Semiconductor laser module and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-10748836-B2
Application number	US-201716078192-A
Country	US
Kind code	B2
Filing date	Feb 20, 2017
Priority date	Feb 25, 2016
Publication date	Aug 18, 2020
Grant date	Aug 18, 2020

Abstract

The semiconductor laser module 1 has an electrically conductive heat sink 10, a submount 20 disposed above the heat sink 10, a semiconductor laser device 30 disposed above the submount 20, a lower solder layer 50 disposed between the heat sink 10 and the submount 20, and an upper solder layer 60 electrically connected to the semiconductor laser device 30 and the heat sink 10. This upper solder layer 60 has an electric resistivity lower than an electric resistivity of the submount 20 and extends along surfaces 21 and 22 of the submount 20 to the heat sink 10.

First claim

The invention claimed is:

1. A semiconductor laser module comprising:
an electrically conductive heat sink;
a submount disposed above the heat sink;
a semiconductor laser device disposed above the submount; and
an electrically conductive portion electrically connected to the semiconductor laser device and the heat sink, the electrically conductive portion extending along a surface of the submount to the heat sink and having an electric resistivity lower than an electric resistivity of the submount,
wherein the electrically conductive portion includes:
an upper solder layer electrically connected to the semiconductor laser device,
a lower solder layer formed between the submount and the heat sink, and
a plating layer formed on at least a side surface of the submount and not formed on a bottom surface of the submount, the plating layer electrically connecting the upper solder layer and the lower solder layer to each other,

wherein the upper solder layer is held in direct contact with the submount.

2. The semiconductor laser module as recited in claim 1 , wherein the submount has a heat conductivity higher than a heat conductivity of the electrically conductive portion.

3. The semiconductor laser module as recited in claim 1 , wherein the plating layer is formed only on the side surface of the submount.

4. A method of manufacturing a semiconductor laser module having an electrically conductive heat sink, a submount disposed above the heat sink, and a semiconductor laser device disposed above the submount, the method comprising:
forming an electrically conductive portion having an electric resistivity lower than an electric resistivity of the submount so as to extend from the semiconductor laser device to the heat sink along a surface of the submount for electrically connecting the semiconductor laser device and the heat sink to each other,
wherein the forming of the electrically conductive portion comprises:
forming a lower solder layer between the heat sink and the submount,
forming a plating layer on at least a side surface of the submount and not on a bottom surface of the submount,
disposing the submount on the lower solder layer so that the plating layer is electrically connected to the lower solder layer, and
forming an upper solder layer electrically connected to the plating layer and the semiconductor laser device,

wherein the forming of the upper solder layer comprises forming the upper solder layer in direct contact with the submount.

5. The method of manufacturing a semiconductor laser module as recited in claim 4 , wherein the submount has a heat conductivity higher than a heat conductivity of the electrically conductive portion.

6. The method of manufacturing a semiconductor laser module as recited in claim 4 , wherein the forming of the plating layer comprises forming the plating layer only on the side surface of the submount.

7. A semiconductor laser module comprising:
an electrically conductive heat sink;
a submount disposed above the heat sink;
a semiconductor laser device disposed above the submount; and
an electrically conductive portion electrically connected to the semiconductor laser device and the heat sink, the electrically conductive portion extending along a surface of the submount to the heat sink and having an electric resistivity lower than an electric resistivity of the submount,
wherein the electrically conductive portion includes:
an upper solder layer electrically connected to the semiconductor laser device,
a lower solder layer formed between the submount and the heat sink, and

a plating layer is formed only on a side surface of the submount, the plating layer electrically connecting the upper solder layer and the lower solder layer to each other.

8. The semiconductor laser module as recited in claim 7 , wherein the submount has a heat conductivity higher than a heat conductivity of the electrically conductive portion.

9. A method of manufacturing a semiconductor laser module having an electrically conductive heat sink, a submount disposed above the heat sink, and a semiconductor laser device disposed above the submount, the method comprising:
forming an electrically conductive portion having an electric resistivity lower than an electric resistivity of the submount so as to extend from the semiconductor laser device to the heat sink along a surface of the submount for electrically connecting the semiconductor laser device and the heat sink to each other,
wherein the forming of the electrically conductive portion comprises:
forming a lower solder layer between the heat sink and the submount,
forming a plating layer comprises forming the plating layer only on a side surface of the submount,
disposing the submount on the lower solder layer so that the plating layer is electrically connected to the lower solder layer, and
forming an upper solder layer electrically connected to the plating layer and the semiconductor laser device.

10. The method of manufacturing a semiconductor laser module as recited in claim 9 , wherein the submount has a heat conductivity higher than a heat conductivity of the electrically conductive portion.

Assignees

• Fujikura Ltd

Inventors

• Kaifuchi Yoshikazu

Classifications

• H10W40/10

  Arrangements for heating · CPC title

• H10W40/60 Primary

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H01S5/0237 Primary

  by soldering · CPC title

• H01S5/022

  Mountings; Housings · CPC title

• H01S5/023

  Mount members, e.g. sub-mount members · CPC title