Implantable pulse generator headers including connectors having offset segments

Patent metadata

Field	Value
Publication number	US-10751528-B2
Application number	US-201715793391-A
Country	US
Kind code	B2
Filing date	Oct 25, 2017
Priority date	Oct 25, 2017
Publication date	Aug 25, 2020
Grant date	Aug 25, 2020

Abstract

Disclosed herein is an implantable electronic device for use with an implantable medical lead. The implantable electronic device includes a housing and a header connector assembly coupled to the housing and adapted to receive the proximal lead end of the implantable medical lead. The header connector assembly includes a connector assembly including a connector, a feedthru extending through the housing, and a conductor coupling the feedthru to the connector. The conductor includes a first conductor segment and a second conductor segment offset from the first conductor segment and each of the first conductor segment and the second conductor segment are resistance welded to the connector.

First claim

What is claimed is:

1. An implantable electronic device comprising:
a housing;
a feedthru extending through the housing; and
a header connector assembly coupled to the housing, the header assembly comprising:
a connector assembly comprising a ring connector, the ring connector adapted to receive and electrically couple to a proximal lead end of an implantable medical lead; and
a conductor coupling the ring connector to the feedthru, the conductor comprising a first conductor segment and a second conductor segment offset from the first conductor segment,

wherein:
the first conductor segment is mechanically and electrically coupled to a first location of the ring connector by a first resistance weld joint, and
the second conductor segment is mechanically and electrically coupled to a second location of the ring connector by a second resistance weld joint.

2. The implantable electronic device of claim 1 , wherein each of the first conductor segment and the second conductor segment are curved to conform to a profile of the ring connector.

3. The implantable electronic device of claim 1 , wherein the first conductor segment and the second conductor segment are substantially flat.

4. The implantable electronic device of claim 1 , wherein the conductor is formed from titanium and has a thickness from and including 0.003 inches to and including 0.050 inches.

5. The implantable electronic device of claim 1 , wherein the conductor comprises a forked terminal portion including the first conductor segment and the second conductor segment such that the first conductor segment and the second conductor segment extend parallel to each other.

6. The implantable electronic device of claim 1 , wherein the conductor comprises a common segment, the first conductor segment and the second conductor forming a junction at the common segment.

7. The implantable electronic device of claim 6 , wherein the common segment has a common segment width, and each of the first location and the second location are disposed at a respective distance from the junction that is greater than or equal to the common segment width.

8. The implantable electronic device of claim 6 , wherein the first conductor segment is aligned with the common segment and the second conductor segment extends from an offshoot of the common segment and extends parallel to the first conductor segment.

9. The implantable electronic device of claim 1 , wherein the conductor is one of a ribbon conductor, a plate, and a wire.

10. The implantable electronic device of claim 1 , wherein the first conductor segment has a first resistance and the second conductor segment has a second resistance substantially equal to the first resistance.

11. An implantable electronic device comprising:
a ring connector adapted to receive a lead end; and
a conductor coupled to the ring connector, the conductor comprising a first conductor segment and a second conductor segment offset from the first conductor segment,
wherein:
the first conductor segment is mechanically and electrically coupled to a first location of the ring connector by a first resistance weld joint, and
the second conductor segment is mechanically and electrically coupled to a second location of the ring connector by a second resistance weld joint.

12. The implantable electronic device of claim 11 , wherein the conductor comprises a forked terminal portion including the first conductor segment and the second conductor segment such that the first conductor segment and the second conductor segment extend parallel to each other.

13. The implantable electronic device of claim 11 , wherein the conductor is one of a ribbon conductor, a plate, and a wire.

14. The implantable electronic device of claim 11 , wherein the first conductor segment has a first resistance and the second conductor segment has a second resistance substantially equal to the first resistance.

15. The implantable electronic device of claim 11 , wherein the conductor is formed from titanium and has a thickness from and including 0.003 inches to and including 0.050 inches.

16. A method of manufacturing an implantable electronic device including a header connector assembly adapted to receive a proximal lead end of an implantable medical lead, the header connector assembly including a connector assembly including a ring connector, the method comprising:
abutting a conductor against the ring connector, wherein abutting the conductor against the ring connector includes abutting a first conductor segment against a first location of the ring connector and abutting a second conductor segment against a second location of the ring connector, the second location offset from the first location;
contacting the first conductor segment with a first electrode and the second conductor segment with a second electrode; and
resistance welding each of the first conductor segment and the second conductor segment to the ring connector by passing a current between the first electrode and the second electrode such that the first conductor segment and the second conductor segment are welded to the ring connector at respective joints.

17. The method of claim 16 , further comprising conforming each of the first conductor segment and the second conductor segment to a curved surface of the ring connector.

18. The method of claim 16 , wherein:
the first conductor segment and the second conductor segment form a junction at a common conductor segment having a common segment width, and
each of the first location and the second location are disposed at a respective distance from the junction that is greater than or equal to the common segment width.

Assignees

• Pacesetter Inc

Inventors

• Chiang Shichan
• Sheldon Evan
• Cappa Armando M

Classifications

• A61N1/3752 Primary

  Details of casing-lead connections · CPC title

• A61N1/37512

  Pacemakers · CPC title

• A61N1/3968

  Constructional arrangements, e.g. casings (A61N1/375 takes precedence) · CPC title

• A61N1/3956

  Implantable devices for applying electric shocks to the heart, e.g. for cardioversion · CPC title

• A61N1/0424

  Shape of the electrode · CPC title