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Nitrogen-containing ligands and their use in atomic layer deposition methods
US10738008B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10738008-B2 |
| Application number | US-201916400269-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 1, 2019 |
| Priority date | Oct 29, 2010 |
| Publication date | Aug 11, 2020 |
| Grant date | Aug 11, 2020 |
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- Title
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Abstract
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Methods for deposition of elemental metal films on surfaces using metal coordination complexes comprising nitrogen-containing ligands are provided. Also provided are nitrogen-containing ligands useful in the methods of the invention and metal coordination complexes comprising these ligands.
First claim
Opening claim text (preview).
What is claimed is: 1. An apparatus comprising: a deposition chamber; and a metal coordination complex which has a formula wherein L is one or more neutral, anionic or mixed ligands, and M is a transition metal ion or a boron group ion. 2. The apparatus of claim 1 , wherein L is not hydrogen. 3. The apparatus of claim 1 , wherein L is one or more of halogen, alkyl, amino and methylamino. 4. The apparatus of claim 1 , wherein L is an NNN ligand. 5. The apparatus of claim 1 , wherein the transition metal ion or the boron group ion is selected from the group consisting of aluminum, titanium, tungsten, zirconium, vanadium, niobium, tantalum, chromium, molybdenum, palladium, platinum, rhodium, iridium, silver, gold, hafnium, manganese, ruthenium and copper. 6. The apparatus of claim 1 , wherein the metal coordination complex is in the vapor phase. 7. The apparatus of claim 1 , wherein L is not an NNN ligand.
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Classifications
from metallo-organic compounds · CPC title
- C07D213/38Primary
having only hydrogen or hydrocarbon radicals attached to the substituent nitrogen atom · CPC title
without C-Metal linkages · CPC title
without C-aluminium linkages · CPC title
without C-boron linkages · CPC title
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Frequently asked questions
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- What does patent US10738008B2 cover?
- Methods for deposition of elemental metal films on surfaces using metal coordination complexes comprising nitrogen-containing ligands are provided. Also provided are nitrogen-containing ligands useful in the methods of the invention and metal coordination complexes comprising these ligands.
- Who is the assignee on this patent?
- Applied Materials Inc
- What technology area does this patent fall under?
- Primary CPC classification C07D213/38. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Aug 11 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).