Methods and apparatuses for assessing high temperature bonding systems and bonded substrates therefrom

Patent metadata

Field	Value
Publication number	US-10755000-B2
Application number	US-201615344530-A
Country	US
Kind code	B2
Filing date	Nov 6, 2016
Priority date	Nov 6, 2015
Publication date	Aug 25, 2020
Grant date	Aug 25, 2020

Abstract

Methods and apparatuses for assessing the behavior of high temperature bonding systems such as sinter joint models of virtual interconnect microstructures via simulations that analyze sinter joint model properties include defining a plurality of sinter joint objects in a virtual interconnect microstructure, each sinter joint object having a type and a size, and determining a location of individual sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model. The type is at least one of an intermetallic compound, a void, and a metal particle. The location is determined by, for each object, creating three-dimensional coordinates, and based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, locking a position and size of the sinter joint object.

First claim

What is claimed is:

1. A method for assessing an interconnect microstructure of a virtual assembly of a high temperature bonding of substrates, the method comprising:
defining, by a processor, a plurality of sinter joint objects in the interconnect microstructure of the virtual assembly, each sinter joint object of the plurality of sinter joint objects having a type and a size, wherein the type is at least one of an intermetallic compound, a void, and a metal particle; and
determining, by the processor, a location of individual sinter joint objects of the plurality of sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model, wherein the location is determined by, for each individual sinter joint object:
creating three-dimensional coordinates for the sinter joint object; and
based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, locking a position and size of the sinter joint object in the virtual joint space.

2. The method of claim 1 , further comprising:
creating, by the processor, a three-dimensional model of the sinter joint model;
determining, by the processor, at least one of mechanical, thermal, and electrical properties of the sinter joint model; and
storing information regarding the type, size, and coordinates of each object of the plurality of sinter joint objects following one or more simulations.

3. The method of claim 2 , wherein the high temperature bonding comprises at least one of a transient liquid phase sintering heating process and a diffusion soldering process.

4. The method of claim 2 , wherein the intermetallic compound comprises one of Cu 6 Sn 5 , Cu 3 Sn, and Ni 3 Sn 4 .

5. The method of claim 1 , wherein each void has a radius of 30 μm and each metal particle has a radius in a range of from about 20 μm to about 40 μm.

6. The method of claim 1 , wherein the plurality of sinter joint objects comprises at least a plurality of voids.

7. The method of claim 1 , wherein the plurality of sinter joint objects does not include one or more voids.

8. The method of claim 1 , wherein a plurality of metal particles comprise 20% of the plurality of sinter joint objects in the sinter joint model.

9. The method of claim 1 , wherein each metal particle is selected from at least one of a group consisting of Ni, Cu, Ag, and Al.

10. The method of claim 9 , wherein the metal particles comprise 20% of the plurality of sinter joint objects in the sinter joint model, a plurality of voids of the plurality of sinter joint objects comprises a range of from about 0% to about 10% of the plurality of sinter joint objects in the sinter joint model, and a plurality of intermetallic compounds of the plurality of sinter joint objects comprises a remaining percentage of the plurality of sinter joint objects in the sinter joint model.

11. The method of claim 1 , wherein:
at least two of the plurality of sinter joint objects of a same type have different sizes.

12. A system for assessing an interconnect microstructure of a virtual assembly of a high temperature bonding of substrates, the system comprising:
a processor;
a non-transitory computer-readable storage medium in communication with the processor, the non-transitory computer-readable storage medium including one or more programming instructions executable by the processor to cause the processor to:
define a plurality of sinter joint objects in the interconnect microstructure of the virtual assembly, each sinter joint object of the plurality of sinter joint objects having a type and a size, wherein the type is at least one of an intermetallic compound, a void, and a metal particle; and
determine a location of individual sinter joint objects of the plurality of sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model, wherein the location is determined by, for each individual sinter joint object, one or more further programming instructions executable by the processor to cause the processor to:
create three-dimensional coordinates for the sinter joint object; and
based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, lock a position and size of the sinter joint object in the virtual joint space.

13. The system of claim 12 , further comprising one or more instructions executable by the processor to cause the processor to:
create a three-dimensional model of the sinter joint model;
determine at least one of mechanical, thermal, and electrical properties of the sinter joint model; and
store information regarding the type, size, and coordinates of each object of the plurality of sinter joint objects following one or more simulations.

14. The system of claim 13 , wherein the plurality of sinter joint objects comprises at least a plurality of voids comprising no more than 10% of the plurality of sinter joint objects in the sinter joint model.

15. The system of claim 13 , wherein the plurality of sinter joint objects does not include one or more voids.

16. The system of claim 13 , wherein a plurality of metal particles comprise 20% of the plurality of sinter joint objects in the sinter joint model.

17. The system of claim 12 , wherein each metal particle is selected from at least one of a group consisting of Ni, Cu, Ag, and Al.

18. The system of claim 17 , wherein a plurality of metal particles comprise 20% of the plurality of sinter joint objects in the sinter joint model, a plurality of voids of the plurality of sinter joint objects comprises a range of from about 0% to about 10% of the plurality of sinter joint objects in the sinter joint model, and a plurality of intermetallic compounds of the plurality of sinter joint objects comprises a remaining percentage of the plurality of sinter joint objects in the sinter joint model.

19. A method for assessing an interconnect microstructure of a virtual assembly of a bonding of substrates, the method comprising:
defining, by a processor, a plurality of sinter joint objects in the interconnect microstructure of the virtual assembly, each sinter joint object of the plurality of sinter joint objects having a type and a size, wherein the type is at least one of an intermetallic compound, a void, and a metal particle;
determining, by the processor, a location of individual sinter joint objects of the plurality of sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model, wherein the location is determined by, for each individual sinter joint object:
creating three-dimensional coordinates for the sinter joint object; and
based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, locking a position and size of the sinter joint object in the virtual joint space;

creating, by the processor, a three-dimensional model of the sinter joint model;
determining one or more simulated properties of the sinter joint model; and
displaying at least one of the one or more simulated properties and the three-dimensional model of the sinter joint model on a graphical user interface communicatively coupled to the processor.

20. The method of claim 19 , further comprising:
storing information regarding the type, size, and coordinates of each object of the plurality of sinter joint objects following the one or more simulations.

Assignees

• Toyota Eng & Mfg North America
• Univ Maryland
• Univ Maryland

Inventors

• Greve Hannes Martin Hinrich
• Mccluskey F Patrick
• Joshi Shailesh N

Classifications

• B22F10/80

  Data acquisition or data processing · CPC title

• G06F30/17 Primary

  Mechanical parametric or variational design · CPC title

• B22F3/1103 Primary

  with particular physical characteristics · CPC title

• B23K2103/12

  Copper or alloys thereof · CPC title

• G06F30/20

  Design optimisation, verification or simulation (optimisation, verification or simulation of circuit designs G06F30/30) · CPC title