Proximity sensor having substrate including light sensing area and temperature sensing area

Patent metadata

Field	Value
Publication number	US-10749066-B2
Application number	US-201816183429-A
Country	US
Kind code	B2
Filing date	Nov 7, 2018
Priority date	Apr 5, 2018
Publication date	Aug 18, 2020
Grant date	Aug 18, 2020

Abstract

A proximity sensor includes a circuit board; a light-emitting element and a light-receiving element on the circuit board; a light barrier; molding portions; and a transparent board disposed on the molding portions and configured to form an air gap with the light-receiving element. The light-receiving element includes: a substrate having a light sensing area and a temperature sensing area; a first input electrode and a first output electrode which are aligned in the light sensing area and apart from each other with a first delay gap therebetween; a sensing film covering at least some portions of the first input electrode and the first output electrode; and a second input electrode and a second output electrode which are aligned in the temperature sensing area and apart from each other with a second delay gap therebetween. The second delay gap is exposed to air.

First claim

What is claimed is:

1. A proximity sensor comprising:
a circuit board having a first bonding pad area and a second bonding pad area;
a light-emitting element and a light-receiving element which are apart from each other and mounted on the circuit board and connected to the first and second bonding pad areas, respectively;
a light barrier disposed between the light-emitting element and the light-receiving element;
molding portions surrounding the light-emitting element and the light-receiving element; and
a transparent board disposed on the molding portions and configured to form an air gap with the light-receiving element,
wherein the light-receiving element comprises:
a substrate having a light sensing area and a temperature sensing area and comprising a piezo electric material;
a first input electrode and a first output electrode which are aligned in the light sensing area and apart from each other with a first delay gap between the first input electrode and the first output electrode;
a sensing film overlapping the first delay gap and covering at least some portions of the first input electrode and the first output electrode; and
a second input electrode and a second output electrode which are aligned in the temperature sensing area and apart from each other with a second delay gap between the second input electrode and the second output electrode,
wherein the second delay gap is exposed to air.

2. The proximity sensor of claim 1 , wherein the first input electrode is configured to receive a first electrical signal and provide a first input acoustic wave to the light sensing area,
the first output electrode is configured to output a first output acoustic wave modulated by the sensing film,
the second input electrode is configured to receive a second electrical signal and provide a second input acoustic wave to the temperature sensing area, and
the second output electrode is configured to output a second output acoustic wave modulated by the substrate.

3. The proximity sensor of claim 1 , wherein, on the circuit board, an integrated circuit (IC) chip connected to the light-receiving element is further mounted, and
the IC chip is molded by the molding portions.

4. The proximity sensor of claim 1 , wherein the light-emitting element comprises a light emitting diode (LED) with wavelengths ranging from about 650 nm to about 780 nm, and
the sensing film comprises CdS or CdSe.

5. The proximity sensor of claim 1 , wherein the first input electrode and the second output electrode comprise Inter Digital Transducer (IDT) electrodes comprising a plurality of fingers having comb shapes, and
the sensing film covers the plurality of fingers.

6. The proximity sensor of claim 1 , further comprising a ground electrode disposed between the light sensing area and the temperature sensing area,
wherein the first input electrode and the second input electrode are symmetrically aligned with respect to the ground electrode.

7. The proximity sensor of claim 1 , wherein, on the transparent board, patterns through which light having a certain frequency band penetrates are formed.

Assignees

• Haesung Ds Co Ltd

Inventors

• Lee Jin Woo
• Hong Jin Kee
• Lee Byung Moon
• Kim Jong Woo

Classifications

• H10F19/80

  Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells · CPC title

• H10F77/20

  Electrodes · CPC title

• H10H20/852

  Encapsulations · CPC title

• H10H20/8506

  Containers · CPC title

• H10H20/822

  Materials of the light-emitting regions · CPC title