Electronic component, method of manufacturing the same, and mount structure of electronic component
US-2015287532-A1 · Oct 8, 2015 · US
Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrate
US10753551B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10753551-B2 |
| Application number | US-201615554872-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 27, 2016 |
| Priority date | Mar 10, 2015 |
| Publication date | Aug 25, 2020 |
| Grant date | Aug 25, 2020 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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- CPC / IPC classifications
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Abstract
Official abstract text for this publication.
An electronic component mounting substrate 10 A is configured of an electronic component 20 , and a mounting substrate 10 mounting the electronic component 20 thereon, in which concave parts 24 are formed on a mounting surface 23 of the electronic component 20 opposite to the mounting substrate 10 , a connection part 39 is exposed at the bottom of the concave part 24 , and electronic component attachment parts 12 provided on the mounting substrate 10 are soldered to the connection parts 39 provided in the electronic component 20.
First claim
Opening claim text (preview).
The invention claimed is: 1. An electronic component mounting substrate comprising: an electronic component, and a mounting substrate mounting the electronic component thereon, wherein a concave part is formed on a mounting surface of the electronic component opposite to the mounting substrate, and a connection part is exposed at the bottom of the concave part, wherein an electronic component attachment part provided on the mounting substrate is soldered to the connection part provided in the electronic component, and wherein the electronic component includes a relay substrate, at least one electronic device wiring in the relay substrate connecting the drive circuit and the electronic device and connecting the drive circuit and the connection part. 2. The electronic component mounting substrate according to claim 1 , wherein the electronic component attachment part is soldered to the connection part provided in the electronic component via a solder bump provided on the electronic component attachment part. 3. The electronic component mounting substrate according to claim 1 , wherein a protruded part is provided on the mounting substrate to surround the electronic component attachment part provided on the mounting substrate. 4. The electronic component mounting substrate according to claim 1 , wherein a convex part is provided at a part on the mounting substrate where the electronic component is mounted, and the electronic component attachment part is provided on the convex part. 5. The electronic component mounting substrate according to claim 1 , wherein a convex part is provided on the mounting substrate to surround a part on the mounting substrate where the electronic component is mounted.
Assignees
Inventors
Classifications
Vias, e.g. via plugs · CPC title
batch processes · CPC title
relative to the surface, e.g. recessed, protruding · CPC title
Bond pads specially adapted therefor · CPC title
of bump connectors · CPC title
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Frequently asked questions
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- What does patent US10753551B2 cover?
- An electronic component mounting substrate 10 A is configured of an electronic component 20 , and a mounting substrate 10 mounting the electronic component 20 thereon, in which concave parts 24 are formed on a mounting surface 23 of the electronic component 20 opposite to the mounting substrate 10 , a connection part 39 is exposed at the bottom of the concave part 24 , and elect…
- Who is the assignee on this patent?
- Sony Semiconductor Solutions Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K3/3436. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 25 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).