Support substrates for microfluidic die

Patent metadata

Field	Value
Publication number	US-10759169-B2
Application number	US-201916357100-A
Country	US
Kind code	B2
Filing date	Mar 18, 2019
Priority date	Dec 30, 2015
Publication date	Sep 1, 2020
Grant date	Sep 1, 2020

Abstract

The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.

First claim

The invention claimed is:

1. A microfluidic component, comprising:
a support including:
a first rigid layer;
a second rigid layer; and
a flexible layer having a first portion and a second portion, the first rigid layer being separated from the second rigid layer by the first portion; and

contact pads on the second portion of the flexible layer.

2. The microfluidic component of claim 1 wherein the first rigid layer includes a first opening, the second rigid layer includes a second opening, and the flexible layer includes a third opening, the first, second, and third openings being aligned with each other.

3. The microfluidic component of claim 2 , further comprising a microfluidic die on the second rigid layer and aligned with the second opening, the microfluidic die positioned in the first opening and the third opening.

4. The microfluidic component of claim 2 wherein the second opening is smaller than the first opening and smaller than the third opening.

5. The microfluidic component of claim 1 wherein the first rigid layer is coupled to the first portion of the flexible layer by a first attachment layer, and the second rigid layer is coupled to the first portion of the flexible layer by a second attachment layer.

6. A microfluidic component, comprising:
a rigid substrate having a first surface, a second surface opposite the first surface, a first end, and a second end opposite the first end;
a microfluidic die positioned on the first surface and at the first end of the rigid substrate; and
contact pads positioned on the second surface and at the second end of the rigid substrate, the contact pads being electrically coupled to the microfluidic die.

7. The microfluidic component of claim 6 wherein the rigid substrate includes a through hole, and the microfluidic die overlaps the through hole.

8. The microfluidic component of claim 6 wherein the contact pads are electrically coupled to the microfluidic die by electrical connections embedded in the rigid substrate.

9. The microfluidic component of claim 6 wherein the contact pads include a first row of contact pads and a second row of contact pads, and the rigid substrate includes through holes positioned between the first row of contact pads and the second row of contact pads.

10. The microfluidic component of claim 6 wherein the rigid substrate includes second contact pads positioned on the first surface and at the first end of the rigid substrate.

11. The microfluidic component of claim 10 wherein the second contact pads are electrically coupled to the contact pads.

12. The microfluidic component of claim 11 wherein the plurality of conductive wires is covered by an encapsulant.

13. The microfluidic component of claim 10 wherein the microfluidic die is electrically coupled to the second contact pads by a plurality of conductive wires.

14. A microfluidic component, comprising:
a support including:
a first rigid layer having a first opening;
a second rigid layer having a second opening; and
a flexible layer having a first portion, a second portion, and a third opening, the first portion being positioned between the first rigid layer and the second rigid layer;

first contact pads on the first portion of the flexible layer; and
second contact pads on the second portion of the flexible layer.

15. The microfluidic component of claim 14 wherein the first opening, the second opening, and the third opening are aligned.

16. The microfluidic component of claim 15 wherein a microfluidic die is coupled to the contact pads on the first portion, the microfluidic die is on the second rigid portion, and the microfluidic die is in the first opening and the second opening.

17. The microfluidic component of claim 14 wherein the first contact pads are in the first opening.

18. The microfluidic component of claim 14 , further comprising:
a first attachment layer coupling the first rigid layer to the flexible layer, the first attachment layer includes a fourth opening aligned with the first opening, the second opening, and the third opening; and
a second attachment layer coupling the second rigid layer to the flexible layer, the second attachment layer includes a fifth opening aligned with the first opening, the second opening, the third opening, and the fourth opening.

19. The microfluidic component of claim 14 wherein the first opening is larger than the second opening and the third opening, and the second opening is larger than the third opening.

20. The microfluidic component of claim 14 wherein the first opening receives a microfluidic die, a plurality of conductive wires, and an encapsulant.

Assignees

• St Microelectronics Inc
• St Microelectronics Int Nv
• St Microelectronics Srl

Inventors

• Dodd Simon
• Hunt David S
• Scheffelin Joseph Edward
• Gruenbacher Dana
• Hollinger Stefan H
• Schober Uwe
• Janouch Peter

Classifications

• B41J2/14072 Primary

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title

• B41J2/17553

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• B41J2002/14362

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• B41J2/14201

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• B41J2/1753

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