Optical device, method for manufacturing same, and display device

Patent metadata

Field	Value
Publication number	US-10767833-B2
Application number	US-201916390430-A
Country	US
Kind code	B2
Filing date	Apr 22, 2019
Priority date	Aug 16, 2018
Publication date	Sep 8, 2020
Grant date	Sep 8, 2020

Abstract

Provided is an optical device, a method for manufacturing the same, and a display device. The optical device includes a chip substrate and a quantum dot film. The quantum dot film includes a quantum dot functional layer, a first package substrate, a second package substrate, and a prism structure and/or a uniform-light diffusing film.

First claim

What is claimed is:

1. An optical device, comprising:
a chip substrate having a first face on which a plurality of light-emitting chips for emitting blue light is distributed in an array; and
a quantum dot film arranged on a side of the chip substrate where the first face is located and configured to convert the blue light emitted by the plurality of light-emitting chips into monochromatic light in various colors capable of being mixed into white light,
wherein the quantum dot film comprises:
a quantum dot functional layer,
a first package substrate arranged on a side of the quantum dot functional layer away from the chip substrate and comprising a first side surface away from the quantum dot functional layer and a second side surface arranged opposite to the first side surface, and
a second package substrate arranged on a side of the quantum dot functional layer proximate to the chip substrate, and comprising a third side surface away from the quantum dot functional layer and a fourth side surface arranged opposite to the third side surface, and
wherein the quantum dot film further comprises:
a prism structure integrated on the first side surface of the first package substrate with the first package substrate as a base substrate; and
a uniform-light diffusing film integrated on the third side surface of the second package substrate with the second package substrate as a base substrate.

2. The optical device of claim 1 , wherein the quantum dot film further comprises:
a first isolation protective layer arranged on the second side surface of the first package substrate; and
a second isolation protective layer arranged on the fourth side surface of the second package substrate.

3. The optical device of claim 1 , wherein the uniform-light diffusing film comprises a transflective film, comprising:
a plurality of reflective regions configured to reflect the blue light; and
a transmissive region configured allow the blue light to pass therethrough,
wherein the plurality of reflective regions is distributed in an array on the second package substrate, and orthogonal projections of the plurality of reflective regions on the first face of the chip substrate the plurality of light-emitting chips, respectively.

4. The optical device of claim 1 , wherein a highly-reflective layer is arranged on a region of the first face of the chip substrate, on which none of the plurality of light-emitting chips is arranged.

5. The optical device of claim 4 , wherein the highly-reflective layer is a white-light-highly-reflective layer having a reflectivity for white light greater than a preset value.

6. The optical device of claim 5 , wherein the white-light-highly-reflective layer comprises a composite film layer of a tantalum pentoxide film layer and a silicon dioxide film layer, a silver plated film layer or an aluminum plated film layer.

7. A method for manufacturing an optical device, comprising:
providing a first package substrate comprising a first side surface and a second side surface arranged opposite to each other and a second package substrate comprising a third side surface and a fourth side surface disposed opposite to each other;
bonding the second side surface of the first package substrate and the fourth side surface of the second package substrate by applying a quantum dot functional layer between the first package substrate and the second package substrate to form a quantum dot film after the quantum dot functional layer has been cured;
forming a chip substrate having a first face on which a plurality of light-emitting chips for emitting blue light is distributed in an array; and
arranging the quantum dot film on a side of the chip substrate where the first face is located,
wherein the providing the first package substrate and the second package substrate comprises:
forming a prism structure on the first side surface of the first package substrate with the first package substrate as a base substrate, and
forming a uniform-light diffusing film on the third side surface of the second package substrate with the second package substrate as a base substrate.

8. The method of claim 7 , wherein the uniform-light diffusing film comprises a transflective film that comprises:
a plurality of reflective regions configured to reflect the blue light; and
a transmissive region configured to allow the blue light to pass therethrough,
wherein the plurality of reflective regions is distributed in an array on the second package substrate, and orthogonal projections of the plurality of reflective regions on the first face of the chip substrate completely coincide with the plurality of light-emitting chips, respectively.

9. The method of claim 7 , wherein the forming the prism structure on the first side surface of the first package substrate with the first package substrate as the base substrate comprises:
forming the prism structure on the first side surface of the first package substrate with the first package substrate as the base substrate through a rolling method.

10. The method of claim 8 , wherein the forming the uniform-light diffusing film on the third side surface of the second package substrate with the second package substrate as the base substrate comprises:
plating reflective films on the third side surface of the second package substrate at positions corresponding to the plurality of reflective regions of the transflective film by an ion beam sputter coating method, to form the transflective film.

11. The method of claim 7 , wherein prior to bonding the second side surface of the first package substrate and the fourth side surface of the second package substrate, the method further comprises:
forming a first isolation protective layer on the second side surface of the first package substrate by an ion beam sputter coating method; and
forming a second isolation protective layer on the fourth side surface of the second package substrate by an ion beam sputter coating method.

12. The method of claim 7 , wherein the forming the chip substrate comprises:
forming a highly-reflective layer on a region of the first face of the chip substrate, on which none of the plurality of light-emitting chips is arranged.

13. The method of claim 10 , wherein the highly-reflective layer is a white-light-highly-reflective layer having a reflectivity for white light greater than a preset value.

14. The method of claim 13 , wherein the white-light-highly-reflective layer comprises a composite film layer of a tantalum pentoxide film layer and a silicon dioxide film layer, a silver plated film layer or an aluminum plated film layer.

15. A display device comprising the optical device of claim 1 .

16. The display device of claim 15 , wherein the quantum dot film further comprises:
a first isolation protective layer arranged on the second side surface of the first package substrate; and
a second isolation protective layer arranged on the fourth side surface of the second package substrate.

17. The display device of claim 15 , wherein the uniform-light diffusing film comprises a transflective film that comprises:
a plurality of reflective regions configured to reflect the blue light; and
a transmissive region configured to allow the blue light to pass therethrough,
wherein the plurality of reflective regions is distributed in an array on the second package substrate, and orthogonal projections of the plurality of reflective regions on the first face of the chip substrate completely coincide with the plurality of light-emitting chips, respectively.

18.

Assignees

• Hefei Boe Optoelectronics Tech
• Boe Technology Group Co Ltd

Inventors

• Zhang Bing
• Geng Xiaolin
• Gao Liang
• Qin Jianwei
• Tang Hai
• Gao Lu
• Jie Jingbin
• Han Bo

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/855

  Optical field-shaping means, e.g. lenses · CPC title

• H10H20/8514

  characterised by their shape, e.g. plate or foil · CPC title

• H10H20/856

  Reflecting means · CPC title

• H10H20/8513

  having two or more wavelength conversion materials · CPC title