Vascular channel manufacture by deflagration

US10744682B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10744682-B2
Application numberUS-201715829051-A
CountryUS
Kind codeB2
Filing dateDec 1, 2017
Priority dateDec 1, 2017
Publication dateAug 18, 2020
Grant dateAug 18, 2020

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method of forming channels within a substrate includes: (a) molding a sacrificial component directly into the substrate; (b) igniting the sacrificial component to cause a deflagration of the sacrificial component, thereby forming a channel in the substrate; and (c) cleaning the channel in the substrate to remove byproducts of the deflagration of the sacrificial component. The sacrificial component includes a combustible material with a protective shell, and the substrate includes a polymeric material.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming channels within a substrate, comprising: molding a sacrificial component directly into the substrate; igniting the sacrificial component to cause deflagration of the sacrificial component, thereby forming a channel in the substrate; cleaning the channel in the substrate to remove byproducts of the deflagration of the sacrificial component; wherein the molding of the sacrificial component directly into the substrate includes: placing the sacrificial component in a mold; pressurizing a polymeric resin; shooting the polymeric resin into the mold; and curing the polymeric resin. 2. The method of claim 1 , wherein molding the sacrificial component directly into the substrate occurs at a processing temperature, the sacrificial component includes a combustible material, the combustible material has a flash point, the processing temperature is less than the flash point of the combustible material, and the substrate includes a substrate material selected from a group consisting of a polymeric material, a reinforcing fiber, and a metal compound. 3. The method of claim 2 , wherein the combustible material is selected from a group consisting of black powder, pentaerythritol tetranitrate, combustible metals, combustible oxides, thermites, nitrocellulose, pyrocellulose, flash powders, and smokeless powder. 4. The method of claim 3 , wherein the sacrificial component includes a protective shell, and the protective shell includes a braided fibrous material. 5. The method of claim 4 , wherein the braided fibrous material is infused with an infusion material selected from a group consisting of a polymer, wax, oil, and a combination thereof. 6. The method of claim 5 , wherein the polymer is selected from a group consisting of polyimide, polytetrafluoroethylene (PTFE), high-density polyethylene (HDPE), polyphenylene sulfide (PPS), polyphthalamide (PPA), polyamides (PA), polypropylene, nitrocellulose, phenolic, polyester, epoxy, polylactic acid, bismaleimides, silicone, acrylonitrile butadiene styrene, polyethylene, polycarbonate, elastomers, polyurethane, polyvinylidene chloride (PVDC), polyvinyl chloride (PVC), polystyrene (PS), shellac resin, nitrocellulose lacquer, epoxy resin, alkyd, polyurethane, and a combination thereof. 7. The method of claim 1 , wherein the sacrificial component includes a protective shell, and the protective shell includes a polymer casing. 8. The method of claim 1 , further comprising forming the sacrificial component using an additive manufacturing process. 9. The method of claim 8 , wherein the additive manufacturing process is a 3D printing process. 10. The method of claim 9 , wherein the sacrificial component is configured as a network, and the network includes filaments intersecting each other. 11. The method of claim 10 , further comprising coating the sacrificial component with a coat, wherein sacrificial component includes a combustible material, the coat includes a coating material, the coating material has a first modulus of resilience, the combustible material has a second modulus of resilience, and the first modulus of resilience is greater than the second modulus of resilience. 12. The method of claim 11 , wherein coating the sacrificial component with the coat including dipping the sacrificial component in a container holding the coat. 13. The method of claim 12 , further comprising removing the sacrificial component from the container and thereafter curing the coat. 14. A method of forming channels within a substrate, comprising: molding a sacrificial component directly into the substrate; igniting the sacrificial component to cause deflagration of the sacrificial component, thereby forming a channel in the substrate; cleaning the channel in the substrate to remove byproducts of the deflagration of the sacrificial component; wherein the molding of the sacrificial component directly into the substrate includes: placing the sacrificial component in a mold; pouring a metallic material into the mold; and cooling the metallic material to allow the metallic material to solidify. 15. A method of forming channels within a substrate, comprising: 3D printing a sacrificial component, wherein the sacrificial component includes a combustible material, and the combustible material has a flash point; molding the sacrificial component with the substrate such that the sacrificial component is at least partially disposed inside the substrate, wherein the molding occurs at a processing temperature, and the processing temperature is less than the flash point; igniting the sacrificial component to cause a deflagration of the sacrificial component, thereby forming a channel in the substrate; and cleaning the channel in the substrate to remove byproducts of the deflagration of the sacrificial component; and wherein cleaning the channel in the substrate includes introducing a liquid into the channel in the substrate to remove byproducts of the deflagration of the sacrificial component. 16. The method of claim 15 , wherein the molding of the sacrificial component with the substrate includes: placing the sacrificial component in a mold; pouring a metallic material into the mold; and cooling the metallic material. 17. The method of claim 15 , wherein the molding of the sacrificial component with the substrate includes: placing the sacrificial component in a mold; pouring a polymeric resin into the mold; and curing the polymeric resin. 18. The method of claim 15 , wherein cleaning the channel in the substrate includes shooting a gas into the channel in the substrate to remove byproducts of the deflagration of the sacrificial component.

Assignees

Inventors

Classifications

  • B33Y40/20Primary

    Post-treatment, e.g. curing, coating or polishing · CPC title

  • B29C33/448Primary

    destructible (B29C33/52 takes precedence; in particular used in injection moulding B29C45/4457) · CPC title

  • Processes of additive manufacturing · CPC title

  • for making objects with integrated channels · CPC title

  • Thermal after-treatment {(B29C71/0063 and B29C71/0072 take precedence)} · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10744682B2 cover?
A method of forming channels within a substrate includes: (a) molding a sacrificial component directly into the substrate; (b) igniting the sacrificial component to cause a deflagration of the sacrificial component, thereby forming a channel in the substrate; and (c) cleaning the channel in the substrate to remove byproducts of the deflagration of the sacrificial component. The sacrificial comp…
Who is the assignee on this patent?
Gm Global Tech Operations Llc
What technology area does this patent fall under?
Primary CPC classification B33Y40/20. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 18 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).