Heat dissipation assembly and electronic device

Patent metadata

Field	Value
Publication number	US-10756000-B2
Application number	US-201916683287-A
Country	US
Kind code	B2
Filing date	Nov 14, 2019
Priority date	Mar 18, 2014
Publication date	Aug 25, 2020
Grant date	Aug 25, 2020

Abstract

The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.

First claim

What is claimed is:

1. An electronic device, comprising:
an enclosure; and
a heat dissipation assembly, located in the enclosure, wherein the heat dissipation assembly comprises a shielding element, a heat pipe, and a first elastic thermal interface material, wherein the shielding element has a via hole, the shielding element is electrically connected to a printed circuit board (PCB), and a heat-generating electronic element is disposed on the PCB; and
the heat-generating electronic element is located in a cavity of the shielding element, wherein the first elastic thermal interface material is fitted onto the heat-generating electronic element through the via hole, and the heat pipe is located on the first elastic thermal interface material; and, wherein
a thermal interface material is located between the heat pipe and the shielding element.

2. The electronic device according to claim 1 , wherein the heat pipe is electrically connected to the shielding element by an electrically conductive elastomer or an electrically conductive interface material.

3. The electronic device according to claim 1 , wherein the electronic device further comprises a thermally conductive support, the thermally conductive support being connected to the heat pipe in a lateral direction.

4. The electronic device according to claim 1 , wherein the heat dissipation assembly further comprises:
a second elastic thermal interface material; and
a thermally conductive metal block, disposed between the second elastic thermal interface material and the PCB, wherein the thermally conductive metal block is connected to the heat-generating electronic element by a thermally conductive layer of the PCB.

5. The electronic device according to claim 4 , wherein the second elastic thermal interface material is an elastic electrically conductive thermal interface material or an elastic insulated thermal interface material.

6. The electronic device according to claim 1 , wherein the first elastic thermal interface material is an elastic insulated thermal interface material or is an elastic electrically conductive thermal interface material.

7. The electronic device according to claim 1 , wherein further comprises an electrically conductive interface material, disposed around the via hole, and located between the shielding element and the heat pipe.

8. The electronic device according to claim 1 , wherein further comprises an electrically conductive elastomer, the electrically conductive elastomer is disposed around the via hole, and the electrically conductive elastomer is electrically connected to the heat pipe.

9. The electronic device according to claim 3 , wherein heat generated by the heat-generating electronic element is transferred to the first elastic thermal interface material and the heat pipe, heat on the heat pipe is transferred to the thermally conductive support and spread out.

10. The electronic device according to claim 1 , wherein the electronic device is a mobile phone.

11. The electronic device according to claim 1 , wherein the electronic device further comprises a thermally conductive support, the thermally conductive support having a via hole; and, wherein a side of the heat pipe is located in the via hole of the thermally conductive support.

12. The electronic device according to claim 11 , wherein the thermally conductive support is a graphite support having a surface attached with a thermally conductive film prepared from a graphite material.

13. An electronic device, comprising:
an enclosure; and
a heat dissipation assembly, located in the enclosure, wherein the heat dissipation assembly comprises a shielding element, a heat pipe, and a first elastic thermal interface material; and
a thermally conductive support connected to the heat pipe in a lateral direction; and, wherein
a heat-generating electronic element of a print circuit board (PCB) is located in a cavity of the shielding element, the shielding element being electrically connected to the PCB; and
the heat pipe is located on the shielding element, and the heat pipe is connected to the shielding element through the first elastic thermal interface material.

14. The electronic device according to claim 13 , wherein the heat dissipation assembly further comprises:
a thermally conductive metal block, disposed on the PCB, wherein the thermally conductive metal block is connected to the heat-generating electronic element by a ground copper layer of the PCB; and
a second elastic thermal interface material, located between the thermally conductive metal block and the heat pipe.

15. The electronic device according to claim 13 , wherein the electronic device is a mobile phone.

16. The electronic device according to claim 13 , wherein the electronic device further comprises a thermally conductive support, the thermally conductive support having a via hole, wherein a side of the heat pipe is located in the via hole of the thermally conductive support.

17. The electronic device according to claim 16 , wherein the thermally conductive support is a graphite support having a surface attached with a thermally conductive film prepared from a graphite material.

Assignees

• Huawei Device Co Ltd

Inventors

• Jin Linfang
• Xiao Yongwang
• Wang Guoping
• Zou Jie
• Li Hualin

Classifications

• H10W42/265

  Shielding wires, e.g. constant potential wires · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/251

  Organics · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title