Glue filling method for multilayer thin film sensor structure

Patent metadata

Field	Value
Publication number	US-10752813-B2
Application number	US-201816051809-A
Country	US
Kind code	B2
Filing date	Aug 1, 2018
Priority date	Jul 9, 2018
Publication date	Aug 25, 2020
Grant date	Aug 25, 2020

Abstract

A glue filling method for a multilayer thin film sensor structure is disclosed herein. Two outer layers of a composite heat-resistant membrane are carved to have desired patterned holes; an inner layer is interposed between two outer layers to form a layered structure. The composite heat-resistant membrane is stuck onto the multilayer thin film sensor structure with the patterned holes aligned to an electric-conduction through-hole of the multilayer thin film sensor structure to form a filling region. A conductive glue is filled into the filling region. Sustained by the inner-layer heat-resistant membrane, the conductive glue protrudes from the patterned hole to cover a portion of the conductive metals on the surface of the multilayer thin film sensor structure. Thereby are simultaneously achieved a water-proof effect, an airtight effect and a fine interface compatibility.

First claim

What is claimed is:

1. A glue filling method for a multilayer thin film sensor structure, comprising steps:
providing a multilayer thin film sensor structure having an upper surface, a lower surface and an electric-conduction through-hole penetrating said upper surface and said lower surface;
providing a composite heat-resistant membrane including at least a first heat-resistant membrane, a second heat-resistant membrane and a third heat-resistant membrane, wherein a first patterned hole and a second patterned hole are respectively formed in said first heat-resistant membrane and said second heat-resistant membrane, corresponding to each other in location, and separately penetrating said first heat-resistant membrane and said second heat-resistant membrane, and wherein sizes of said first patterned hole and said second patterned hole are larger than a size of said electric-conduction through-hole, and wherein said third heat-resistant membrane is arranged between said first heat-resistant membrane and said second heat-resistant membrane, and wherein the first patterned hole and the second patterned hole are aligned to an axis;
sticking said composite heat-resistant membrane to said lower surface of said multilayer thin film sensor structure and aligning said first patterned hole to said electric-conduction through-hole to make said electric-conduction through-hole and said first patterned hole form a filling region;
filling a conductive glue into said filling region and letting said conductive glue protrude from said filling region toward said second patterned hole with said third heat-resistant membrane sustaining said conductive glue to form an arc-shaped bump; and
curing said conductive glue to form an electric-conduction plug, and peeling off said composite heat-resistant membrane.

2. The glue filling method for a multilayer thin film sensor structure according to claim 1 , wherein said conductive glue is cured in a thermosetting method.

3. The glue filling method for a multilayer thin film sensor structure according to claim 1 further comprises a step: after said conductive glue is cured, using an optical release method or a thermal release method to decrease stickiness of said composite heat-resistant membrane and then peeling off said composite heat-resistant membrane.

4. The glue filling method for a multilayer thin film sensor structure according to claim 1 , wherein said composite heat-resistant membrane is made of polyethylene (PE), polyethylene terephthalate (PET), poly(methyl methacrylate (PMMA), or a rubber.

5. The glue filling method for a multilayer thin film sensor structure according to claim 1 , wherein after said conductive glue is cured, said electric-conduction plug has an upper cover and a lower cover respectively protruding from said upper surface and said lower surface, and wherein each of said upper cover and said lower cover is in form of an arc-shaped bump.

6. The glue filling method for a multilayer thin film sensor structure according to claim 5 , wherein a diameter of said upper cover is larger than an upper diameter of said electric-conduction through-hole, and a diameter of said lower cover is larger than a lower diameter of said electric-conduction through-hole.

7. The glue filling method for a multilayer thin film sensor structure according to claim 6 , wherein a plurality of conductive metals is respectively disposed on said upper surface and said lower surface of said multilayer thin film sensor structure, and wherein each of said upper cover and said lower cover covers a portion of said conductive metals.

8. The glue filling method for a multilayer thin film sensor structure according to claim 1 , wherein said multilayer thin film sensor structure further includes at least a first sensing film and a second sensing film, and wherein said electric-conduction through-hole penetrates said first sensing film and said second sensing film.

9. The glue filling method for a multilayer thin film sensor structure according to claim 1 , wherein said first heat-resistant membrane and said second heat-resistant membrane are adhesive, and said third heat-resistant membrane is non-adhesive.

Assignees

• Interface Tech (Chengdu) Co Ltd
• Interface Optoelectronics (Shenzhen) Co Ltd
• General Interface Solution Ltd

Inventors

• Chen Sheng Che
• Ho Yi-Hung

Classifications

• B32B15/04

  comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)} · CPC title

• B32B2250/42

  Alternating layers, e.g. ABAB(C), AABBAABB(C) · CPC title

• B32B9/041

  of metal · CPC title

• B32B2307/412

  Transparent · CPC title

• B32B3/266

  characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12 · CPC title