Method of manufacturing a switch

US10745273B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10745273-B2
Application numberUS-201715627673-A
CountryUS
Kind codeB2
Filing dateJun 20, 2017
Priority dateApr 22, 2008
Publication dateAug 18, 2020
Grant dateAug 18, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

MEMS switches and methods of manufacturing MEMS switches is provided. The MEMS switch having at least two cantilevered electrodes having ends which overlap and which are structured and operable to contact one another upon an application of a voltage by at least one fixed electrode.

First claim

Opening claim text (preview).

It is claimed: 1. A method of forming a switch, comprising: depositing a liner over an uppermost layer of layers of resist; etching the layers of the resist through openings until at least two cantilever electrodes and at least one voltage applying electrode are in a void; sealing the void with additional liner material to form a hermetically sealed dome; sequentially depositing metal or metal alloy within the openings of the resist on a structure until the at least two cantilever electrodes and the at least one voltage applying electrode are formed within the layers of the resist; sequentially depositing the metal or the metal alloy within the openings until at least three cantilever electrodes are formed within the layers of resist, wherein a first of the at least three cantilever electrodes is configured to apply a voltage to move a second of the at least three cantilever electrodes towards a third of the at least three cantilever electrodes, the second and the third cantilever electrodes being formed to be moveable; and forming a vertically extending portion on at least one of the second of the at least three cantilever electrodes and the third of the at least three cantilever electrodes to reduce a travel distance between the second of the at least three cantilever electrodes and the third of the at least three cantilever electrodes. 2. The method of claim 1 , wherein the metal or the metal alloy sequentially deposited comprises Au. 3. The method of claim 1 , wherein the metal or the metal alloy sequentially deposited comprises AlCu. 4. The method of claim 1 , wherein the metal or the metal alloy sequentially deposited comprises W. 5. The method of claim 1 , wherein the metal or the metal alloy sequentially deposited comprises Cu. 6. The method of claim 1 , further comprising forming openings in the liner. 7. The method of claim 6 , wherein the liner is a nitride liner and the openings in the liner are filled with additional nitride. 8. The method of claim 1 , wherein the liner is deposited on a portion of one of the at least two cantilever electrodes thereby fixing the one of the at least two cantilever electrodes to the liner. 9. The method of claim 8 , wherein the one of the at least two cantilever electrodes fixed to the liner is stationary. 10. The method of claim 1 , wherein two cantilever electrodes of the at least two cantilever electrodes overlap with each other. 11. The method of claim 1 , wherein upon application of a voltage to one voltage applying electrode of the at least one voltage applying electrode, two cantilevers of the at least two cantilevers are operable to directly contact each other. 12. The method of claim 11 , wherein the voltage applied to the one voltage applying electrode of the at least one voltage applying electrode is about 100 V. 13. The method of claim 1 , wherein the resist comprises polymethylglutarimide (PMGI). 14. The method of claim 1 , wherein the layers of the resist are etched using N-methylpyrrolidone to create the void. 15. The method of claim 1 , wherein the openings of the resist are lined with at least one refractory metal.

Assignees

Inventors

Classifications

  • making use of micromechanics · CPC title

  • Hermetically sealing an opening in the lid · CPC title

  • Electric connections to or between contacts; Terminals {(for high tension switches H01H33/025; for electromagnetic relays H01H50/14; for circuit breakers H01H71/08)} · CPC title

  • Electrodes · CPC title

  • Electrical characteristics, e.g. by doping materials · CPC title

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What does patent US10745273B2 cover?
MEMS switches and methods of manufacturing MEMS switches is provided. The MEMS switch having at least two cantilevered electrodes having ends which overlap and which are structured and operable to contact one another upon an application of a voltage by at least one fixed electrode.
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification H01H59/0009. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 18 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).