Diamond-coated cemented carbide cutting tool

Patent metadata

Field	Value
Publication number	US-10745802-B2
Application number	US-201816495629-A
Country	US
Kind code	B2
Filing date	Mar 22, 2018
Priority date	Mar 22, 2017
Publication date	Aug 18, 2020
Grant date	Aug 18, 2020

Abstract

In this diamond-coated cemented carbide cutting tool, (1) an average particle size of WC particles is 0.5 to 0.9 μm, (2) (R z ) being 0.5 to 1.0 μm, a maximum distance between the concave and convex (Δ) is 0.5 to 1.5 μm, a length (Y e ) is 0.5 to 2.0 μm, (3) a sum of areas of WC particles, which satisfies (L 1 ) being 0.4 to 0.8 μm, (L 2 ) being 0.2 to 0.4 μm, and (L 1 )/(L 2 ) being 1.5 to 2.5, is 70 area % or more, (4) an average grain size of diamond crystals in a region of 0.5 to 1.5 μm from the body interface is 0.1 to 0.3 μm, and (5) columnar crystals satisfying at least one of: a ratio of crystals, which has a growth direction shifted in 10 degrees or less from the diamond film thickness direction, being 90% or more; or an orientation ratio of <110> being 30 to 70%.

First claim

The invention claimed is:

1. A diamond-coated cemented carbide cutting tool comprising:
a WC-based cemented carbide body containing 3 to 15 mass % of Co that is coated with a diamond film,
wherein, in a cross section of the diamond-coated cemented carbide cutting tool in a diamond film thickness direction,
(1) an average particle size of WC particles constituting the WC-based cemented carbide body is 0.5 to 0.9 μm,
(2) a maximum height difference (R z ) of concave and convex of an interface of the WC-based cemented carbide body contacting the diamond film is 0.5 to 1.0 μm, a maximum distance (Δ) between adjacent concave and convex of the WC-based cemented carbide body at the interface is 0.5 to 1.5 μm, and a length (Y e ) of the diamond film in the thickness direction in a region where a binder phase of the WC-based cemented carbide body is removed is 0.5 to 2.0 μm,
(3) when a sum of areas occupied by individual WC particles contacting the diamond film at the interface is defined as 100 area %, a sum of areas of WC particles, which satisfies a maximum value (L 1 ) of vertex-to-vertex distances of the WC particles at a body interface being 0.4 to 0.8 μm, a minimum value (L 2 ) of a diameter of an inscribed-circle inscribed in the WC particle or distances between tangents of opposing faces being 0.2 to 0.4 μm, and (L 1 )/(L 2 ) being 1.5 to 2.5, is 70 area % or more,
(4) an average grain size of diamond crystals in a region of 0.5 to 1.5 μm from the WC-based cemented carbide body interface toward the diamond film is 0.1 to 0.3 μm, and
(5) the diamond-coated cemented carbide cutting tool comprises columnar crystals, which contact the top of the diamond crystals and constitute the diamond film, the columnar crystals satisfy at least one of: a ratio of crystals, which has a growth direction shifted in 10 degrees or less from the diamond film thickness direction, being 90% or more; and an orientation ratio of <110> being 30 to 70%.

2. The diamond-coated cemented carbide cutting tool according to claim 1 ,
wherein an average film thickness of the diamond film is 3 to 30 μm.

Assignees

• Mitsubishi Materials Corp

Inventors

• Shikada Shinichi
• TOMINAGA Akimitsu
• Takashima Hideaki

Classifications

• C23C16/27 Primary

  Diamond only · CPC title

• C01B32/26

  Preparation (by using ultra-high pressure B01J3/06; by crystal growth C30B29/04) · CPC title

• B23C5/16

  characterised by physical features other than shape · CPC title

• B23B51/00

  Tools for drilling machines · CPC title

• B23B27/20 Primary

  with diamond bits {or cutting inserts} · CPC title