Temperature triggered switch

Patent metadata

Field	Value
Publication number	US-10740667-B2
Application number	US-201815913535-A
Country	US
Kind code	B2
Filing date	Mar 6, 2018
Priority date	Mar 6, 2018
Publication date	Aug 11, 2020
Grant date	Aug 11, 2020

Abstract

Apparatus, systems, and methods for determining a temperature excursion are provided. In one example, a system can comprise a temperature switch component that experiences a temperature excursion associated with a metal alloy of the temperature switch component and one or more electrodes, wherein the temperature excursion is based on a temperature of the metal alloy exceeding a defined threshold value. Additionally, the system can comprise a radio frequency identification tag component that receives a signal, from an external reader device, utilized to determine that the temperature excursion has occurred based on a parameter change, associated with the temperature excursion, from a first parameter to a second parameter different than the first parameter.

First claim

What is claimed is:

1. An apparatus comprising:
a first electrode disposed on a substrate layer, wherein a first side of the first electrode is adjacent and coupled to a first metal sidewall, wherein a second side of a second electrode is adjacent and coupled to a second metal sidewall, the first metal sidewall facing the second metal sidewall, wherein a first edge of the first electrode is disposed directly on and coupled to the substrate layer, wherein a second edge of the second electrode, a third edge of the first metal sidewall, a fourth edge of the second metal sidewall and a fifth edge of the first electrode are disposed directly on and coupled to a mechanical support having a sixth edge disposed directly on and coupled to the substrate layer, and wherein there is a gap between the first metal sidewall and the second metal sidewall; and
a metal alloy disposed on the mechanical support and within the gap, wherein the metal alloy melts based on a temperature excursion of the metal alloy and the melting causes the metal alloy to contact the first metal sidewall and the second metal sidewall causing an electrical connection between the first metal sidewall and the second metal sidewall.

2. The apparatus of claim 1 , wherein the first metal sidewall within the gap comprises a wetting property to react with the metal alloy.

3. The apparatus of claim 1 , wherein the metal alloy is a solder alloy selected from a group consisting of:
gallium, indium, zinc, gold, copper, bismuth, tin, tin and gold, tin and copper, tin and zinc, or tin, gold, and copper.

4. The apparatus of claim 1 , wherein the metal alloy retracts from a surface within the gap based on a temperature decrease to a temperature lower than the temperature excursion, resulting in a removal of the electrical connection.

5. The apparatus of claim 2 , wherein the first metal sidewall is at a first position relative to the metal alloy, wherein the second metal sidewall is at a second position relative to the metal alloy, the first position being on a first side of the metal alloy and the second position being opposite the first position, and wherein the first metal sidewall and the second metal sidewall comprise a wetting property to facilitate a dispersion of the metal alloy.

6. The apparatus of claim 1 , wherein the temperature excursion comprises a temperature of the metal alloy exceeding a defined value.

7. A method, comprising:
a metal alloy of a device melting and contacting a first electrode and second electrode based on a temperature excursion of the metal alloy, resulting in a contact forming an electrical connection between the first electrode and the second electrode, wherein the first electrode is disposed on a substrate layer, wherein a first side of the first electrode is adjacent and coupled to a first metal sidewall, wherein a second side of the second electrode is adjacent and coupled to a second metal sidewall, the first metal sidewall facing the second metal sidewall, wherein a first edge of the first electrode is disposed directly on and coupled to the substrate layer, wherein a second edge of the second electrode and a third edge of the first electrode are disposed directly on and coupled to a mechanical support having a fourth edge disposed directly on and coupled to the substrate layer; and
transmitting a signal, to an external reader device and utilized to determine that the temperature excursion has occurred, wherein the transmitting is initiated based on a configuration change associated with the electrical connection.

8. The method of claim 7 , wherein a parameter change from a first parameter to a second parameter, different than the first parameter, is prompted by the configuration change.

9. The method of claim 8 , wherein the parameter change comprises a resonant frequency change, associated with a radio frequency identification tag, from a first resonant frequency to a second resonant frequency different than the first resonant frequency.

10. The method of claim 7 , wherein the electrical connection activates a humidity sensor or a temperature sensor coupled to the electrical connection.

11. The method of claim 7 , further comprising:
generating duration data representative of a duration that the temperature excursion has exceeded a defined threshold value.

12. The method of claim 7 , further comprising:
causing the metal alloy to retract based on a temperature decrease to a temperature lower than the temperature excursion, resulting in a termination of the electrical connection.

13. The apparatus of claim 1 , wherein the mechanical support is perpendicular to the substrate layer.

Assignees

• IBM

Inventors

• Hung Li-Wen
• Nah Jae-Woong

Classifications

• Y02B90/20

  Smart grids as enabling technology in buildings sector (smart grids supporting the management or operation of end-user stationary applications in general, or like technologies with no associated climate change mitigation effect Y04S20/00) · CPC title

• Y04S20/14

  Protecting elements, switches, relays or circuit breakers · CPC title

• G01K11/06

  using melting, freezing, or softening · CPC title

• G06K19/07749

  the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title

• G01K1/024 Primary

  for remote indication · CPC title