Techniques for device attachment with dual band imaging sensor

Patent metadata

Field	Value
Publication number	US-10757308-B2
Application number	US-201615199861-A
Country	US
Kind code	B2
Filing date	Jun 30, 2016
Priority date	Mar 2, 2009
Publication date	Aug 25, 2020
Grant date	Aug 25, 2020

Abstract

Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. The device attachment may include an infrared imagining module and a non-thermal imaging module that cooperate with one or more of a non-thermal imaging module in an attached device and a light source in the attached device for capturing and processing images.

First claim

What is claimed is:

1. A device, comprising:
a thermal imaging module having a first side and a second side opposite the first side;
a non-thermal imaging module;
a circuit board, wherein the thermal imaging module is disposed such that the first side is within a socket secured to the circuit board; and
a bridge coupled to and extending between the thermal imaging module and the non-thermal imaging module, wherein the bridge comprises at least one fixturing element that engages a portion of the non-thermal imaging module and contacts a surface of the circuit board to support the non-thermal imaging module, wherein the bridge is coupled to the second side and configured to maintain a position of the thermal imaging module relative to the non-thermal imaging module to maintain alignment between the thermal imaging module and the non-thermal imaging module.

2. The device of claim 1 , wherein the bridge is disposed above the circuit board and is configured to maintain the position of the thermal imaging module relative to the non-thermal imaging module for spatially referenced X, Y, rotation, and tilt positions.

3. The device of claim 1 , wherein the socket mechanically and electrically couples the thermal imaging module to the circuit board.

4. The device of claim 3 , wherein the non-thermal imaging module is electrically coupled to the circuit board by a flexible circuit and wherein the at least one fixturing element comprises at least one fixturing post that extends through the portion of the non-thermal imaging module to the surface of the circuit board to support the non-thermal imaging module.

5. The device of claim 4 , wherein:
the bridge includes first and second openings in which the thermal imaging module and the non-thermal imaging module are respectively disposed;
a first surface of the second opening bears against a surface of the non-thermal imaging module to prevent translational motion of the non-thermal imaging module within the bridge;
a top interior surface of the bridge engages the non-thermal imaging module to maintain a relative tilt of the non-thermal imaging module; and
the at least one fixturing post comprises at least two fixturing posts that engage corresponding openings on the non-thermal imaging module to maintain a relative rotational offset of the thermal imaging module and the non-thermal imaging module.

6. A method of assembling the device of claim 1 , the method comprising:
providing the thermal imaging module;
securing the thermal imaging module to the circuit board;
providing the non-thermal imaging module; and
coupling the thermal imaging module to the non-thermal imaging module by the bridge.

7. The method of claim 6 , wherein:
the coupling comprises controlling, by the bridge, a position of the thermal imaging module relative to the non-thermal imaging module for spatially referenced X, Y, rotation, and tilt positions;
the at least one fixturing element comprises at least one fixturing post;
the securing the thermal imaging module comprises mechanically and electrically coupling the thermal imaging module to the circuit board by inserting the thermal imaging module into the socket secured to the circuit board; and
the providing the non-thermal imaging module comprises:
electrically coupling the non-thermal imaging module to the circuit board by connecting the non-thermal imaging module to the circuit board by a flexible circuit, wherein the non-thermal imaging module is coupled to the circuit board only via the bridge and the flexible circuit; and
inserting the at least one fixturing post through the portion of the non-thermal imaging module to the surface of the circuit board to support the non-thermal imaging module.

8. The method of claim 7 , wherein the providing the thermal imaging module further comprises disposing the thermal imaging module in a first opening of the bridge, and wherein the providing the non-thermal imaging module further comprises:
placing a first surface of a second opening of the bridge against a surface of the non-thermal imaging module to prevent translational motion of the non-thermal imaging module within the bridge;
placing a top interior surface of the bridge against the non-thermal imaging module to maintain a relative tilt of the non-thermal imaging module; and
wherein the inserting the at least one fixturing post through the portion of the non-thermal imaging module comprises inserting at least two fixturing posts into corresponding openings on the non-thermal imaging module to maintain a relative rotational offset of the thermal imaging module and the non-thermal imaging module.

9. A device, comprising:
a thermal imaging module comprising an infrared sensor assembly; and
a switch assembly comprising a slider plate and a slider button provided on the slider plate, wherein the switch assembly is configured to switch on and off the device and further configured to control the slider plate configured to block external infrared energy from being received by the infrared sensor assembly, wherein, via movement of the slider button, the switch assembly comprises:
a first switch position that positions the slider plate to switch off the device;
a second switch position that positions the slider plate to switch on the device; and
a third switch position that positions at least a portion of the slider plate to block the external infrared energy from being received by the infrared sensor assembly while the device is switched on.

10. The device of claim 9 , wherein the slider plate is configured to be:
moved to the first switch position to contact neither a first switch nor a second switch;
moved to the second switch position to contact the first switch and not the second switch; and
moved to the third switch position to contact both the first switch and the second switch and block the external infrared energy from being received by the thermal imaging module while the device is switched on.

11. The device of claim 9 , wherein the third switch position controls the thermal imaging module to perform a calibration operation and further positions the slider plate to provide a uniform scene for the thermal imaging module.

12. The device of claim 11 , further comprising:
a temperature measurement device to provide a temperature measurement of the slider plate for the calibration operation; and
at least one molded interconnect trace that thermally couples the slider plate to the temperature measurement device to provide the temperature measurement of the slider plate.

13. A method, comprising:
providing a thermal imaging module comprising an infrared sensor assembly; and
providing a switch assembly comprising a slider plate and a slider button provided on the slider plate, wherein the switch assembly is configured to switch on and off the thermal imaging module and further configured to control the slider plate to selectively block external infrared energy from being received by the infrared sensor assembly, wherein, via movement of the slider button, the switch assembly comprises:
a first switch position that positions the slider plate to switch off a device that includes the thermal imaging module;
a second switch position that positions the slider plate to switch on the device; and
a third switch position that positions at least a portion of the slider plate to block the external infrared energy from being received by the infrared sensor assembly while the device is switched on.

14. The method of claim 13 , wherein the slider plate is configured to be:
moved to the first switch position to contact neither a first switch nor a secon

Assignees

• Flir Systems

Inventors

• Kent Michael

Classifications

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/51

  Housings · CPC title

• G01J5/048 Primary

  Protective parts · CPC title

• H04N23/11

  for generating image signals from visible and infrared light wavelengths · CPC title

• G01J5/0804

  Shutters · CPC title