Electro-optical device, manufacturing method of electro-optical device, and electronic apparatus

Patent metadata

Field	Value
Publication number	US-10739554-B2
Application number	US-201715793290-A
Country	US
Kind code	B2
Filing date	Oct 25, 2017
Priority date	Mar 26, 2015
Publication date	Aug 11, 2020
Grant date	Aug 11, 2020

Abstract

An electro-optical apparatus has an element substrate that is provided with a mirror and a sealing member which seals the mirror, and the sealing member includes a light-transmitting cover which faces the mirror opposite from the element substrate. An infrared cut filter is laminated on the light-transmitting cover.

First claim

What is claimed is:

1. An electro-optical device comprising:
an element substrate;
a mirror that is provided on a first face side of the element substrate;
a driving element that drives the mirror;
a sealing member that has a light-transmitting cover and is provided such that the mirror is positioned between the light-transmitting cover and the element substrate;
an infrared cut filter that is provided on the light-transmitting cover;
a substrate on which the element substrate is mounted, the substrate including an internal metal layer forming a portion of a face of the substrate facing the element substrate, an external metal layer forming a face of the substrate on an opposite side of the substrate from the element substrate, and a relay metal section formed inside a through hole of the substrate and connecting the internal metal layer and the external metal layer, the element substrate being mounted on the internal metal layer; and
a lead terminal that extends outside from the substrate, the lead terminal having a bent section that is bent in a direction in which a leading end section of the lead terminal is away from the substrate.

2. The electro-optical device according to claim 1 ,
wherein the infrared cut filter is formed of a film that is laminated on at least one of a second face of the light-transmitting cover and a third face of the light-transmitting cover, the second face faces the mirror, and the third face is on an opposite side from the second face.

3. The electro-optical device according to claim 1 ,
wherein the lead terminal includes a convex section that protrudes in a direction which intersects with an extension direction of the lead terminal.

4. The electro-optical device according to claim 1 ,
wherein a heat dissipation unit is provided on a face on an opposite side from the element substrate of the substrate.

5. The electro-optical device according to claim 4 ,
wherein the heat dissipation unit is a heat sink on which a heat dissipation fin is provided.

6. The electro-optical device according to claim 1 ,
wherein the sealing member includes a spacer that surrounds a region in which the mirror is formed between the element substrate and the light-transmitting cover,
the element substrate is accommodated inside a concave shaped substrate mounting section which is formed on the substrate, and
a sealing resin that seals around the spacer is provided inside the substrate mounting section.

7. An electronic apparatus provided with the electro-optical device according to claim 1 , comprising:
a light source section which irradiates light from a light source onto the mirror.

8. An electro-optical device comprising:
an element substrate;
a mirror that is provided on a first face side of the element substrate;
a driving element that drives the mirror;
a sealing member that has a light-transmitting cover and is provided such that the mirror is positioned between the light-transmitting cover and the element substrate;
an infrared cut filter that is provided laminated on the entire body of the light-transmitting cover facing the mirror;
a substrate on which the element substrate is mounted; and
a lead terminal that extends outside from the substrate, the lead terminal having a bent section that is bent in a direction in which a leading end section of the lead terminal is away from the substrate.

Assignees

• Seiko Epson Corp

Inventors

• Kondo Manabu

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W70/655

  Fan-out layouts · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W70/68

  Shapes or dispositions thereof · CPC title