Method for producing skin-covered, expanded bead molded article

US10766166B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10766166-B2
Application numberUS-201514792763-A
CountryUS
Kind codeB2
Filing dateJul 7, 2015
Priority dateJul 18, 2014
Publication dateSep 8, 2020
Grant dateSep 8, 2020

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for producing a skin-covered molded article including filling polypropylene-based resin expanded beads in a hollow space of a thermoplastic resin skin and feeding steam into the hollow space to fusion-bond the expanded beads together, the expanded beads showing specific DSC characteristics involving a specific high temperature peak(s) with specific heat of fusion.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for producing a skin-covered, expanded bead molded article comprising the steps of: providing a skin of a thermoplastic resin molded article defining a hollow space therewithin; filling polypropylene-based resin expanded beads in the hollow space; and then feeding a heating medium into the hollow space through one or more heating medium feeding pins inserted into the hollow space to fusion-bond the expanded beads to each other and to form an expanded bead molded article that is covered with the skin; wherein the polypropylene-based resin expanded beads are prepared from a polypropylene-based resin which has a melting point of 140 to 155° C. and which is selected from the group consisting of ethylene-propylene random copolymers, propylene-butene random copolymers, and propylene-ethylene-butene random copolymers, wherein the polypropylene-based resin expanded beads have such a crystal structure that gives a first DSC curve obtained when a measurement specimen sampled from the polypropylene-based resin expanded beads is heated from 23° C. to 200° C. at a heating speed of 10° C./min and a second DSC curve obtained when the measurement specimen remaining after the measurement of the first DSC curve is cooled from 200° C. to 40° C. at a cooling rate of 10° C./minute and then again heated to 200° C. at a heating rate of 10° C./minute, said first DSC curve having an intrinsic endothermic peak intrinsic to the polypropylene-based resin constituting the polypropylene-based resin expanded beads and at least one high temperature endothermic peak which is located on a higher temperature side of the intrinsic endothermic peak, said at least one high temperature endothermic peak does not appear in the second DSC curve, wherein a total heat of fusion ΔHt of the entire endothermic peaks of the DSC curve is more than 75 J/g, a ratio ΔH2/ΔHt of a total heat of fusion ΔH2 of said at least one high temperature endothermic peak to the total heat of fusion ΔHt is 0.20 to 0.30, wherein the heat of fusion ΔH2 is greater than 15 J/g and not greater than 23 J/g, and a heat of fusion ΔHh of that portion of said at least one high temperature endothermic peak which is higher than the peak top temperature of a lowest temperature peak is 6 J/g or more and 10 J/g or less, said lowest temperature peak being that high temperature endothermic peak which has the lowest peak top temperature among the peak top temperatures of said at least one high temperature endothermic peak with the proviso that when there is only one high temperature endothermic peak in said DSC curve, the peak top temperature of the only one high temperature endothermic peak is said lowest temperature peak. 2. The method according to claim 1 , wherein the thermoplastic resin molded article is obtained by blow molding and wherein the polypropylene-based resin expanded beads are filled in the hollow space of the thermoplastic resin molded article while the thermoplastic resin molded article is in a softened state. 3. The method according to claim 1 , wherein the polypropylene-based resin expanded beads have a bulk density of 20 to 60 kg/m 3 . 4. The method according to claim 1 , wherein the thermoplastic resin molded article is formed of a polypropylene-based resin. 5. The method according to claim 1 , wherein a difference ΔTp in peak top temperature between the intrinsic endothermic peak and a neighboring high temperature endothermic peak is 15° C. or more. 6. The method according to claim 1 , wherein said DSC curve has only one high temperature peak and that said lowest temperature peak is said only one high temperature peak. 7. The method according to claim 1 , wherein the ΔHt of the entire endothermic peaks is not more than 120 J/g. 8. The method according to claim 1 , wherein said feeding of the heating medium into the hollow space is carried out using two first and second groups of steam pins in such a manner that the heating medium is first fed into the hollow space through the first group of steam pins while sucking the heating medium from the second group of steam pins, the heating medium being next fed through the second group of steam pins while sucking the heating medium through the first group of steam pins, and, thereafter, fed through both first and second groups of steam pins, and wherein each of the steam pins of the first group is spaced apart a distance of 200 to 400 mm from its adjacent steam pin of the second group.

Assignees

Inventors

Classifications

  • Preforms or parisons characterised by their configuration, e.g. geometry, dimensions or physical properties · CPC title

  • the preform having one end closed · CPC title

  • Hydrogen, oxygen, CO2, nitrogen or noble gases · CPC title

  • Ethene-propene or ethene-propene-diene copolymers · CPC title

  • Extrusion of the foamable blend · CPC title

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What does patent US10766166B2 cover?
A method for producing a skin-covered molded article including filling polypropylene-based resin expanded beads in a hollow space of a thermoplastic resin skin and feeding steam into the hollow space to fusion-bond the expanded beads together, the expanded beads showing specific DSC characteristics involving a specific high temperature peak(s) with specific heat of fusion.
Who is the assignee on this patent?
Jsp Corp
What technology area does this patent fall under?
Primary CPC classification B29C44/14. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 08 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).