Imaging device, manufacturing method, and electronic apparatus

Patent metadata

Field	Value
Publication number	US-10748947-B2
Application number	US-201716322307-A
Country	US
Kind code	B2
Filing date	Jul 25, 2017
Priority date	Aug 8, 2016
Publication date	Aug 18, 2020
Grant date	Aug 18, 2020

Abstract

The present disclosure relates to an imaging device, a manufacturing method, and an electronic apparatus. An imaging device includes: a sensor substrate with an effective pixel area; a transparent sealing member that seals a surface of the sensor substrate; a sealing resin that bonds the sensor substrate and the sealing member; and a reinforcing resin that bonds the sensor substrate and the sealing member. A product of adhesive strength per unit area of the sealing resin and the reinforcing resin in the outer peripheral region and an area of a part bonded in the outer peripheral region is set to be larger than a product of adhesive strength per unit area of the sealing resin in the effective pixel area and an area of a part bonded in the effective pixel area. The present technology can be applied to, for example, a CMOS image sensor of WCSP.

First claim

What is claimed is:

1. An imaging device comprising:
a sensor substrate provided with an effective pixel area in which a plurality of pixels is arranged in an array;
a transparent sealing member that seals a surface of the sensor substrate on the effective pixel area side;
a first adhesive member that bonds the sensor substrate and the sealing member in an area including at least the effective pixel area; and
a second adhesive member that bonds the sensor substrate and the sealing member in an outer peripheral region located outside the effective pixel area in a planar view, and has higher rigidity than the first adhesive member,
wherein a product of adhesive strength per unit area of the first adhesive member and the second adhesive member in the outer peripheral region and an area of a part bonded in the outer peripheral region is set to be larger than a product of adhesive strength per unit area of the first adhesive member in the effective pixel area and an area of a part bonded in the effective pixel area.

2. The imaging device according to claim 1 , wherein
the second adhesive member is disposed in an area including chip edges of the imaging device, in the outer peripheral region, and is formed with a discontinuous part in a planar view of the Imaging device.

3. The imaging device according to claim 2 , wherein
the second adhesive member is formed in at least two positions along two opposed sides in a planar view of the imaging device.

4. The imaging device according to claim 2 , wherein
the second adhesive member is formed in a plurality of positions in a scattered manner along an outer periphery of the chip edges in a planar view of the imaging device.

5. The imaging device according to claim 1 , wherein
the second adhesive member is disposed in an area including no chip edge of the imaging device, in the outer peripheral region.

6. The imaging device according to claim 5 , wherein
the second adhesive member is formed with a discontinuous part in a planar view of the Imaging device.

7. The imaging device according to claim 6 , wherein
the second adhesive member is formed inside the chip edges of the imaging device along two opposed sides in a planar view of the imaging device.

8. The imaging device according to claim 5 , wherein
the second adhesive member is continuously formed in a manner to surround the effective pixel area side inside the chip edges of the imaging device in a planar view of the imaging device.

9. The imaging device according to claim 6 , wherein
the second adhesive member is formed in a plurality of positions in a scattered manner along an outer periphery of the imaging device, inside the chip edges of the imaging device in a planar view of the imaging device.

10. The imaging device according to claim 1 , wherein
an excavated portion is provided in the outer peripheral region of at least one of the sensor substrate or the sealing member, and
the first adhesive member is embedded in the excavated portion.

11. The imaging device according to claim 1 , wherein
a recess is formed in a central region of the sensor substrate, in which the effective pixel area is provided, and
the sensor substrate and the sealing member are stacked in layers such that a protruded portion of the sealing member is fitted in the recess via the first adhesive member, the protruded portion being formed in a protruded shape in accordance with a shape of the recess.

12. The imaging device according to claim 11 , wherein
an anchoring member is formed in a manner to extend from the sensor substrate side to the sealing member in the outer peripheral region of the sensor substrate.

13. The imaging device according to claim 1 , wherein
a pad opening for opening a pad is formed in the outer peripheral region of the sensor substrate, and
a thin film is formed in the pad opening.

14. The imaging device according to claim 1 , wherein
a pad opening for opening a pad is formed in the outer peripheral region of the sensor substrate such that the pad opening is opened with multiple steps.

15. The imaging device according to claim 1 , wherein
a pad opening for opening a pad is formed in the outer peripheral region of the sensor substrate, with a structure for avoiding formation of a step on the first adhesive member at a stepped portion of the pad opening.

16. A method of manufacturing an imaging device that includes:
a sensor substrate provided with an effective pixel area in which a plurality of pixels is arranged in an array;
a transparent sealing member that seals a surface of the sensor substrate on the effective pixel area side;
a first adhesive member that bonds the sensor substrate and the sealing member in an area including at least the effective pixel area; and
a second adhesive member that bonds the sensor substrate and the sealing member in an outer peripheral region located outside the effective pixel area in a planar view, and has higher rigidity than the first adhesive member,
wherein a product of adhesive strength per unit area of the first adhesive member and the second adhesive member in the outer peripheral region and an area of a part bonded in the outer peripheral region is set to be larger than a product of adhesive strength per unit area of the first adhesive member in the effective pixel area and an area of a part bonded in the effective pixel area, the method comprising:
forming the second adhesive member with a discontinuous part in the outer peripheral region of either the sensor substrate or the sealing member;
forming the first adhesive member on an entire surface except an area in which the second adhesive member has been formed; and
bonding the sensor substrate and the sealing member with the first adhesive member and the second adhesive member.

17. A method of manufacturing an imaging device that includes:
a sensor substrate provided with an effective pixel area in which a plurality of pixels is arranged in an array;
a transparent sealing member that seals a surface of the sensor substrate on the effective pixel area side;
a first adhesive member that bonds the sensor substrate and the sealing member in an area including at least the effective pixel area; and
a second adhesive member that bonds the sensor substrate and the sealing member in an outer peripheral region located outside the effective pixel area in a planar view, and has higher rigidity than the first adhesive member,
wherein a product of adhesive strength per unit area of the first adhesive member and the second adhesive member in the outer peripheral region and an area of a part bonded in the outer peripheral region is set to be larger than a product of adhesive strength per unit area of the first adhesive member in the effective pixel area and an area of a part bonded in the effective pixel area, the method comprising:
forming the second adhesive member, at a wafer level before the imaging device is divided into individual pieces, such that the second adhesive member is disposed in the outer peripheral region except portions at which chip edges of the imaging device are to be formed;
forming the first adhesive member on an entire surface except an area in which the second adhesive member has been formed;
bonding the sensor substrate and the sealing member with the first adhesive member and the second adhesive member; and
performing dicing at the portions at which chip edges of the imaging device are to be formed.

18. An electronic apparatus comprising an imaging device that includes:
a sensor substrate provided wi

Assignees

• Sony Semiconductor Solutions Corp

Inventors

• Masuda Yoshiaki
• Ando Atsuhiro
• Kubo Norihiro
• Arai Chihiro
• Saito Sotetsu
• Tada Masahiro
• Miyazawa Shinji

Classifications

• H10W76/60

  Seals · CPC title

• H10W74/40

  characterised by their materials · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H04N25/70

  SSIS architectures; Circuits associated therewith · CPC title