Adhesive bonding composition and method of use

Patent metadata

Field	Value
Publication number	US-10734353-B2
Application number	US-201916515754-A
Country	US
Kind code	B2
Filing date	Jul 18, 2019
Priority date	Jun 30, 2014
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition.

First claim

The invention claimed is:

1. A method of adhesive bonding comprising:
a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly, wherein said polymerizable adhesive composition includes an organic vehicle comprising in part a monomer forming a thermoset resin;
b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one X-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition, wherein the sulfur-containing compound comprises at least one member selected from the group consisting of CaS, ZnSeS, and iron sulfate; and
c) adhesively joining two or more components together by way of the polymerizable adhesive composition.

2. The method of claim 1 , wherein irradiating comprises severing bonds in the adhesive composition to promote said vulcanization.

3. The method of claim 1 , wherein said thermoset resin is selected from the group consisting of acrylics, phenolics, urethanes, epoxies, styrenes, and silicones.

4. The method of claim 1 , wherein said polymerizable adhesive composition includes at least one photoinitiator selected from the group consisting of benzoin ethers, benzil ketals, α-dialkoxyacetophenones, α-aminoalkylphenones, acylphosphine oxides, benzophenones/amines, thioxanthones/amines, and titanocenes.

5. The method of claim 1 , wherein said polymerizable adhesive composition further comprises inorganic particulates selected from the group consisting of metals and metal alloys, ceramics and dielectrics, and metal-coated polymers.

6. The method of claim 1 , wherein said polymerizable adhesive composition further comprises an organic component selected from the group consisting of solvents, viscosity modifiers, surfactants, dispersants, and plasticizers.

7. The method of claim 1 , wherein the surface of the element to be bonded comprises at least one member selected from the group consisting of a polytetrafluoroethylene, a poly(perfluoroalkylacrylate), a polystyrene, a polyacrylate, a poly(methyl methacrylate), a poly(dimethylsiloxane), a polyethylene, a polychlorotrifluoroethylene, a polypropylene, a polyvinyl chloride, a polyvinyl fluoride, a polyvinylidenedichloride, a polyvinylidenedifluoride, a polyacrylamide, a polyethylene terephthalate, a poly(6-aminocoproicacid), and a poly(11-aminoundecaroicacid).

8. The method of claim 1 , wherein the surface of the element to be bonded comprises at least one member selected from the group consisting of a silicone and a poly (dimethyl siloxane).

9. The method of claim 1 , wherein irradiating comprises irradiating at least one energy converting material in the polymerizable adhesive composition.

10. The method of claim 9 , wherein said at least one energy converting material is a downconverting material.

11. The method of claim 10 , wherein said downconverting material comprises inorganic particulates selected from the group consisting of metal oxides; metal sulfides; doped metal oxides; and mixed metal chalcogenides.

12. The method of claim 10 , wherein said downconverting material comprises at least one member selected from the group consisting of Y 2 O 3 , Y 2 O 2 S, NaYF 4 , NaYbF 4 , YAG, YAP, Nd 2 O 3 , LaF 3 , LaCl 3 , La 2 O 3 , TiO 2 , LuPO 4 , YVO 4 , YbF 3 , YF 3 , Na-doped YbF 3 , ZnS; ZnSe; MgS; CaS; ZnSeS y ; ZnSe x S y :Cu, Ag, Ce, Tb; alkali lead silicate including compositions of SiO 2 , B 2 O 3 , Na 2 O, K 2 O, PbO, MgO, and Ag, and combinations, alloys, and layers thereof.

13. The method of claim 10 , wherein the downconverting material comprises a dopant including at least one member selected from the group consisting of Er, Eu, Yb, Tm, Nd, Mn Tb, Ce, Y, U, Pr, La, Gd and other rare-earth species and combinations thereof.

14. The method of claim 9 , wherein said at least one energy converting material further comprises an upconverting material.

15. The method of claim 14 , wherein said upconverting material comprises at least one member selected from the group consisting of Y 2 O 3 , Y 2 O 2 S, NaYF 4 , NaYbF 4 , YAG, YAP, Nd 2 O 3 , LaF 3 , LaCl 3 , La 2 O 3 , TiO 2 , LuPO 4 , YVO 4 , YbF 3 , YF 3 , Na-doped YbF 3 , SiO 2 and alloys thereof.

16. The method of claim 1 , wherein providing a polymerizable adhesive composition comprises:
providing a solution containing natural or synthetic rubber compounds on said surface of the element to be bonded;
removing said solvent;
polymerizing said rubber compounds.

17. The method of claim 16 , wherein the polymerization comprises exposing the rubber compounds to at least one member selected from the group consisting of x-rays, e-beam, and UV flux.

18. The method of claim 17 , wherein the exposing produces breakage of double bonds in the rubber compounds followed by bonding of the rubber compounds to the surface of the element to be bonded.

19. A method of adhesive bonding comprising:
a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly;
b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one member selected from the group consisting of x-ray, e-beam, visible, and infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and
c) adhesively joining two or more components together by way of the polymerizable adhesive composition;
wherein the surface of the element to be bonded comprises at least one member selected from the group consisting of a polytetrafluoroethylene, a poly(perfluoroalkylacrylate), a polystyrene, a polyacrylate, a poly(methyl methacrylate), a silicone, a poly(dimethylsiloxane), a polyethylene, a polychlorotrifluoroethylene, a polypropylene, a polyvinyl chloride, a polyvinyl fluoride, a polyvinylidenedichloride, a polyvinylidenedifluoride, a polyacrylamide, a polyethylene terephthalate, a poly(6-aminocoproicacid), and a poly(11-aminoundecaroicacid).

20. The method of claim 19 , wherein irradiating comprises severing bonds in the adhesive composition to promote said vulcanization.

21. The method of claim 19 , wherein the sulfur-containing compound comprises at least one member selected from the group consisting of CaS, ZnSeS, and iron sulfate.

22. The method of claim 19 , wherein said polymerizable adhesive composition includes at least one photoinitiator selected from the group consisting of benzoin ethers, benzil ketals, α-dialkoxyacetophenones, α-aminoalkylphenones, acylphosphine oxides, benzophenones/amines, thioxanthones/amines, and titanocenes.

23. The method of claim 19 , wherein said polymerizable adhesive composition further comprises inorganic particulates selected from the group consisting of: metals and metal alloys, ceramics and dielectrics, and metal-coated polymers.

24. The method of claim 19 , wherein said polymerizable adhesive composition further comprises an organic component selected from the group consisting of: solvents, viscosity modifiers, surfactants, dispersants, and plasticizers.

25. The method of claim 19 , wherein the surface of the element to be bonded comprises at least one member selected from the group consisting of a polytetrafluoroethylene, a poly(perfluoroalkylacrylate

Assignees

• Immunolight Llc

Inventors

• Fathi Zakaryae
• Bourke Jr Frederic A
• Walder Harold

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/07311

  Treating the bonding area before connecting, e.g. by applying flux or cleaning · CPC title