Thermal pattern sensor with pyroelectric capacitance and hard protective layer

US10734566B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10734566-B2
Application numberUS-201816207653-A
CountryUS
Kind codeB2
Filing dateDec 3, 2018
Priority dateDec 4, 2017
Publication dateAug 4, 2020
Grant dateAug 4, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Thermal pattern sensor comprising several pixels arranged on a substrate, each pixel including at least: a pyroelectric capacitance formed by at least one portion of pyroelectric material arranged between at least one lower electrode and at least one upper electrode, with the lower electrode arranged between the substrate and the portion of pyroelectric material, a dielectric layer such that the upper electrode is arranged between the portion of pyroelectric material and the dielectric layer, a heating element including at least one deposition of electrically conductive particles and such that the dielectric layer is arranged between the upper electrode and the heating element, a protective layer arranged between the dielectric layer and the heating element and including at least one material of which the Shore A hardness is greater than or equal to around 60.

First claim

Opening claim text (preview).

The invention claimed is: 1. Thermal pattern sensor comprising several pixels arranged on a substrate, each pixel including at least: a pyroelectric capacitance formed by at least one portion of pyroelectric material arranged between at least one lower electrode and at least one upper electrode, with the lower electrode arranged between the substrate and the portion of pyroelectric material, a dielectric layer such that the upper electrode is arranged between the portion of pyroelectric material and the dielectric layer, a heating element including at least one deposition of electrically conductive particles and such that the dielectric layer is arranged between the upper electrode and the heating element, a protective layer arranged between the dielectric layer and the heating element and including at least one material of which the Shore A hardness is greater than or equal to around 60. 2. Thermal pattern sensor according to claim 1 , in which the thickness of the protective layer is between around 100 nm and 600 nm. 3. Thermal pattern sensor according to claim 1 , in which the protective layer comprises at least one cross-linkable organic polymer material and/or at least one inorganic material of sol-gel and/or SOG type and/or a ceramic material of sol-gel type. 4. Thermal pattern sensor according to claim 3 , in which the cross-linkable organic polymer material corresponds to one of the following materials: epoxy, polyurethane, acrylic, or in which the SOG corresponds to one of the following materials: PMMSQ, MSQ, polyquinoxaline, or in which the inorganic material of sol-gel type comprises at least one of the following compounds: Al 2 O 3 , TiO 2 , WO 3 , SiO 2 . 5. Thermal pattern sensor according to claim 1 , in which the heating element comprises at least one layer of silver particles. 6. Thermal pattern sensor according to claim 1 , in which the substrate includes at least one plastic material. 7. Thermal pattern sensor according to claim 1 , in which the lower and upper electrodes comprise at least one of the following materials: silver, gold, copper, nickel, carbon, graphene, conductive polymer. 8. Thermal pattern sensor according to claim 1 , in which said thermal pattern sensor is a finger print sensor. 9. Method for producing a thermal pattern sensor comprising several pixels arranged on a substrate, each produced by the implementation of the following steps: producing at least one lower electrode on a substrate; producing at least one portion of pyroelectric material at least on the lower electrode; producing at least one upper electrode on the portion of pyroelectric material; producing at least one dielectric layer at least on the upper electrode; producing at least one protective layer on the dielectric layer; producing at least one heating element on the protective layer; in which the lower electrode, the upper electrode and the portion of pyroelectric material form a pyroelectric capacitance, and in which the protective layer comprises a material of which the Shore A hardness is greater than or equal to around 60. 10. Method according to claim 9 , in which the heating element comprises at least one layer of silver particles formed by a printing deposition. 11. Method according to claim 9 , in which the lower electrode and/or the upper electrode and/or the portion of pyroelectric material are produced by printing depositions. 12. Method according to claim 9 , in which said thermal pattern sensor is a finger print sensor.

Assignees

Inventors

Classifications

  • using capacitors, e.g. pyroelectric capacitors · CPC title

  • H10N19/00Primary

    Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00 · CPC title

  • Protecting the fingerprint sensor against damage caused by the finger · CPC title

  • non-optical, e.g. ultrasonic or capacitive sensing · CPC title

  • Thermoelectric active materials · CPC title

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What does patent US10734566B2 cover?
Thermal pattern sensor comprising several pixels arranged on a substrate, each pixel including at least: a pyroelectric capacitance formed by at least one portion of pyroelectric material arranged between at least one lower electrode and at least one upper electrode, with the lower electrode arranged between the substrate and the portion of pyroelectric material, a dielectric layer such that th…
Who is the assignee on this patent?
Commissariat Energie Atomique
What technology area does this patent fall under?
Primary CPC classification H10N19/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 04 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).