Substrate for medical device and medical device

Patent metadata

Field	Value
Publication number	US-10749244-B2
Application number	US-201515516850-A
Country	US
Kind code	B2
Filing date	Aug 19, 2015
Priority date	Oct 27, 2014
Publication date	Aug 18, 2020
Grant date	Aug 18, 2020

Abstract

A substrate for a medical device, a portion of which is brought into contact with or inserted into a subject. The substrate includes a patient circuit conductively connected to the portion that is configured to be brought into contact with or inserted into the subject, and a ground-side circuit configured to perform at least one of transmission of a signal, reception of a signal, and supply of electric power on the patient circuit. The ground-side circuit is grounded by a protective ground to ensure safety of a manipulator of the medical device. The substrate also includes an insulating layer between the patient circuit and the ground-side circuit providing insulation between the patient circuit and the ground-side circuit, and an isolated circuit provided apart from the patient circuit and the ground-side circuit on the insulating layer and having a different reference potential from the patient circuit and the ground-side circuit.

First claim

The invention claimed is:

1. A substrate for a medical device configured to be included in the medical device, a portion of which is brought into contact with or inserted into a subject,
the substrate for the medical device comprising:
a patient circuit that is conductively connected to the portion of the medical device that is configured to be brought into contact with or inserted into the subject;
a ground-side circuit that is a circuit configured to perform at least one of transmission of a signal, reception of a signal, and supply of electric power on the patient circuit, the ground-side circuit being grounded by a protective ground to ensure safety of a manipulator of the medical device;
an insulating layer provided between the patient circuit and the ground-side circuit and providing insulation between the patient circuit and the ground-side circuit;
an isolated circuit provided apart from the patient circuit and the ground-side circuit on the insulating layer and having a different reference potential from the patient circuit and the ground-side circuit; and
a first impedance circuit that connects the patient circuit to the isolated circuit, and a second impedance circuit that connects the ground-side circuit to the isolated circuit, at least one of the first and second impedance circuits being formed of a chip-type surface mount electronic component.

2. The substrate for the medical device according to claim 1 , further comprising a plurality of impedance means for connecting either one of the patient circuit and the ground-side circuit and the isolated circuit,
wherein the patient circuit and the ground-side circuit are connected via the isolated circuit and at least part of the plurality of impedance means.

3. The substrate for the medical device according to claim 2 , wherein the isolated circuit and the impedance means are located on at least one of a first surface and a second surface that are inner layers of surfaces in a thickness direction of the substrate for the medical device.

4. The substrate for the medical device according to claim 2 , wherein the impedance means is formed of a chip-type electronic component.

5. The substrate for the medical device according to claim 4 , wherein the impedance means is located on at least two of a first surface and a second surface that are inner layers of surfaces in a thickness direction of the substrate for the medical device, and is provided such that at least part of the impedance means overlap along the thickness direction of the substrate for the medical device.

6. The medical device according to claim 2 , wherein the impedance means includes a dielectric sheet.

7. The substrate for the medical device according to claim 1 , further comprising:
a plurality of the isolated circuits; and
an impedance means for connecting two of the plurality of isolated circuits.

8. The substrate for the medical device according to claim 1 , comprising a conductor provided in the ground-side circuit and fixed in the medical device while being conductively connected to a ground-side circuit or a grounding unit provided in the medical device and yet outside the substrate for the medical device.

9. The medical device according to claim 1 , wherein the isolated circuit is placed at a position where stray capacitance occurs between the patient circuit and the ground-side circuit.

10. The medical device according to claim 1 , wherein the patient circuit and the ground-side circuit are arranged on a same layer in a thickness direction of the substrate.

11. The substrate for the medical device according to claim 1 , wherein the isolated circuit and the first and second impedance circuits are located on at least one of a first surface and a second surface that are inner layers of surfaces in a thickness direction of the substrate for the medical device.

12. The substrate for the medical device according to claim 1 , further comprising:
a plurality of the isolated circuits; and
an impedance circuit configured to provide a predetermined impedance for connecting two of the plurality of isolated circuits.

13. The substrate for the medical device according to claim 1 , wherein each of the first impedance circuit and the second impedance circuit is formed of a chip-type surface mount electronic component.

14. The substrate for the medical device according to claim 13 , wherein the at least one of the first impedance circuit and the second impedance circuit is located on at least two of a first surface and a second surface that are inner layers of surfaces in a thickness direction of the substrate for the medical device, and is provided such that at least part of the first and second impedance circuits overlap in the thickness direction of the substrate for the medical device.

15. The medical device according to claim 1 , wherein at least one of the first impedance circuit and the second impedance circuit includes a dielectric sheet.

16. The substrate for the medical device according to claim 1 , wherein the first and second impedance circuits are arranged to overlap the insulating layer, the first impedance circuit connects the patient circuit to the isolated circuit across the insulating layer, and the second impedance circuit connects the ground-side circuit to the isolated circuit across the insulating layer.

17. The substrate for the medical device according to claim 1 , wherein the patient circuit and the ground-side circuit include a plurality of surface-mount type electronic components.

18. The substrate for the medical device according to claim 1 , wherein the first and second impedance circuits include at least one of a capacitor, a coil, and a resistance.

19. The substrate for the medical device according to claim 1 , wherein the first impedance circuit and the second impedance circuit are arranged on a same layer in a thickness direction of the substrate.

20. A medical device, a portion of which is brought into contact with or inserted into a subject,
the medical device comprising a substrate for the medical device,
wherein the substrate for the medical device includes
a patient circuit that is conductively connected to the portion of the medical device that is configured to be brought into contact with or inserted into the subject,
a ground-side circuit that is a circuit configured to perform at least one of transmission of a signal, reception of a signal, and supply of electric power on the patient circuit, the ground-side circuit being grounded by a protective ground to ensure safety of a manipulator of the medical device
an insulating layer provided between the patient circuit and the ground-side circuit and providing insulation between the patient circuit and the ground-side circuit,
an isolated circuit provided apart from the patient circuit and the ground-side circuit on the insulating layer and having a different reference potential from the patient circuit and the ground-side circuit, and
a first impedance circuit that connects the patient circuit to the isolated circuit, and a second impedance circuit that connects the around-side circuit to the isolated circuit, at least one of the first and second impedance circuits being formed of a chip-type surface mount electronic component.

21. The medical device according to claim 20 , comprising:
a tip device including a circuit unit conductively connected to the patient circuit and being configured to be brought into contact with or inserted into the subject; and
a control device including

Assignees

• Sony Olympus Medical Solutions Inc

Inventors

• Kanno Kiyotaka

Classifications

• H04N23/00

  Cameras or camera modules comprising electronic image sensors; Control thereof · CPC title

• H05K1/0262 Primary

  Arrangements for regulating voltages or for using plural voltages · CPC title

• H01Q1/2283 Primary

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• A61B1/04

  combined with photographic or television appliances · CPC title

• H05K2201/09972

  Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently · CPC title