Differential transmission line formed on a wiring substrate and having a metal conductor ground layer, where a metal conductor removal block is formed in the ground layer at a location of curved sections of the differential transmission line

Patent metadata

Field	Value
Publication number	US-10757802-B2
Application number	US-201816131046-A
Country	US
Kind code	B2
Filing date	Sep 14, 2018
Priority date	May 3, 2018
Publication date	Aug 25, 2020
Grant date	Aug 25, 2020

Abstract

A differential transmission line and a wiring substrate are provided. The differential transmission line includes a ground layer, a dielectric layer, a first transmission line, and a second transmission line. The ground layer is formed of a metal conductor. The dielectric layer is disposed on the ground layer. The first transmission line and the second transmission line are disposed on the dielectric layer. A metal conductor removal block is distributed in at least a portion of at least one of a first projection area of the ground layer on which to project the first transmission line and a second projection area of the ground layer on which to project the second transmission line. A metal conductor is provided in a region between the first projection area and the second projection area of the ground layer.

First claim

What is claimed is:

1. A differential transmission line, comprising:
a ground layer, formed of a metal conductor;
a dielectric layer, disposed on the ground layer; and
a first transmission line for transmitting a first signal and a second transmission line for transmitting a second signal, disposed on the dielectric layer,
wherein the first and second signals are phase inverted from each other,
wherein a metal conductor removal block is distributed in at least one portion of at least one of a first projection area of the ground layer on which to project a curved section of the first transmission line and a second projection area of the ground layer on which to project a curved section of the second transmission line, and the metal conductor is provided in an entire region between the first projection area and the second projection area of the ground layer.

2. The differential transmission line according to claim 1 , wherein the metal conductor removal block is distributed in at least one portion of one of the first projection area and the second projection area, and the metal conductor is provided in an entire region of the other of the first projection area and the second projection area.

3. The differential transmission line according to claim 1 , wherein the metal conductor removal block is further distributed in at least one portion of each of the first projection area and the second projection area.

4. The differential transmission line according to claim 1 , wherein the metal conductor removal block in the first projection area extends along a routing direction of the first transmission line.

5. The differential transmission line according to claim 1 , wherein the metal conductor removal block in the second projection area extends along a routing direction of the second transmission line.

6. The differential transmission line according to claim 1 , wherein the metal conductor removal block is distributed in a portion of the first projection area, formed in the first projection area of the ground layer on which to project the curved section of the first transmission line, and disposed parallel to a routing direction of the first transmission line.

7. The differential transmission line according to claim 1 , wherein the metal conductor removal block is distributed in a portion of the second projection area, formed in the second projection area of the ground layer on which to project the curved section of the second transmission line, and disposed parallel to a routing direction of the second transmission line.

8. The differential transmission line according to claim 1 , further comprises a plurality of sub metal conductor removal blocks of the metal conductor removal block distributed in the first projection area and disposed parallel to a routing direction of the first transmission line.

9. The differential transmission line according to claim 1 , further comprises a plurality of sub metal conductor removal blocks of the metal conductor removal block distributed in the second projection area and disposed parallel to a routing direction of the second transmission line.

10. The differential transmission line according to claim 1 , the differential transmission line comprising:
another ground layer, disposed on the dielectric layer and formed of another metal conductor, wherein the first transmission line and the second transmission line are disposed within the dielectric layer,
wherein another metal conductor removal block is distributed in at least one portion of at least one of another first projection area of the another ground layer on which to project the curved section of the first transmission line and another second projection area of the another ground layer on which to project the curved section of the second transmission line, and the another metal conductor is provided in a region between the another first projection area and the another second projection area of the another ground layer.

11. A wiring substrate, comprising:
at least one differential transmission line structure, wherein the at least one differential transmission line structure includes:
a ground layer, formed of a metal conductor;
a dielectric layer, disposed on the ground layer; and
a first transmission line for transmitting a first signal and a second transmission line for transmitting a second signal, disposed on the dielectric layer,

wherein the first and second signals are phase inverted from each other,
wherein a metal conductor removal block is distributed in at least one portion of at least one of a first projection area of the ground layer on which to project a curved section of the first transmission line and a second projection area of the ground layer on which to project a curved section of the second transmission line, and the metal conductor is provided in an entire region between the first projection area and the second projection area of the ground layer.

12. The wiring substrate according to claim 11 , wherein the metal conductor removal block is distributed in at least one portion of one of the first projection area and the second projection area, and the metal conductor is provided in an entire region of the other of the first projection area and the second projection area.

13. The wiring substrate according to claim 11 , wherein the metal conductor removal block is further distributed in at least one portion of each of the first projection area and the second projection area.

14. The wiring substrate according to claim 11 , wherein the metal conductor removal block in the first projection area extends along a routing direction of the first transmission line.

15. The wiring substrate according to claim 11 , wherein the metal conductor removal block in the second projection area extends along a routing direction of the second transmission line.

16. The wiring substrate according to claim 11 , wherein the metal conductor removal block is distributed in a portion of the first projection area, formed in the first projection area of the ground layer on which to project the curved section of the first transmission line, and disposed parallel to a routing direction of the first transmission line.

17. The wiring substrate according to claim 11 , wherein the metal conductor removal block is distributed in a portion of the second projection area, formed in the second projection area of the ground layer on which to project the curved section of the second transmission line, and disposed parallel to a routing direction of the second transmission line.

18. The wiring substrate according to claim 11 , further comprises a plurality of sub metal conductor removal blocks of the metal conductor removal block distributed in the first projection area and disposed parallel to a routing direction of the first transmission line.

19. The wiring substrate according to claim 11 , further comprises a plurality of sub metal conductor removal blocks of the metal conductor removal block distributed in the second projection area and disposed parallel to a routing direction of the second transmission line.

20. The wiring substrate according to claim 11 , wherein the at least one differential transmission line structure further comprises:
another ground layer, disposed on the dielectric layer and formed of another metal conductor, wherein the first transmission line and the second transmission line are disposed within the dielectric layer,
wherein another metal conductor removal block is distributed in at least one portion of at least one of an

Assignees

• Wistron Corp

Inventors

• Su Po-Lung

Classifications

• H05K1/0245 Primary

  Lay-out of balanced signal pairs, e.g. differential lines or twisted lines · CPC title

• H05K2201/09272

  Layout details of angles or corners · CPC title

• H05K1/0228

  Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K1/0245) · CPC title

• H05K1/0225

  Single or multiple openings in a shielding, ground or power plane (H05K1/0227 takes precedence) · CPC title

• H01P3/026 Primary

  Coplanar striplines [CPS] · CPC title