Leveling agent and electroplating composition comprising the same

Patent metadata

Field	Value
Publication number	US-10760174-B2
Application number	US-201816191464-A
Country	US
Kind code	B2
Filing date	Nov 15, 2018
Priority date	Nov 28, 2017
Publication date	Sep 1, 2020
Grant date	Sep 1, 2020

Abstract

The present invention relates to a leveling agent and electroplating composition comprising the same. When features are plated using the electroplating composition of the present invention, excellently leveled plated surfaces with minimized defects may be obtained.

First claim

What is claimed is:

1. A leveling agent for electroplating comprising a compound of Chemical Formula 1, as follows:

In Chemical Formula 1,
R 1 and R 2 are groups which are the same as or different from each other, each of which is independently selected from a group of hydrogen, halogens, and C 1 to C 10 alkyls, and which may form a fused ring by being combined with each other; and
R 3 is a group selected from hydrogen and C 1 to C 10 alkyls.

2. The leveling agent for electroplating of claim 1 , wherein R 1 and R 2 are hydrogen or halogens.

3. The leveling agent for electroplating of claim 2 , wherein the halogen is chlorine (Cl).

4. The leveling agent for electroplating of claim 1 , wherein R 3 is hydrogen.

5. The leveling agent for electroplating of claim 1 , wherein the compound expressed by Chemical formula 1 is a group selected from the compounds of the following Chemical Formulas 2 to 4:

6. An electroplating composition, comprising:
A metal ion supply source;
An electrolyte; and
a leveling agent described in claim 1 .

7. The electroplating composition of claim 6 , wherein the content of the leveling agent is 0.0001 to 0.02 wt % based on the total weight of the metal ion supply source, the electrolyte, and the leveling agent.

8. The electroplating composition of claim 6 , further comprising: an accelerator and a suppressor.

Assignees

• Soulbrain Co Ltd

Inventors

• Jang Min Jung
• Yun Jong Cheol
• Kim Wan Joong
• Ryu Hee Jeong
• Park Seung Min

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W20/057

  by selectively depositing, e.g. by using selective CVD or plating · CPC title

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title

• H10P14/44

  Physical vapour deposition [PVD] · CPC title

• C07D275/04

  condensed with carbocyclic rings or ring systems · CPC title