Addition-curable silicone composition
US-2016280918-A1 · Sep 29, 2016 · US
US10752774B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10752774-B2 |
| Application number | US-201715624087-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 15, 2017 |
| Priority date | Dec 18, 2014 |
| Publication date | Aug 25, 2020 |
| Grant date | Aug 25, 2020 |
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A polyorganosiloxane composition for molding includes: (A) a straight-chain polyorganosiloxane having two or more alkenyl groups and having a viscosity (25° C.) of 10,000 to 500,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane including M, D, and Q units, at a molar ratio of a:b:c, on average (0.3≤a≤0.6, 0≤b≤0.1, 0.4≤c≤0.7, and a+b+c=1), and having two or more alkenyl groups; (C) an amount of a polyorganohydrogensiloxane having Si-bonded hydrogen atoms, an average degree of polymerization of 10 or more, a content of the Si-bonded hydrogen atoms of 5.0 mmol/g or more and 11.0 mmol/g or less, and a mass decrease rate up to 140° C. by TGA of 2.0 mass % or less so that an amount of the (Si-bonded hydrogen atoms/alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A cured product excellent in mold release property is obtained and contamination of a metal mold is prevented.
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What is claimed is: 1. A polyorganosiloxane composition for molding comprising: (A) a straight-chain polyorganosiloxane having on average two or more alkenyl groups bonded to silicon atoms in one molecule and having a viscosity at 25° C. of 10,000 to 1,000,000 mPa·s; (B) 30 to 80 mass % of a polyorganosiloxane relative to a total of the (A) component and this component (B), the polyorganosiloxane including a resin structure containing on average: a monofunctional siloxane unit (a) represented by a formula: R 1 3 SiO 1/2 , wherein R 1 s independently represent an alkenyl group or a substituted or unsubstituted alkyl group; a bifunctional siloxane unit (b) represented by a formula: R 1 2 SiO 2/2 , wherein R 1 s are as in the above; and and a tetrafunctional siloxane unit (c) represented by a formula: SiO 4/2 , at a molar ratio of a:b:c, wherein 0.3≤a≤0.6, 0≤b≤0.1, 0.4≤c≤0.7, and a relation of a+b+c=1 is satisfied, and the resin structure having on average two or more alkenyl groups bonded to silicon atoms in one molecule; (C) an amount of a polyorganohydrogensiloxane having a hydrogen atom bonded to a silicon atom, an average degree of polymerization of 10 or more, a content of the hydrogen atom of 5.0 mmol/g or more and 11.0 mmol/g or less, and a weight decrease rate up to 140° C. by thermogravimetric analysis (TGA) of 2.0 wt % or less so that an amount of the hydrogen atom in this component is 1.0 to 3.0 mol relative to a total 1 mol of the alkenyl group in the (A) component and the alkenyl group in the (B) component; and (D) a catalytic amount of a hydrosilylation reaction catalyst, wherein the (B) component includes a polyorganosiloxane having: one or more substituted or unsubstituted alkyl groups bonded to silicon atoms in one molecule and an alkoxy group bonded to silicon atoms in one molecule; and a molar ratio of the alkoxy groups to the substituted or unsubstituted alkyl groups (a number of moles of alkoxy groups/a number of moles of substituted or unsubstituted alkyl groups) is 0.030 or less. 2. The polyorganosiloxane composition for molding according to claim 1 , wherein the straight-chain polyorganosiloxane being the (A) component has a viscosity at 25° C. of 50,000 to 500,000 mPa·s. 3. The polyorganosiloxane composition for molding according to claim 1 , wherein the (B) component includes: a monofunctional siloxane unit represented by a formula: (CH 3 ) 2 (CH 2 ═CH)SiO 1/2 ; a monofunctional siloxane unit represented by a formula: (CH 3 ) 3 SiO 1/2 ; and a tetrafunctional siloxane unit represented by a formula: SiO 4/2 . 4. The polyorganosiloxane composition for molding according to claim 1 , wherein the (B) component has a weight-average molecular weight Mw of 1500 or more by gel permeation chromatography (GPC). 5. The polyorganosiloxane composition for molding according to claim 1 , wherein a content rate of the (B) component to a total of the (A) component and the (B) component is 35 to 70 mass %. 6. The polyorganosiloxane composition for molding according to claim 1 , wherein the (C) component includes a straight-chain polyorganohydrogensiloxane having a weight decrease rate up to 180° C. by thermogravimetric analysis (TGA) is 2.0 wt % or less. 7. The polyorganosiloxane composition for molding according to claim 1 , wherein the (C) component includes a straight-chain polyorganohydrogensiloxane represented by a general formula: (R 2 3 SiO 1/2 )(R 2 HSiO 2/2 ) x (R 2 2 SiO 2/2 ) y (R 2 3 SiO 1/2 ), or a general formula: (R 2 2 HSiO 1/2 )(R 2 HSiO 2/2 ) x (R 2 2 SiO 2/2 ) y (R 2 2 HSiO 1/2 ), wherein R 2 s independently represent a substituted or unsubstituted monovalent hydrocarbon group except an alkenyl group, both x and y are positive integer numbers, and a relation of 30≤x+y≤200 and a relation of 0.4≤x/(x+y)≤0.7 is satisfied. 8. The polyorganosiloxane composition for molding according to claim 1 , wherein the (D) hydrosilylation reaction catalyst is a platinum-based metal compound. 9. The polyorganosiloxane composition for molding according to claim 1 , containing no inorganic filler and having a viscosity measured by a rotational viscometer at 25° C. of 10,000 to 1,000,000 mPa·s. 10. The polyorganosiloxane composition for molding according to claim 1 , containing no inorganic filler and a transmittance of light with a wavelength of 400 nm of 85% or more in a cured product having a thickness of 6 mm. 11. An optical member, a light source lens or cover made by curing the polyorganosiloxane composition for molding according to claim 1 . 12. The optical member, the light source lens or cover according to claim 11 , wherein the optical member is at least one kind selected from a primary or secondary lens for LED, a thick optical lens, a reflector for LED, an automobile LED matrix lighting lens, an augmented reality optical member, a silicone optical head for an LED chip, and a work light lens and reflector. 13. The optical member, the light source lens or cover according to claim 11 , wherein the light source is at least one kind selected from indoor or outdoor lighting, a reading light and accent lighting of public transport, and an LED street light. 14. The optical member, the light source lens or cover according to claim 11 , wherein the optical member is at least one kind selected from an illumination optical member for smartphone or tablet, an LED display for computer or television, and a light guide. 15. A molding method comprising: molding by a method selected from injection molding, compression molding, transfer molding, potting, and dispensing, using the polyorganosiloxane composition for molding according to claim 1 .
Esters of phosphorous acids, e.g. of H3PO3 · CPC title
containing silicon bound to hydrogen · CPC title
Flameproof or explosion-proof arrangements · CPC title
characterised by the material · CPC title
made of organic materials, e.g. plastics (G02B1/08 takes precedence) · CPC title
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