Electronic circuit board, laminated board, and method of manufacturing electronic circuit board

Patent metadata

Field	Value
Publication number	US-10734355-B2
Application number	US-201715851900-A
Country	US
Kind code	B2
Filing date	Dec 22, 2017
Priority date	Jun 25, 2015
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

An electronic circuit board includes: electronic components; a silicon board that is plate shaped, includes a wiring pattern provided on at least one of a surface and a reverse surface thereof, and includes recessed portions where the electronic components are individually mounted; and a supporting board that is layered over the reverse surface of the silicon board, and includes a wiring pattern provided on at least one of a surface and a reverse surface thereof. Side faces of the recessed portions are perpendicular to the surface of the silicon board, the wiring pattern is connected to at least one of the electronic components mounted in the recessed portions, via at least one of a via and a bottom surface electrode provided in of the at least one of the recessed portions, and the recessed portions penetrate through the silicon board.

First claim

What is claimed is:

1. An electronic circuit board, comprising:
a silicon board having a plate shape, the silicon board comprising
a plurality of recessed portions, each of the plurality of recessed portions penetrating completely through the silicon board from a surface to an opposed reversed surface, at least one side face of each of the plurality of recessed portions being perpendicular to the surface of the silicon board;

a plurality of electronic components, an electronic component of the plurality of electronic components being mounted in each of the plurality of recessed portions;
a supporting board layered over the reverse surface of the silicon board;
a sealing resin completely filled in a respective recessed portion of the plurality of recessed portions from the surface to the opposed reverse surface of the silicon board to embed and fix the electronic components in the sealing resin; and
an insulating protective layer that is layered over the surface of the silicon board and a surface of the sealing resin filling each of the plurality of recessed portions;
wherein
an electrically conductive via is formed in each of the plurality of recessed portions, each electrically conductive via being formed through the insulating protective layer and sealing resin to electrically connect each of the plurality of electronic components to a wiring pattern formed on the insulating protective layer.

2. The electronic circuit board according to claim 1 , wherein at least one of the plurality of recessed portions comprises:
a first recessed portion provided on the surface of the silicon board includes a tapered side face such that the first recessed portion is reduced in diameter from an opening side of the first recessed portion; and
a second recessed portion including the at least one side face perpendicular to the surface of the silicon board.

3. The electronic circuit board according to claim 1 , wherein an additional insulating protective layer is provided on an inner wall face of at least one of the plurality of recessed portions.

4. The electronic circuit board according to claim 1 , wherein the silicon board includes a semiconductor circuit.

5. A laminated board, comprising:
the electronic circuit board according to claim 1 layered therein.

6. A method of manufacturing the electronic circuit board according to claim 1 , the method comprising:
forming, by etching the silicon board, the plurality of recessed portions in the silicon board, the plurality of recessed portions including at least one side face perpendicular to the surface of the silicon board;
arranging the electronic component of the plurality of electronic components in the respective ones of the plurality of recessed portions; and
embedding and fixing the plurality of electronic components in respective ones of the plurality of recessed portions with the sealing resin.

7. The method of manufacturing the electronic circuit board according to claim 6 , wherein the forming comprises:
forming a first recessed portion on the surface of the silicon board, the first recessed portion including a tapered side face such that the first recessed portion is reduced in diameter from an opening side of the first recessed portion; and
forming a second recessed portion including the at least one side face perpendicular to the surface of the silicon board.

8. The method of manufacturing the electronic circuit board according to claim 7 , wherein in the arranging, after the plurality of electronic components are mounted on the silicon board, vibrating the silicon board to drop the plurality of electronic components into a respective one of the plurality of recessed portions.

Assignees

• Olympus Corp

Inventors

• Suyama Takuro

Classifications

• H10P50/242

  of Group IV materials · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W70/614

  the multiple chips being integrally enclosed · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title