Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices

Patent metadata

Field	Value
Publication number	US-10748867-B2
Application number	US-201213343651-A
Country	US
Kind code	B2
Filing date	Jan 4, 2012
Priority date	Jan 4, 2012
Publication date	Aug 18, 2020
Grant date	Aug 18, 2020

Abstract

The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.

First claim

What is claimed is:

1. A method of making a three-dimensional device using a fused deposition modeling (FDM) three-dimensional printing device, comprising the steps of: creating a three-dimensional substrate comprising a plurality of layers by selectively depositing a thermoplastic substrate material in a layer-by-layer fashion using a FDM additive manufacturing system, wherein the plurality of layers is extruded from said FDM additive manufacturing system comprising a movable dispensing head that moves along a predetermined pattern to thereby produce each of the plurality of layers; intermittently pausing the FDM additive manufacturing system after a specified number of layers have been deposited, and then selectively removing portions of the substrate via micro-machining to form a plurality of interconnection cavities and a plurality of component cavities therein, wherein the plurality of interconnection cavities interconnect with at least some of a plurality of component cavities; filling the interconnection cavities with a conductive material; and placing one or more electrical components in the component cavities, the one or more electrical components contacting the conductive material in the interconnection cavities.

2. The method of claim 1 , wherein the substrate material comprises at least one of a polymer material, a ceramic material, a metallic material, a mineral material, a glass ceramic material, a semi-conductor material, a nanomaterial, a biomaterial, an organic material, or any combination thereof.

3. The method of claim 1 , wherein the substrate material further comprises acrylonitrile butadiene styrene (ABS), ABSi, ABSplus, ABS-M30, ABSM30i, PC-ABS, PC-ISO, polyphenylsulfone (PPSF/PPSU), or any combination thereof.

4. The method of claim 1 , wherein the substrate material comprises at least one of poly(methyl methacrylate) (PMMA), polypropylene, polyolefin, 1LPE, HOPE, polyvinyl acetate, polyester, nylon, polyimides, polyketone, polyether ethyl ketone (PEEK), polybutadiene, polylactic acid, polycaprolactone, polyethylene terephthalate, liquid crystalline polymer (lCP), polystyrene, polyvinyl chloride, polyfluoroethylene, polydifluoroethylene, polytetrafluoroethylene, ZEONEX RS420, Eccostock HIK-TPO, co-polymers and block co-polymers of the previous, or any combination thereof.

5. The method of claim 1 , further comprising the step of forming a cooling channel by removing a portion of the substrate.

6. The method of claim 1 , further comprising the step of depositing at least one of a thermally conductive material, a ceramic material, a dielectric material, a magnetic material, a piezoelectric material, an insulating material, an elastomer, a wax, a resin, an epoxy, a plastic material, a glass or any combination thereof on the substrate.

7. The method of claim 1 , wherein the interconnection cavities comprise at least one of an interconnection channel, a pin cavity or a via.

8. The method of claim 1 , wherein the portions of the substrate are removed using at least one of a micro-machining machine, a CNC micro-machining machine, a micro electrical discharge machining machine, an electrochemical machining machine, a direct write proton micro-machining machine, a radiative source, an ultrasonic cutting machine, a hot wire cutting machine, a waterjet machine, an etching machine, a deep reactive ion etching machine, a crystal orientation dependent etching machine, a wet bulk micromachining machine, a UV-lithography or X-ray lithography (LIGA) machine, a hot embossing lithography machine, a precision mechanical sawing machine, a chemically assisted ion milling machine, a sand blasting machine, a cutting machine.

9. The method of claim 1 , wherein the conductive material comprises at least one of a metal, a metal alloy, an ink containing conductive particles, a conductive polymer or a wire.

10. The method of claim 1 , wherein the interconnection cavities are filled with the conductive material using at least one of a direct-write microdispensing process, a direct-print microdispensing process, a material extrusion additive manufacturing head, another extrusion-based deposition system, an inkjet dispensing system, a spray machine, a wire bonding machine, a solder machine, a photolithographic technique, an electrodeposition machine, a damascene process, a rotogravure machine, an electrosputtering machine or by a physical embedding process.

11. The method of claim 1 , wherein the conductive material is cured using at least one of a laser, an Ohmic curing process, an inductive curing process, a radiation curing process, an electric polarization process or a magnetic polarization process.

12. The method of claim 1 , wherein the electrical components comprise at least one of an electronic component, an electrostatic component, a pneumatic component, an electroacoustic component, a microelectromechanical system (MEMS), a biomedical component, an electrochemical component, an electromechanical component, an electromagnetic component, a mechanical component, a metamaterial component, an optical component, a photonic component, a thermal component or a thermal management component.

13. The method of 1 , wherein the electrical components comprise at least one of an integrated circuit, a resistor, a capacitor, an inductor, a transistor, a them listor, a thyristor, a sensor, a processor, a memory, an interface device, a display, a power source, an energy conversion device or an antenna.

14. The method of claim 1 , wherein the electrical components are placed by at least one of hand placement and using a component placement machine, wherein the component placement machine comprises at least one of a pick and place machine, a robotic process or other automated component placement technology.

Assignees

• Wicker Ryan B
• Macdonald Eric
• Medina Francisco
• Espalin David
• Muse Danny W
• Univ Texas

Inventors

• Wicker Ryan B
• Macdonald Eric
• Medina Francisco
• Espalin David
• Muse Danny W

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/07183

  Means for monitoring · CPC title

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title