Method and device for increasing laser-induced shock wave pressure

US10745776B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10745776-B2
Application numberUS-201515752444-A
CountryUS
Kind codeB2
Filing dateSep 7, 2015
Priority dateAug 13, 2015
Publication dateAug 18, 2020
Grant dateAug 18, 2020

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A method and a device for increasing a laser induced shock wave pressure. According to the method, plasmas ( 21 ) are generated by impinging an aluminium foil ( 20 ) using lasers; a high-voltage pulse electrode ( 22 ) discharges to the plasmas ( 21 ) to induce and form a photoelectric combined energy field and then high-temperature plasmas ( 21 ) having the characteristics of an ultra-high density and an ultra-high speed expansion are induced and generated; a surface to be processed is impacted by the high-temperature plasmas ( 21 ) in a restrained state; the laser induced shock wave pressure is increased substantially; the surface of a high-strength material is reinforced, and the strength, hardness, abrasion resistance and anti-fatigue performances of the high-strength material are improved. The device comprises a laser, the electrode ( 22 ), a high-voltage power supply ( 4 ), a discharging medium ( 12 ), a moving platform, etc.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for increasing laser-induced shock wave pressure, the method comprising: using a laser to induce aluminum foil to generate plasma; pulse electrodes discharging to the plasma to induce and form a photoelectric composite energy field, thereby inducing and generating the plasma, wherein the plasma is a high-temperature plasma; and the plasma in a restrained state impacting a surface to be processed, increasing the laser induced shock wave pressure, strengthening the surface of high-strength materials and improving strength, hardness, abrasion resistance and anti-fatigue performances of high-strength materials, wherein a voltage of the pulse electrodes is at least 400 Volts. 2. The method according to claim 1 , wherein the surface to be processed is a surface of a workpiece, and wherein the method further comprises: A) the surface of the workpiece is affixed with the aluminum foil, and the laser is irradiated on a surface of the aluminum foil, the laser being a nanosecond pulse laser; B) the aluminum foil absorbs laser energy to gasify and form gasified substances; C) under action of the laser, the gasified substances ionize and generate a plasmoid with conductive characteristics; D) the plasmoid continues to absorb the laser energy and expands, making an outer surface of the plasmoid rapidly expand outward; E) after the outer surface of the plasmoid enters a discharge gap of the pulse electrodes, the pulse electrodes automatically discharge to automatically induce and form a photoelectric composite energy field and generate a high temperature; F) under action of the high temperature, a plasma density of the plasma rapidly increases and explodes, thereby realizing expansion of the plasma; and G) under constraint of a discharge medium, the plasma impacts the surface of the workpiece with a shock wave and produces a strengthening effect. 3. The method according to claim 2 , wherein the pulse electrodes comprise 2 to 6 symmetrical electrodes, and wherein the symmetrical electrodes are symmetrically arranged in a horizontal plane around a center of a light spot on the aluminum foil. 4. The method according to claim 2 , wherein a critical voltage of a power supply of the pulse electrodes is U 0 = E r · D = E r ⁡ ( L 1 - Vt 0 ) = E r ⁡ ( L 1 - Bt 0 ⁢ E τ ⁢ ⁢ d 2 ) , where E r is a critical electric field strength when the discharge medium is broken down, D is a distance between an outer surface of the plasma and the pulse electrodes when the discharge medium is broken down, L 1 is a distance between a discharge end of the pulse electrodes and a spot center on a surface of the aluminum foil, V is a speed of plasma expansion, t 0 is a time of the discharge medium being broken down, E is an energy of the laser, r is a pulse width of the laser, d is a diameter of a laser spot, and B is a constant obtained from experimental data. 5. The method according to claim 4 , wherein a spacing L 2 between the pulse electrodes is 0.8˜1.0R, and R is a diameter of the laser spot; and wherein the distance L 1 between the discharge end of the pulse electrodes and the spot center on the surface of the aluminum foil is maintained in a range of 0.5R to 0.8R. 6. The method according to claim 4 , wherein a time distribution of the shock wave is adjusted by the time t 0 of the discharge medium being broken down, and the time t 0 of the discharge medium being broken down is adjusted by the distance L 1 between the discharge end of the pulse electrodes and the spot center on the surface of the aluminum foil, the time t 0 is calculated as t 0 = L 1 - D V , and a time distribution function of a pressure of the shock wave is P ⁡ ( t

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Classifications

  • in a liquid, e.g. underwater · CPC title

  • Modifying the physical properties by methods other than heat treatment or deformation · CPC title

  • in combination with arc heating, e.g. tungsten inert gas [TIG], metal inert gas [MIG] or plasma welding · CPC title

  • by shock processing · CPC title

  • C21D10/005Primary

    by laser shock processing · CPC title

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What does patent US10745776B2 cover?
A method and a device for increasing a laser induced shock wave pressure. According to the method, plasmas ( 21 ) are generated by impinging an aluminium foil ( 20 ) using lasers; a high-voltage pulse electrode ( 22 ) discharges to the plasmas ( 21 ) to induce and form a photoelectric combined energy field and then high-temperature plasmas ( 21 ) having the characteristics of an ultra-high dens…
Who is the assignee on this patent?
Univ Jiangsu
What technology area does this patent fall under?
Primary CPC classification C21D10/005. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 18 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).