Power storage device packaging material and method for manufacturing power storage device packaging material

Patent metadata

Field	Value
Publication number	US-10734616-B2
Application number	US-201916267135-A
Country	US
Kind code	B2
Filing date	Feb 4, 2019
Priority date	Aug 5, 2016
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

The present invention relates to a power storage device packaging material. The packaging material includes at least a substrate protective layer, a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer in this order. The substrate protective layer is a cured product of a raw material containing a polyester resin and a polyisocyanate compound, has a glass transition temperature (Tg) of 60 to 140° C., and has a thickness of 1 to 5 μm, with a ratio of the thickness of the substrate protective layer to the thickness of the substrate layer being 35% or less.

First claim

What is claimed is:

1. A power storage device packaging material, comprising at least a substrate protective layer, a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer in this order,
wherein the substrate protective layer is a cured product of a raw material containing a polyester resin and a polyisocyanate compound, has a glass transition temperature (Tg) of 100 to 140° C., and has a thickness of 1 to 5 μm, with a ratio of the thickness of the substrate protective layer to a thickness of the substrate layer being 35% or less.

2. The power storage device packaging material of claim 1 , further comprising an anticorrosion treatment layer on one or both surfaces of the metal foil layer.

3. The power storage device packaging material of claim 1 , wherein the ratio of the thickness of the substrate protective layer to the thickness of the substrate layer is 3.5% or more.

4. The power storage device packaging material of claim 1 , wherein the raw material further contains a filler.

5. The power storage device packaging material of claim 1 , wherein the substrate layer is a polyamide film.

6. A method for manufacturing a power storage device packaging material, the method comprising:
adhering a substrate layer to one surface of a metal foil layer via an adhesive layer;
forming a substrate protective layer on a surface of the substrate layer on the opposite side of the adhesive layer; and
forming a sealant layer on a surface of the metal foil layer on the opposite side of the adhesive layer via a sealant adhesive layer,
wherein the substrate protective layer is a cured product of a raw material containing a polyester resin and a polyisocyanate compound, has a glass transition temperature (Tg) of 100 to 140° C., and has a thickness of 1 to 5 μm, with a ratio of the thickness of the substrate protective layer to a thickness of the substrate layer being 35% or less.

Assignees

• Toppan Printing Co Ltd

Inventors

• Yamazaki Tomohiko
• Suzuta Masayoshi

Classifications

• H01M50/105

  Pouches or flexible bags · CPC title

• H01M50/126

  comprising three or more layers · CPC title

• H01M50/145

  for protecting against corrosion · CPC title

• B32B2310/021

  using electrical effects (B32B2310/08 and B32B2310/12 take precedence) · CPC title

• B32B2307/7246

  Water vapor barrier · CPC title