises a carrier, a base which is connected to the carrier, and a pressure sensor which is mounted on the base, wherein a bottom base area of the pressure sensor is greater than a top base area of the base, the pressure sensor being protected against thermomechanical stresses by an end of the base, which is facing away from the pressure sensor, the end being adhes…
Who is the assignee on this patent?
Endress Hauser Gmbh Co Kg, Endress Hauser Se Co Kg
What technology area does this patent fall under?
Primary CPC classification G01L19/145. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 08 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).