Electronic component mounting apparatus

Patent metadata

Field	Value
Publication number	US-10734259-B2
Application number	US-201616462536-A
Country	US
Kind code	B2
Filing date	Nov 21, 2016
Priority date	Nov 21, 2016
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

A flip-chip bonding apparatus ( 100 ) is provided with: a bonding tool ( 10 ) that includes a base ( 11 ), and an island ( 13 ) that vacuum-sucks, to a surface ( 14 ) thereof, a semiconductor die ( 70 ) having protruding electrodes ( 72, 73 ) that are disposed on both the surfaces; and a heater ( 20 ) that heats the semiconductor die ( 70 ) vacuum-sucked to the island ( 13 ). The flip-chip bonding apparatus heats the semiconductor die ( 70 ), bonds the protruding electrodes ( 73 ) of the semiconductor die ( 70 ) to protruding electrodes ( 82 ) of a semiconductor die ( 80 ), and seals, using a non-conductive film (NCF) ( 75 ), a gap between the semiconductor die ( 70 ) and the semiconductor die ( 80 ). Continuous vacuum suction holes ( 15 ) are provided in the base ( 11 ), said continuously vacuum suction holes being at positions adjacent to the outer peripheral surface of the island ( 13 ).

First claim

The invention claimed is:

1. An electronic component mounting apparatus, comprising:
a bonding tool including a base and an island that protrudes from the base and sucks a semiconductor die having protruding electrodes disposed on both surfaces of the semiconductor die onto a surface of the island with a vacuum; and
a heater that is disposed on a base side of the bonding tool and heats the semiconductor die that is sucked to the island with a vacuum,
wherein the electronic component mounting apparatus heats the semiconductor die, bonds the protruding electrodes of the surface of the semiconductor die opposite to the island to a substrate or other electrodes of another semiconductor die, and seals a gap between the surface of the semiconductor die opposite to the island and a surface of the substrate or the another semiconductor die using a resin, and
wherein a plurality of continuous vacuum suction holes are provided at positions adjacent to an outer peripheral surface of the island of the base.

2. The electronic component mounting apparatus according to claim 1 , wherein a plurality of types of bonding tools having different total areas of the continuous vacuum suction holes are able to be attached to the electronic component mounting apparatus in accordance with a height of the protruding electrodes on the surface of the semiconductor die on the island side.

3. The electronic component mounting apparatus according to claim 2 , wherein, when the height of the protruding electrodes of the surface of the semiconductor die on the island side is large, a bonding tool having a larger total area of the continuous vacuum suction holes is able to be attached to the electronic component mounting apparatus than when the height of the protruding electrodes of the surface of the semiconductor die on the island side is small.

4. The electronic component mounting apparatus according to claim 1 , wherein a diameter of each continuous vacuum suction hole is substantially equal to a height of the island.

5. The electronic component mounting apparatus according to claim 1 , wherein each continuous vacuum suction hole is rectangular, oval, or elliptical, and a width of a short side of each continuous vacuum suction hole is substantially equal to a height of the island.

6. The electronic component mounting apparatus according to claim 1 , wherein other continuous vacuum suction holes communicating with the continuous vacuum suction holes provided in the base are provided in the heater, a cooling pipe that cools a gas sucked from the continuous vacuum suction holes to condense or solidify the gas is connected to the other continuous vacuum suction holes, and a recovery container that stores a liquid or a solid condensing or solidifying in the cooling pipe is connected to the cooling pipe.

Assignees

• Shinkawa Kk

Inventors

• Nagai Satoru
• Takayama Shin
• Kobayashi Midori

Classifications

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10W90/00

  Package configurations · CPC title