Ambient-light-sensing hole structure package and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10746595-B2
Application number	US-201815972253-A
Country	US
Kind code	B2
Filing date	May 7, 2018
Priority date	Mar 14, 2018
Publication date	Aug 18, 2020
Grant date	Aug 18, 2020

Abstract

An ambient-light-sensing hole structure package and a method of manufacturing the same are provided. The ambient-light-sensing hole structure package includes a transparent cover, a decorative layer, a porous structure layer, and an optical adhesive. The transparent cover has a surface. The decorative layer is disposed on the surface and the decorative layer has an opening that exposes a portion of the surface. The porous structure layer is disposed on one side of the decorative layer and the porous structure layer covers the portion of the surface. The porous structure layer includes a plurality of through holes, and the through holes overlap with the opening. The optical adhesive is interposed between the decorative layer and the porous structure layer.

First claim

What is claimed is:

1. An ambient-light-sensing hole structure package, comprising:
a transparent cover having a surface;
a decorative layer disposed on the surface, and the decorative layer having an opening exposing a portion of the surface, wherein a material of the decorative layer includes a light-shielding material, and the opening has a pore diameter;
a multi-pore structural layer disposed adjacent to a side of the decorative layer, and the multi-pore structural layer covering the portion of the surface, wherein the multi-pore structural layer comprises a plurality of through holes, and the through holes overlap the opening, wherein the pore diameter of the opening is greater than a diameter of each through hole; and
an optical adhesive interposed between the decorative layer and multi-pore structural layer.

2. The ambient-light-sensing hole structure package of claim 1 , further comprising a transparent film, the multi-pore structural layer being disposed on the transparent film, wherein the multi-pore structural layer is interposed between the transparent film and the optical adhesive.

3. The ambient-light-sensing hole structure package of claim 1 , further comprising a transparent film, and the multi-pore structural layer disposed on the transparent film, wherein the transparent film is interposed between the multi-pore structural layer and the optical adhesive.

4. The ambient-light-sensing hole structure package of claim 1 , wherein the through holes are arranged in a concentric circular array or a rectangular array.

5. The ambient-light-sensing hole structure package of claim 4 , wherein the diameter of each through hole ranges from 30 micrometers to 65 micrometers.

6. The ambient-light-sensing hole structure package of claim 4 , wherein a first distance is present between any two adjacent ones of the through holes, and the first distance ranges from 50 micrometers to 65 micrometers.

7. The ambient-light-sensing hole structure package of claim 1 , wherein the multi-pore structural layer laterally extends a second distance, and the second distance is at least 1 mm greater than the pore diameter.

8. A method of manufacturing the ambient-light-sensing hole structure package, the method comprising the following steps:
providing a transparent cover;
forming a decorative layer on the transparent cover, the decorative layer having an opening, wherein a material of the decorative later includes a light-shielding material and the opening has pore diameter;
providing a transparent film;
forming a multi-pore structural layer on the transparent film to form a functional layer, wherein the multi-pore structural layer comprises a plurality of through holes, wherein the pore diameter of the opening is greater than a diameter of each through hole; and
adhering the functional layer to the decorative layer using an optical adhesive, wherein the through holes overlap the opening.

9. The manufacturing method of claim 8 , wherein the multi-pore structural layer is interposed between the transparent film and the optical adhesive.

10. The manufacturing method of claim 8 , wherein the transparent film is interposed between the multi-pore structural layer and the optical adhesive.

Assignees

• Interface Tech (Chengdu) Co Ltd
• Interface Optoelectronics (Shenzhen) Co Ltd
• General Interface Solution Ltd

Inventors

• Chen Chun-Hung
• Yu Jing-Bing
• Lin Tai-Wu
• Yao Yen-Chang
• Chang ya-ting
• Chia Pang-Chiang
• Huang Yen-Heng

Classifications

• B23P19/04

  for assembling or disassembling parts · CPC title

• G01J1/0437

  using masks, aperture plates, spatial light modulators, spatial filters, e.g. reflective filters · CPC title

• G01J1/4204 Primary

  with determination of ambient light (solar light G01J2001/4266) · CPC title

• G01J1/0455

  having a throughhole enabling the optical element to fulfil an additional optical function, e.g. a mirror or grating having a through-hole for a light collecting or light injecting optical fibre · CPC title

• B29C65/48

  using adhesives {, i.e. using supplementary joining material; solvent bonding} · CPC title