Fingerprint recognition apparatus and manufacturing method therefor, mobile terminal, and fingerprint lock

Patent metadata

Field	Value
Publication number	US-10755075-B2
Application number	US-201816106604-A
Country	US
Kind code	B2
Filing date	Aug 21, 2018
Priority date	Dec 12, 2017
Publication date	Aug 25, 2020
Grant date	Aug 25, 2020

Abstract

The present disclosure relates to the field of fingerprint recognition technologies, and provides a fingerprint recognition apparatus and a manufacturing method therefor, a mobile terminal, and a fingerprint lock. The apparatus includes: a substrate defining a protrusion on a surface of the substrate; a fingerprint chip, including: a signal processing circuit connected to the protrusion by passing through a TSV structure, a plurality of sensing electrodes connected to the signal processing circuit, and a protection layer covering the plurality of sensing electrodes; and a touch cover plate located on the protection layer.

First claim

What is claimed is:

1. A fingerprint recognition apparatus, comprising:
a substrate defining a protrusion on a surface of the substrate;
a fingerprint chip, comprising:
a signal processing circuit connected to the protrusion through a through substrate via (TSV) structure;
a plurality of sensing electrodes connected to the signal processing circuit; and
a protection layer covering the plurality of sensing electrodes; and

a touch cover plate located on the protection layer.

2. The apparatus according to claim 1 , wherein:
the protection layer has a first opening extending to each sensing electrode of the plurality of sensing electrodes; and
the apparatus further comprises:
a conductive material filling the first opening, wherein the touch cover plate is located on the conductive material filling.

3. The apparatus according to claim 1 , further comprising:
a buffer layer located on the protection layer, wherein there is a second opening extending from a surface of the buffer layer to each sensing electrode of the plurality of sensing electrodes; and
a conductive material filling the second opening, wherein the touch cover plate is located on the conductive material filling.

4. The apparatus according to claim 3 , wherein the conductive material filling comprises a soft conductive material.

5. The apparatus according to claim 4 , wherein the soft conductive material comprises graphite or a conductive silver paste.

6. The apparatus according to claim 3 , wherein the buffer layer comprises an organic polymer.

7. A mobile terminal, comprising: the fingerprint recognition apparatus according to claim 1 .

8. A fingerprint lock, comprising: the fingerprint recognition apparatus according to claim 1 .

9. A method for manufacturing a fingerprint recognition apparatus, comprising: forming a protrusion on a surface of a substrate;
forming a fingerprint chip, wherein the fingerprint chip comprises: a signal processing circuit connected to the protrusion through a through substrate via (TSV) structure; a plurality of sensing electrodes connected to the signal processing circuit;
and a protection layer covering the plurality of sensing electrodes; and forming a touch cover plate on the protection layer.

10. The method according to claim 9 , wherein the protection layer has a first opening extending to each sensing electrode of the plurality of sensing electrodes; and
wherein the method further comprises:
before forming a touch cover plate on the protection layer, forming a conductive material filling the first opening, wherein the touch cover plate is formed on the conductive material filling.

11. The method according to claim 9 , wherein the protection layer has a first opening extending to each sensing electrode; and
wherein forming a touch cover plate on the protection layer comprises:
forming a buffer layer filling the first opening on the protection layer;
forming a second opening extending from a surface of the buffer layer to each sensing electrode of the plurality of sensing electrodes;
forming a conductive material filling the first opening; and
forming the touch cover plate on the conductive material filling.

12. The method according to claim 11 , wherein the second opening is in alignment with the first opening.

13. The method according to claim 9 , wherein forming a touch cover plate on the protection layer comprises:
forming a buffer layer on the protection layer;
forming an opening extending from a surface of the buffer layer to each sensing electrode of the plurality of sensing electrodes;
forming a conductive material filling the opening; and
forming the touch cover plate on the conductive material filling.

14. The method according to claim 11 , wherein the conductive material comprises a soft conductive material.

15. The method according to claim 14 , wherein the soft conductive material comprises graphite or a conductive silver paste.

16. The method according to claim 11 , wherein the buffer layer comprises an organic polymer.

Assignees

• Semiconductor Mfg International (Beijing) Corporation
• Semiconductor Mfg International (Shanghai) Corporation
• Semiconductor Mfg (Beijing) International Corporation
• Semiconductor Mfg (Shanghai) International Corporation

Inventors

• Chen Wenlei
• Wang Qifeng

Classifications

• G06F3/044 Primary

  by capacitive means · CPC title

• G06V40/1329

  Protecting the fingerprint sensor against damage caused by the finger · CPC title

• G06V40/1306

  non-optical, e.g. ultrasonic or capacitive sensing · CPC title

• G06V40/1365 Primary

  Matching; Classification · CPC title

• G06F21/32

  using biometric data, e.g. fingerprints, iris scans or voiceprints · CPC title