Printed wiring

Patent metadata

Field	Value
Publication number	US-10754485-B2
Application number	US-201716332639-A
Country	US
Kind code	B2
Filing date	Sep 13, 2017
Priority date	Oct 13, 2016
Publication date	Aug 25, 2020
Grant date	Aug 25, 2020

Abstract

In printed wiring that is formed, on a surface of a base member. by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.

First claim

What is claimed is:

1. Printed wiring formed, on a surface of a base member, by a film of cured electrically conductive ink, the printed wiring comprising:
a wavy line;
a first wiring element;
a second wiring element; and
a surplus wavy line disposed along the wavy line,
the first wiring element being located at one side of both sides in a width direction of the wavy line,
the second wiring element being located at the other side of the both sides and adjacent to the wavy line,
the surplus wavy line being located between the wavy line and the first wiring element and adjacent to the wavy line, and
the surplus wavy line being connected to the wavy line and having a same potential as the wavy line, wherein an apex of a bending portion included in at least one of the wavy line and the surplus wavy line is cut forming a W-shaped notch,
the bending portion protruding in a width direction of the at least one of the wavy line and the surplus wavy line,
and the bending portion whose apex is cut being located at at least one of both sides in the width direction of the at least one of the wavy line and the surplus wavy line.

2. The printed wiring according to claim 1 , wherein the first wiring element is an electrode made up of thin-line meshes or a wiring line made up of thin-line meshes.

3. The printed wiring according to claim 1 , wherein, inside at least one of the wavy line and the surplus wavy line, one pit or one space is disposed in a width direction of a wavy-line shape and one or more pits or one or more spaces are disposed in a longitudinal direction of the wavy-line shape.

4. The printed wiring according to claim 1 , wherein the second wiring element is another wavy line disposed along the wavy line.

5. The printed wiring according to claim 4 , wherein an apex of a bending portion included in the second wiring element is cut, the bending portion protruding in a width direction of the second wiring element, and the bending portion whose apex is cut being located at at least one of both sides in the width direction of the second wiring element.

6. The printed wiring according to claim 4 , wherein, inside the second wiring element, one pit or one space is disposed in a width direction of a wavy-line shape and one or more pits or one or more spaces are disposed in a longitudinal direction of the wavy-line shape.

7. Printed wiring formed, on a surface of a base member, by a film of cured electrically conductive ink, the printed wiring comprising:
a wavy line;
a first wiring element;
a second wiring element; and
a surplus wavy line disposed along the wavy line,
the first wiring element being located at one side of both sides in a width direction of the wavy line,
the second wiring element being located at the other side of the both sides and adjacent to the wavy line,
the surplus wavy line being located between the wavy line and the first wiring element and adjacent to the wavy line, and
the surplus wavy line being insulated from the wavy line, wherein an apex of a bending portion included in at least one of the wavy line and the surplus wavy line is cut forming a W-shaped notch,
the bending portion protruding in a width direction of the at least one of the wavy line and the surplus wavy line,
and the bending portion whose apex is cut being located at at least one of both sides in the width direction of the at least one of the wavy line and the surplus wavy line.

8. The printed wiring according to claim 7 , wherein the first wiring element is an electrode made up of thin-line meshes or a wiring line made up of thin-line meshes.

9. The printed wiring according to claim 7 , wherein, inside at least one of the wavy line and the surplus wavy line, one pit or one space is disposed in a width direction of a wavy-line shape and one or more pits or one or more spaces are disposed in a longitudinal direction of the wavy-line shape.

10. The printed wiring according to claim 7 , wherein the second wiring element is another wavy line disposed along the wavy line.

11. The printed wiring according to claim 10 , wherein an apex of a bending portion included in the second wiring element is cut, the bending portion protruding in a width direction of the second wiring element, and the bending portion whose apex is cut being located at at least one of both sides in the width direction of the second wiring element.

12. The printed wiring according to claim 10 , wherein, inside the second wiring element, one pit or one space is disposed in a width direction of a wavy-line shape and one or more pits or one or more spaces are disposed in a longitudinal direction of the wavy-line shape.

Assignees

• Japan Aviation Electronics Ind Ltd

Inventors

• Sakaue Akitoshi

Classifications

• H05K2201/0979

  Redundant conductors or connections, i.e. more than one current path between two points · CPC title

• H05K2201/09263

  Meander · CPC title

• H05K2201/09227

  Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting · CPC title

• H05K3/1275

  by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title