Method for three-dimensionally shaping resin packaging member, and resin packaging member

US10759134B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10759134-B2
Application numberUS-201616064119-A
CountryUS
Kind codeB2
Filing dateDec 8, 2016
Priority dateJan 5, 2016
Publication dateSep 1, 2020
Grant dateSep 1, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A method for three-dimensionally forming a resin packaging member. The resin packaging member is heated to a temperature not higher than the Vicat softening temperature of the packaging member, and then compression shaping is conducted at a temperature not lower than room temperature and not higher than the Vicat softening temperature so as to form a three-dimensionally shaped portion with a large protrusion.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin packaging member having a three-dimensionally shaped portion that protrudes outward, the three-dimensionally shaped portion after hot filling has a shaping height of not less than 0.1 mm, and having a sealant film that has, at the thinnest part of the three-dimensionally shaped portion, a thickness of 50 to 95% of a thickness of the sealant film before processing. 2. The resin packaging member according to claim 1 , wherein the resin packaging member comprises at least an elastic sealant film and a less elastic outer film. 3. A method for three-dimensionally shaping the resin packaging member according to claim 1 , comprising heating the resin packaging member to a temperature not higher than a Vicat softening temperature of the packaging member and conducting a compress-shaping at a temperature not lower than room temperature and not higher than the Vicat softening temperature so as to form a compress-shaped portion protruding in a direction opposite to a compression direction. 4. The method for three-dimensionally shaping according to claim 3 , wherein the resin packaging member comprises an elastic sealant film and a less elastic outer film arranged outside, the Vicat softening temperature is a softening temperature of the sealant film, and the compression shaping is conducted from the outer film side. 5. The method for three-dimensionally shaping according to claim 3 , wherein the compression shaping is conducted by use of a male processing mold and an anvil. 6. The method for three-dimensionally shaping according to claim 5 , wherein both the male processing mold and the anvil are formed as rotary rolls. 7. A pouch formed of the resin packaging member according to claim 1 . 8. A sealing member formed of the resin packaging member according to claim 1 .

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What does patent US10759134B2 cover?
A method for three-dimensionally forming a resin packaging member. The resin packaging member is heated to a temperature not higher than the Vicat softening temperature of the packaging member, and then compression shaping is conducted at a temperature not lower than room temperature and not higher than the Vicat softening temperature so as to form a three-dimensionally shaped portion with a la…
Who is the assignee on this patent?
Toyo Seikan Kaisha Ltd
What technology area does this patent fall under?
Primary CPC classification B29C43/46. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 01 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).