Antibacterial medical implant surface

Patent metadata

Field	Value
Publication number	US-10736997-B2
Application number	US-201815927419-A
Country	US
Kind code	B2
Filing date	Mar 21, 2018
Priority date	Mar 21, 2017
Publication date	Aug 11, 2020
Grant date	Aug 11, 2020

Abstract

Aspects include methods of fabricating antibacterial surfaces for medical implant devices including patterning a photoresist layer on a silicon substrate and etching the silicon to generate a plurality of nanopillars. Aspects also include removing the photoresist layer from the structure and coating the plurality of nanopillars with a biocompatible film. Aspects also include a system for preventing bacterial infection associated with medical implants including a thin silicon film including a plurality of nanopillars.

First claim

What is claimed is:

1. A method of fabricating an antibacterial structure for a medical implant device, the method comprising:
patterning a photoresist layer on a semiconductor substrate;
depositing a metal layer on the structure;
removing the photoresist layer and a portion of the metal layer from the structure to create a patterned metal layer;
etching the substrate under the patterned metal layer to generate a plurality of nanopillars; and
removing the patterned metal layer from the structure.

2. The method according to claim 1 further comprising coating the plurality of nanopillars with a biocompatible film.

3. The method according to claim 2 , wherein the biocompatible film comprises titanium.

4. The method according to claim 2 , wherein the biocompatible film forms a conformal coating.

5. The method according to claim 2 , wherein the biocompatible film comprises a conductive metal.

6. The method according to claim 5 , wherein the biocompatible film comprises platinum, silver, aluminum, nickel, titanium, or alloys thereof.

7. The method according to claim 2 , wherein the biocompatible film comprises aluminum oxide, hydroxyapatite, silicon dioxide, titanium carbide, titanium nitride, titanium dioxide, zirconium dioxide, calcium phosphate, chromium nitride, collagen, chitosan, cellulose or cellulose derivatives, poly-/-lactic acid (PLLA), poly(ε-caprolactone) (PCL), poly(lactide-co-glycolide) (PLGA), poly(ether imide) (PEI), poly(1,3-trimethylene carbonate) (PTMC), poly(styrene sulfonate) (PSS), or combinations thereof.

8. The method according to claim 2 , wherein the biocompatible film comprises nitrides, oxides, metallic oxides, metallic hydroxides, nanoporous inorganic coatings, natural polymers, synthetic polymers, or a combinations thereof.

9. The method according to claim 1 , wherein each of the plurality of nanopillars has a top pillar diameter within a range from about 1 nanometer to about 200 nanometers.

10. The method according to claim 1 , wherein each of the plurality of nanopillars has a bottom pillar diameter within a range from about 1 nanometer to about 1 micrometer.

11. The method according to claim 1 , wherein the plurality of nanopillars has an average height within a range from about 100 nanometers to about 10 micrometers.

12. The method according to claim 1 , wherein the plurality of nanopillars are spaced on the silicon substrate with an average pitch within a range from about 100 nanometers to about 2 micrometers.

13. The method according to claim 1 further comprising generating a thin silicon ribbon comprising the plurality of nanostructures.

14. The method according to claim 13 further comprising applying the thin silicon ribbon to the medical implant device.

15. The method according to claim 13 , wherein the thin silicon ribbon has a thickness of about 1 micron to about 100 microns.

16. The method according to claim 13 , wherein generating the thin silicon ribbon comprises applying a tensile layer to the plurality of nanopillars to cause a fracture in the semiconductor substrate.

17. The method according to claim 16 , wherein generating the thin silicon ribbon further comprises separating the plurality of nanopillars from the semiconductor substrate at the fracture in the semiconductor substrate.

18. The method of claim 13 , wherein the thin silicon ribbon is flexible.

19. The method according to claim 1 , wherein the metal layer comprises a conductive metal selected from the group consisting of gold, silver, platinum, palladium, and copper.

20. A method of fabricating an antibacterial structure for a medical implant device, the method comprising:
patterning a photoresist layer on a semiconductor substrate;
depositing a metal layer on the semiconductor substrate;
removing the photoresist layer and only a portion of the metal layer, leaving another portion of the metal layer on the semiconductor substrate to create a patterned metal layer;
etching, using a metal-assisted chemical etching process, the substrate in areas directly beneath portions of the patterned metal layer, to generate a plurality of nanopillars; and
removing the patterned metal layer from the structure.

Assignees

• IBM

Inventors

• Gifford Stacey M
• Hu Huan
• Kinser Emily R
• Yu Roy R
• Zafar Sufi

Classifications

• B81C1/00206 Primary

  Processes for functionalising a surface, e.g. provide the surface with specific mechanical, chemical or biological properties · CPC title

• A61L27/34

  Macromolecular materials · CPC title

• A61L27/306

  Other specific inorganic materials not covered by A61L27/303 - A61L27/32 · CPC title

• A61L2400/18

  Modification of implant surfaces in order to improve biocompatibility, cell growth, fixation of biomolecules, e.g. plasma treatment · CPC title

• B82B3/0033

  Manufacture or treatment of substrate-free structures, i.e. not connected to any support · CPC title