Multilayered polyolefin-based films having an integrated backsheet and encapsulation performance comprising a layer comprising crystalline block copolymer composite or block copolymer composite

Patent metadata

Field	Value
Publication number	US-10759152-B2
Application number	US-201816205687-A
Country	US
Kind code	B2
Filing date	Nov 30, 2018
Priority date	Jun 30, 2011
Publication date	Sep 1, 2020
Grant date	Sep 1, 2020

Abstract

A multilayer film structure including a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B includes a crystalline block composite resin or a block composite resin and bottom Layer C includes a polyolefin having at least one melting point greater than 125 C.

First claim

What is claimed is:

1. A multilayer film structure comprising:
a top encapsulation Layer A;
a bottom Layer C comprising a propylene-based polymer having at least one melting point greater than 125° C.;
a tie Layer B between Layer A and Layer C;
the multilayer film structure characterized in that Layer B consists of (1) a block composite resin (BC), (2) an optional polyolefin consisting of ethylene and α-olefin, (3) an optional colorant, (4) an optional stabilizer, and (5) an optional antioxidant, the BC made from monomers consisting of propylene and ethylene and the BC has
i) an ethylene-propylene copolymer (EP) comprising at least 40 mol % polymerized ethylene;
ii) a crystalline propylene-based polymer (CPP); and
iii) a diblock copolymer comprising (a) an ethylene-propylene block comprising at least 40 mol % polymerized ethylene and (b) a crystalline propylene block.

2. The multilayer film structure of claim 1 wherein the CPP comprises greater than 90 mol % polymerized propylene.

3. The multilayer film structure of claim 2 wherein the block composite resin in Layer B has two peak melting temperatures.

4. The multilayer film structure of claim 3 wherein the block composite resin in layer B has a first peak melting temperature greater than 120° C.

5. The multilayer film structure of claim 4 wherein the block composite resin in layer B has a first peak melting temperature greater than 125° C.

6. The multilayer film structure of claim 1 wherein the crystalline propylene block (iii)(b) of the diblock copolymer is the same composition as the crystalline propylene-based polymer (CPP) of the block composite resin.

7. The multilayer film structure of claim 6 wherein the ethylene-propylene block (iii)(a) of the diblock copolymer is the same composition as the EP copolymer of the block composite resin.

8. The multilayer film structure of claim 1 wherein the Layer B block composite resin has an ethylene-propylene block amount in the range of from 30 to 70 weight % based on total weight of the diblock copolymer (iii).

9. The multilayer film structure of claim 1 wherein the block composite resin has a CBCI from 0.3 to 0.8.

10. The multilayer film structure of claim 1 wherein the tie Layer B is a blend with greater than 40 weight percent of the block composite resin.

11. The multilayer film structure of claim 1 wherein the top encapsulation Layer A comprises an ethylene/octene copolymer elastomer or plastomer.

12. The multilayer film structure of claim 11 wherein the top encapsulation Layer A comprises a silane-graft containing ethylene/octene copolymer.

13. The multilayer film structure of claim 1 comprising
the top seal Layer A comprising a silane-graft containing ethylene/alpha-olefin copolymer;
the bottom Layer C comprising the propylene-based polymer; and
the tie Layer B between Layer A and Layer C, the block composite resin with
i) an ethylene-propylene polymer (EP) comprising at least 93 mol % polymerized ethylene;
ii) the crystalline propylene-based polymer; and
iii) a diblock copolymer comprising (a) an ethylene-propylene block comprising at least 93 mol % polymerized ethylene and (b) a crystalline propylene block.

14. The multilayer film structure of claim 1 having a thickness from 0.2 mm to 1.5 mm wherein
the top encapsulation Layer A is from 0.15 mm to 1.25 mm in thickness;
the tie Layer B is from 10 to 150 μm in thickness; and
Layer C is from 150 to 375 μm in thickness.

15. An electronic device (ED) module comprising an electronic device and a multilayer film structure of claim 1 .

16. The multilayer film structure of claim 1 wherein the Layer (B) consists of (1) the BC, (2) the colorant, (3) the stabilizer that is a UV stabilizer, and (4) the antioxidant.

17. The multilayer film structure of claim 1 wherein the Layer (B) consists of (1) the BC, (2) the colorant, and (3) the stabilizer that is a UV stabilizer.

18. The multilayer film structure of claim 1 wherein the Layer (B) consists of (1) the BC, and (2) the colorant.

Assignees

• Dow Global Technologies Llc

Inventors

• Bonekamp Jeffrey E
• Hu Yushan
• Nickel Nichole E
• Chu Lih-Long
• Naumovitz John A
• Hofius Mark G

Classifications

• H10F71/00

  Manufacture or treatment of devices covered by this subclass (patterning processes to connect thin photovoltaic cells in integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/33; manufacture or treatment of encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/80; manufacture or treatment of integrated devices, or assemblies of multiple devices, comprising at least one element in which radiation controls the flow of current H10F39/00) · CPC title

• H10F19/804 Primary

  Materials of encapsulations · CPC title

• H10F19/85

  Protective back sheets · CPC title

• C08L53/00

  Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers · CPC title

• Y02E10/50

  Photovoltaic [PV] energy · CPC title