Joint structures

US10751932B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10751932-B2
Application numberUS-201715656401-A
CountryUS
Kind codeB2
Filing dateJul 21, 2017
Priority dateJul 21, 2017
Publication dateAug 25, 2020
Grant dateAug 25, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Aspects of the present disclosure are directed to a three-dimensional joint and/or formation thereof, such as by 3D-printing the joint. The joint is provided with an interface region having a curable material in a curable state. The joint is positioned with the interface region in contact with a joinable member, and the interface region is cured to form a bond between the joint and the joinable member. Such an approach may, for example, involve forming a mechanical and/or chemical bond with the joint. Further, by utilizing such a joint (e.g., in a 3D-printed form), complex structural components can be formed from a curable material that can be partially cured with structures formed therein, and cured further to create the bond.

First claim

Opening claim text (preview).

What is claimed is: 1. A method comprising: forming a three-dimensional object by 3D-printing and partially curing a curable material in a three-dimensional structural form, the three-dimensional object including an interface region having the partially-cured curable material in a curable state; positioning the three-dimensional object with the interface region, in the curable state, in contact with a joinable member; and with the interface region in contact with the joinable member, joining the three-dimensional object to the joinable member by curing the interface region. 2. The method of claim 1 , wherein curing the interface region includes forming a chemical bond between the interface region of the three-dimensional object and the joinable member. 3. The method of claim 1 , wherein curing the interface region includes forming a mechanical bond between the interface region of the three-dimensional object and the joinable member. 4. The method of claim 1 , wherein forming the three-dimensional object includes forming the curable material as three-dimensional internal structures within exterior walls of the three-dimensional object, by 3D-printing the curable material. 5. The method of claim 1 , wherein forming the three-dimensional object includes forming the interface region with the curable material including at least one resin that is compatible with a resin in the joinable member, and joining the three-dimensional object to the joinable member includes using the compatible resins to form a bond that joins the three-dimensional object to the joinable member. 6. The method of claim 1 , wherein forming the three-dimensional object includes fully curing a portion of the curable material and partially curing another portion of the curable material at the interface, therein providing a rigid 3D structure with a curable interface; and joining the three-dimensional object to the joinable member includes co-curing the interface region of the three-dimensional object with an interface region of the joinable member that is also in a curable state. 7. The method of claim 6 , wherein co-curing the interface region of the three-dimensional object with the interface region of the joinable member includes forming a continuous joint including cured material from both the interface region of the three-dimensional object and the interface region of the joinable member. 8. The method of claim 6 , wherein co-curing the interface region of the three-dimensional object with the interface region of the joinable member includes forming a chemical bond between the interface region of the three-dimensional object and the interface region of the joinable member. 9. The method of claim 1 , wherein forming a three-dimensional object includes arranging the curable material in the three-dimensional structural form and partially curing the curable material, therein 3D-printing the three-dimensional object with the interface region of the curable material in a curable state. 10. The method of claim 1 , wherein arranging the curable material includes arranging the curable material using a process selected from the group of: vat photopolymerization, material jetting, direct write, material extrusion, continuous fiber material extrusion, continuous fiber additive manufacturing and a combination thereof. 11. The method of claim 1 , wherein: forming the three-dimensional object includes forming the three-dimensional object with a second interface region having the curable material in a curable state; positioning the three-dimensional object includes positioning the second interface region in contact with a second joinable member; and joining the three-dimensional object to the joinable member includes curing the second interface region with the second interface region in contact with the second joinable member, therein joining the joinable members to one another with the three-dimensional object acting as a joint between the joinable members and permanently affixing the joinable members relative to one another via the joint. 12. The method of claim 1 , wherein: arranging the curable material in the three-dimensional structural form includes partially curing the three-dimensional structural form and therein providing the interface region having the curable material in the curable state, and curing the interface region includes curing the three-dimensional object. 13. A method comprising: 3D-printing a three-dimensional joint having an interface region including a curable material, by partially curing the curable material; positioning the three-dimensional joint with the interface region in contact with a joinable member; and forming a bond that joins the three-dimensional joint to the joinable member by curing the interface region. 14. The method of claim 13 , wherein forming the bond includes at least one of forming a chemical bond and forming a mechanical bond. 15. The method of claim 13 , wherein partially curing the three-dimensional joint includes carrying out a step selected from the group of: actively interrupting curing of the curable material, using different energy types to partially cure the curable material, 3D printing the curable material with respective materials having different cure rates at different regions of the three-dimensional joint, 3D printing the curable material with respective materials that cure at different temperatures, and a combination thereof. 16. The method of claim 13 , wherein 3D-printing the three-dimensional joint includes providing the three-dimensional joint in a curable state, further including curing three-dimensional structures of the three-dimensional joint while curing the interface region. 17. The method of claim 13 , wherein 3D-printing the three-dimensional joint includes printing three-dimensional adhesive material that is further curable at the interface region, the adhesive material having a chemical composition that, when cured while in contact with the joinable member, forms a chemical bond with the joinable member. 18. The method of claim 13 , wherein 3D-printing the three-dimensional joint includes forming internal three-dimensional structures within an external wall in a curable state, further including curing the three-dimensional structures while curing the interface region.

Assignees

Inventors

Classifications

  • B29C65/02Primary

    by heating, with or without pressure · CPC title

  • the to-be-joined areas of both parts to be joined being partially cured · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Fibre-reinforced materials (B29C66/729 takes precedence) · CPC title

  • characterised by the materials of both parts being thermosets · CPC title

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Frequently asked questions

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What does patent US10751932B2 cover?
Aspects of the present disclosure are directed to a three-dimensional joint and/or formation thereof, such as by 3D-printing the joint. The joint is provided with an interface region having a curable material in a curable state. The joint is positioned with the interface region in contact with a joinable member, and the interface region is cured to form a bond between the joint and the joinable…
Who is the assignee on this patent?
Wisconsin Alumni Res Found
What technology area does this patent fall under?
Primary CPC classification B29C65/02. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 25 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).