Composition for low thermal expansion members, low thermal expansion member, electronic device, and method for producing low thermal expansion member
US-2019055444-A1 · Feb 21, 2019 · US
US10756152B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10756152-B2 |
| Application number | US-201916423296-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 28, 2019 |
| Priority date | Sep 27, 2018 |
| Publication date | Aug 25, 2020 |
| Grant date | Aug 25, 2020 |
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An exemplary embodiment of the present inventive concept provides a display device including: a substrate; a semiconductor layer; a first inorganic insulating film disposed on the semiconductor layer and including a first opening; a first conductive film disposed on the first inorganic insulating film; a second inorganic insulating film disposed on the first inorganic insulating film to fill a concave portion on the first conductive film; a second conductive film disposed on the second inorganic insulating film; a third inorganic insulating film disposed on the second conductive film and including a second opening; and a third conductive film disposed on the third inorganic insulating film, and connected to the second conductive film, wherein the first opening and the second opening may overlap each other.
Opening claim text (preview).
What is claimed is: 1. A display device comprising: a substrate; a semiconductor layer disposed on the substrate; a first inorganic insulating film disposed on the semiconductor layer and including a first opening; a first conductive film disposed on the first inorganic insulating film, the first conductive film disposed on a lateral surface and a lower surface of the first opening; a second inorganic insulating film disposed on the first inorganic insulating film, the second inorganic insulating film filling a concave portion on the first conductive film; a second conductive film disposed on the second inorganic insulating film and connected to the first conductive film; a third inorganic insulating film disposed on the second conductive film and the second inorganic insulating film exposed by the second conductive film, the third inorganic insulating film including a second opening; and a third conductive film disposed on the third inorganic insulating film and connected to the second conductive film, wherein the first opening and the second opening overlap each other in a plan view. 2. The display device of claim 1 , wherein a lower end portion of each of the first opening and the second opening is narrower than an upper end portion thereof, and when a width of the lower end portion of the first opening is referred to as a first line width and a width of the lower end portion of the second opening is referred to as a second line width, the second line width is larger than or equal to the first line width. 3. The display device of claim 2 , wherein the first line width is 1.3 um or less. 4. The display device of claim 2 , wherein the first opening and the second opening overlap so that a center of the first line width, a center of the second conductive film, and a center of the second line width are in a straight line. 5. The display device of claim 1 , wherein the second inorganic insulating film is planarized so that an upper surface of the second inorganic insulating film coincides with an upper surface of the first conductive film formed on the second inorganic insulating film. 6. The display device of claim 1 , wherein the second conductive film and the third conductive film are in contact with each other in a predetermined area within a closed edge. 7. A display device comprising: a substrate; a semiconductor layer disposed on the substrate; a first inorganic insulating film disposed on the semiconductor layer and including a first opening; a first conductive film disposed on the first inorganic insulating layer, the first conductive film disposed on a lateral surface and a lower surface of the first opening; a second inorganic insulating film disposed on the first conductive film, the second inorganic insulating film filling a concave portion on the first conductive film, the second inorganic insulating film including a second opening; and a second conductive film disposed on the second inorganic insulating film, formed on a lateral surface and a lower surface of the second opening, and connected to the first conductive film, wherein the first opening and the second opening overlap each other in a plan view. 8. The display device of claim 7 , wherein a lower end portion of each of the first opening and the second opening is narrower than an upper end portion thereof, and when a width of the lower end portion of the first opening is referred to as a first line width and a width of the lower end portion of the second opening is referred to as a second line width, the second line width is larger than or equal to the first line width. 9. The display device of claim 8 , wherein the first line width is 1.3 um or less. 10. The display device of claim 8 , wherein the first opening and the second opening overlap so that a center of the first line width and a center of the second line width are in a straight line. 11. The display device of claim 7 , wherein a contact region of the first conductive film and the second conductive film has a ring shape in a plan view. 12. A manufacturing method of a display device, comprising: forming a semiconductor layer on a substrate; forming an insulating film on the substrate; forming a first inorganic insulating film on the insulating film; forming a first opening exposing the semiconductor layer in the first inorganic insulating film; forming a first conductive film on a lateral surface and a lower surface of the first opening on the first inorganic insulating film; forming a second inorganic insulating film on the first inorganic insulating film and a concave portion formed on the first conductive film; planarizing the second inorganic insulating film to form an isolated filling portion which fills the concave portion on the first conductive film; forming a second conductive film on the planarized second inorganic insulating film; forming a third inorganic insulating film on the second conductive film and the second inorganic insulating film exposed by the second conductive film; forming a second opening that exposes the second conductive film in the third inorganic insulating film at a position overlapping the first opening in a plan view; and forming a third conductive film that is disposed on the third inorganic insulating film and is disposed on a lateral surface and a lower surface of the second opening. 13. The manufacturing method of the display device of claim 12 , wherein in the planarizing of the second inorganic insulating film, an upper surface of the second inorganic insulating film is planarized so that the upper surface of the second inorganic insulating film coincides with an upper surface of the first conductive film formed on the first inorganic insulating film. 14. The manufacturing method of the display device of claim 12 , wherein a lower end portion of each of the first opening and the second opening is narrower than an upper end portion thereof, and when a width of the lower end portion of the first opening is referred to as a first line width and a width of the lower end portion of the second opening is referred to as a second line width, the second line width is larger than or equal to the first line width. 15. The manufacturing method of the display device of claim 14 , wherein the first line width is 1.3 urn or less. 16. The manufacturing method of the display device of claim 14 , wherein the first opening and the second opening overlap so that a center of the first line width, a center of the second conductive film, and a center of the second line width are in a straight line. 17. A manufacturing method of a display device, comprising: forming a semiconductor layer on a substrate; forming an insulating film on the substrate; forming a first inorganic insulating film on the insulating film; forming a first opening exposing the semiconductor layer in the first inorganic insulating film; forming a first conductive film on a lateral surface and a lower surface of the first opening on the first inorganic insulating film; forming a second inorganic insulating film on the first conductive film, on the first inorganic insulating film exposed by the first conductive film, and on the first conductive film to fill a concave portion formed on the first conductive film; partially planarizing an upper surface of the second inorganic insulating film; forming a second opening that exposes the first conductive film and the second inorganic insulating film filling the concave portion formed on the first conductive film to overlap the first openi
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