Method for adjusting the setpoint temperature of a heat transfer medium

US10746415B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10746415-B2
Application numberUS-201414513771-A
CountryUS
Kind codeB2
Filing dateOct 14, 2014
Priority dateOct 15, 2013
Publication dateAug 18, 2020
Grant dateAug 18, 2020

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A method for adjusting the setpoint temperature of a heat transfer medium circulating in a heating or cooling system ( 9 ) inside a building or at least inside a surrounding part of a building. The heating or cooling circuit includes a plurality of heat transferring units, each with a temperature controlled valve. A sum opening degree (OD) of all temperature controlled valves is determined in a time dependent manner and a setpoint temperature T w,ref of heat transferring medium is controlled according to a predetermined sum opening degree (OD) of all temperature controlled valves. A heating system ( 9 ) is provided for supplying heat to a building or a part of the building via a liquid heat transfer medium circulated in a circuit. The heating system ( 9 ) includes heat transferring units, each being equipped with a temperature controlled valve. The system is controllable according to the method for adjusting the setpoint temperature.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for adjusting a setpoint temperature of a heat transfer medium circulating in a heating or cooling system inside a building or circulating in a heating or cooling system at least inside a surrounding part of a building, the method comprising the steps of: providing a heating or cooling circuit comprising a plurality of heat transferring units, each of the plurality of heat transferring units being equipped with a temperature controlled valve; determining a sum opening degree of all temperature controlled valves in a time dependent manner; and controlling the setpoint temperature of heat transferring medium according to a predetermined sum opening degree of all temperature controlled valves, the time dependent sum valve opening degree being based on an actual estimated hydraulic system resistance compared with an estimated minimum and/or maximum hydraulic system resistance, the estimation of the minimum and/or maximum hydraulic system resistance being based on estimated hydraulic systems resistances registered in the last 5 to 25 days, wherein the estimation of the minimum and/or the maximum hydraulic system resistance is provided by filtering peak values of a continuously determined hydraulic system resistance, wherein the sum opening degree of all temperature controlled valves is determined on the basis of at least one of a volume rate of flow and a pressure head through the heating or cooling circuit. 2. A method according to claim 1 , wherein the setpoint temperature is also adjusted according to an outside temperature outside of the building. 3. A method according to claim 1 , wherein the sum opening degree of all temperature controlled valves is determined from at least one of sensor based data and electrical data of a heating or cooling system pump. 4. A method according to claim 1 , wherein the method provides a first phase when the minimum and maximum hydraulic system resistance are estimated and a second phase when the sum opening degree of all temperature controlled valves is determined.

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What does patent US10746415B2 cover?
A method for adjusting the setpoint temperature of a heat transfer medium circulating in a heating or cooling system ( 9 ) inside a building or at least inside a surrounding part of a building. The heating or cooling circuit includes a plurality of heat transferring units, each with a temperature controlled valve. A sum opening degree (OD) of all temperature controlled valves is determined in a…
Who is the assignee on this patent?
Grundfos Holding As
What technology area does this patent fall under?
Primary CPC classification F24F11/83. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Aug 18 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).