Substrate blank shearing and precise stack location apparatus and method for web fed presses

US10751935B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10751935-B2
Application numberUS-201815995900-A
CountryUS
Kind codeB2
Filing dateJun 1, 2018
Priority dateJun 1, 2018
Publication dateAug 25, 2020
Grant dateAug 25, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The automation of the assembly of a stack of substrates in the process of forming an object includes a blanking die having a push through plate to drive the blanked sheets onto a set of locating pins, thereby creating a very accurate stack. An image forming device may print and develop images onto a web that is subsequently die cut and stacked onto a curing platen. The die cutter cuts individual sheets out of the web and cuts or pre-cuts alignment holes into each sheet that would be accepted by the curing platen having locating pins corresponding to the alignment holes in the sheet. The die cutting operation includes a tamping device that would accurately transfer the sheets from the die to the curing platen. This stack may then be removed and/or processed to form a 3D object.

First claim

Opening claim text (preview).

What is claimed is: 1. A blanking die apparatus for stacking substrate sheets from a printed substrate web of a printing process, comprising: a punch holder aligned with a die holder, the punch holder configured to reciprocate towards and away from the die holder in a direction transverse to a delivery path of the printed substrate web fed between the punch holder and the die holder, the punch holder having a cavity therein with a cavity opening adjacent the die holder, the die holder having a channel there through corresponding with the cavity of the punch holder, the punch holder and the die holder configured to receive the printed substrate web there between, the printed substrate web including a printed image portion and a non-printed boarder portion, the die holder having a top surface proximate the punch holder and defining the delivery path of the printed substrate web to slide on, the punch holder and die holder configured to press the printed substrate web from opposite directions without piercing the substrate web; at least one guide post configured to maintain operative alignment of the punch holder and the die holder; a punch plate slidingly shiftable within the cavity of the punch holder, the punch plate configured to reciprocate in the direction transverse to the delivery path of the printed substrate web between a recessed position in the punch holder and a cutting position extended into the channel of the die holder to sever a substrate sheet from the printed substrate web and then move the severed substrate sheet into the channel, the punch plate having an inner periphery wall defining an aperture; and a knockout plate slidingly received within the aperture of the punch plate, the knockout plate configured to reciprocate in the direction transverse to the delivery path of the printed substrate web between a recessed location in the punch plate and a push through position beyond the die holder to push the severed substrate sheet through the channel, wherein the recessed location of the knockout plate coincides with the recessed position of the punch plate and the push through position of the knockout plate extends through the channel beyond the cutting position of the punch plate. 2. The apparatus of claim 1 , further comprising a sheet receiving cart aligned under the channel, the cart including a base, a decrementing pressure plate and a plurality of location pins attached to the base and extending through the decrementing pressure plate towards the cavity of the punch holder to maintain operative alignment of the decrementing pressure plate and the base. 3. The apparatus of claim 2 , wherein the severed substrate sheet includes alignment apertures corresponding with the location pins, and the knockout plate is further configured to push the severed substrate sheet onto the decrementing pressure plate with the location pins through the alignment apertures. 4. The apparatus of claim 3 , wherein the alignment apertures are pre-punched prior to a severing of the substrate sheet by the punch plate. 5. The apparatus of claim 2 , wherein the punch plate is further configured to repeatedly reciprocate between the recessed position and the cutting position to sever additional substrate sheets from the printed substrate web fed between the punch holder and the die holder, with the knockout plate further configured to push each additional severed substrate sheet through the channel onto the decrementing pressure plate, the decrementing pressure plate configured to permit entry and containment of the severed substrate sheets to create an orientated stacked arrangement. 6. The apparatus of claim 5 , the knockout plate further configured to push each additional severed substrate sheet the same distance through the channel onto the decrementing pressure plate, the decrementing pressure plate being biased from the base and configured to decrement in distance from the base upon entry of each additional severed substrate sheet onto the decrementing pressure plate. 7. The apparatus of claim 1 , the knockout plate having a boundary wall that abuts only the non-printed boarder portion of the severed substrate sheet to push the severed substrate sheet through the channel. 8. The apparatus of claim 1 , wherein the at least one guide post is fixedly attached to the die holder. 9. The apparatus of claim 1 , wherein the printed substrate web is one of a paper, plastic, carbon reinforced material and fabric. 10. A method of automatically stacking substrate sheets from a printed substrate web of a printing process, comprising: a) feeding the printed substrate web along a delivery path between a punch holder and a die holder of a blanking die apparatus, wherein the punch holder is aligned with the die holder, the printed substrate web including a printed image portion and a non-printed boarder portion, the blanking die apparatus having at least one guide posts configured to maintain operative alignment of the punch holder and the die holder, the die holder having a top surface proximate the punch holder and defining the deliver path of the printed substrate web to slide on during the feeding; b) pressing the printed substrate web between the punch holder and the die holder to hold the printed substrate web therebetween, the punch holder configured to reciprocate towards and away from the die holder in a direction transverse to a delivery path for the printed substrate web fed between the punch holder and the die holder, the punch holder having a cavity therein with a cavity opening adjacent the die holder, the die holder having a channel there through corresponding with the cavity of the punch holder; c) shifting a punch plate within the cavity of the punch holder to sever a substrate sheet from the printed substrate web with the punch plate, the punch plate configured to reciprocate in the direction transverse to the delivery path of the printed substrate web between a recessed position in the punch holder and a cutting position extended into the channel of the die holder to sever the substrate sheet from the printed substrate web and then move the severed substrate sheet into the channel, the punch plate having an inner periphery wall defining an aperture; and d) pushing the severed substrate sheet through the channel of the die holder with a knockout plate slidingly received within the aperture of the punch plate, the knockout plate configured to reciprocate in the direction transverse to the delivery path of the printed substrate web between a recessed location in the punch plate and a push through position beyond the die holder to push the severed substrate sheet through the channel, wherein the recessed location of the knockout plate coincides with the recessed position of the punch holder and the push through position of the knockout plate extends through the channel beyond the cutting position of the punch plate. 11. The method of claim 10 , further comprising, after Step d), pushing the severed substrate sheet onto a sheet receiving cart aligned under the channel, the cart including a base, a decrementing pressure plate and a plurality of location pins attached to the base and extending through the decrementing pressure plate towards the cavity of the punch holder to maintain operative alignment of the decrementing pressure plate and the base, wherein the severed substrate sheet includes alignment apertures corresponding with the location pins, and the knockout plate is further configured to push the severed substrate sheet onto the decrementing pressure plate with the location pins through the alignment apertures. 12. The method of claim 11 , further comprising, before Step d), automatically

Assignees

Inventors

Classifications

  • before shaping · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Preparation · CPC title

  • Cutting out · CPC title

  • involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control (surface shaping B29C59/00; after-treatment of articles without altering their shape B29C71/00) · CPC title

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What does patent US10751935B2 cover?
The automation of the assembly of a stack of substrates in the process of forming an object includes a blanking die having a push through plate to drive the blanked sheets onto a set of locating pins, thereby creating a very accurate stack. An image forming device may print and develop images onto a web that is subsequently die cut and stacked onto a curing platen. The die cutter cuts individua…
Who is the assignee on this patent?
Xerox Corp
What technology area does this patent fall under?
Primary CPC classification B29C64/147. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 25 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).