Underfill solution supplying device for a dispenser, dispenser including the same, and method of manufacturing a semiconductor module using the same

Patent metadata

Field	Value
Publication number	US-10734258-B2
Application number	US-201816181570-A
Country	US
Kind code	B2
Filing date	Nov 6, 2018
Priority date	Jan 22, 2018
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

A dispenser includes a syringe container having a first end and a second end, the syringe container having a length direction extending between the first end and the second end, a plunger movable within the syringe container along the length direction of the syringe container and configured to be positioned on a surface of an underfill solution to be received within the syringe container at a first region between the plunger and the second end, a cap attached airtightly to the first end of the syringe container, a first gas supply line configured to supply a first gas into the syringe container through the cap, and a second gas supply line extending from the cap to the plunger, the second gas supply line being in fluid communication with the first region and configured to supply a second gas into the underfill solution to be received within the syringe container at the first region through a through hole of the plunger.

First claim

What is claimed is:

1. A dispenser, comprising:
a syringe container having a first end and a second end, the syringe container having a length direction extending between the first end and the second end;
a plunger movable within the syringe container along the length direction of the syringe container and configured to be positioned on a surface of an underfill solution to be received within the syringe container at a first region between the plunger and the second end;
a cap attached airtightly to the first end of the syringe container;
a first gas supply line configured to supply a first gas into the syringe container through the cap; and
a second gas supply line extending from the cap to the plunger, the second gas supply line being in fluid communication with the first region and configured to supply a second gas into the underfill solution to be received within the syringe container at the first region through a through hole of the plunger.

2. The dispenser of claim 1 , wherein the first gas supply line extends into the syringe container through a first through hole of the cap.

3. The dispenser of claim 1 , wherein the second gas supply line extends into the syringe container through a second through hole of the cap.

4. The dispenser of claim 3 , wherein the second gas supply line is engaged with the through hole of the plunger.

5. The dispenser of claim 4 , wherein the second gas supply line extends through the through hole of the plunger.

6. The dispenser of claim 1 , wherein the plunger comprises:
a cylindrical outer body engaged airtightly with an inner wall of the syringe container;
a plate provided in a lower portion of the cylindrical outer body, the plate configured to pressurize the underfill solution; and
a gas supply guide extending upwardly from the plate and having the through hole therein.

7. The dispenser of claim 6 , wherein the plate and the cylindrical outer body forms a recess which is configured to receive the first gas.

8. The dispenser of claim 1 , further comprising a fluid supply line connected to an injection hole, the injection hole formed at the second end, the fluid supply line configured to supply the underfill solution to a pump of the dispenser.

9. The dispenser of claim 1 , further comprising a check valve installed in the first gas supply line, the check valve configured to control a flow of the first gas.

10. The dispenser of claim 1 , further comprising a solenoid valve installed in the second gas supply line, the solenoid valve configured to control a flow of the second gas.

11. The dispenser of claim 1 , further comprising:
an injection hole formed in the second end of the syringe container; and
a fluid supply line connected to the injection hole to supply the underfill solution from the syringe container to a pumping device.

12. A dispenser, comprising:
a syringe container configured to receive an underfill solution;
a plunger movable within the syringe container along a length direction of the syringe container and configured to pressurize the underfill solution to be received within the syringe container at a first region;
a cap attached airtightly to a first end of the syringe container; and
a first gas supply line extending to the plunger through the cap, the first gas supply line being in fluid communication with the first region and configured to supply a first gas for bubble formation into the underfill solution to be received within the syringe container at the first region through a through hole of the plunger.

13. The dispenser of claim 12 , wherein the first gas supply line extends into the syringe container through a through hole of the cap.

14. The dispenser of claim 12 , further comprising a second gas supply line extending into the syringe container through the cap and configured to supply a second gas for plunger pressurization.

15. The dispenser of claim 14 , further comprises:
an injection hole formed in a second end of the syringe container, the syringe container having a length direction extending between the first end and the second end; and
a fluid supply line connected to the injection hole to supply the underfill solution from the syringe container to a pumping device.

16. The dispenser of claim 12 , wherein the plunger comprises
a cylindrical outer body engaged airtightly with an inner wall of the syringe container;
a plate provided in a lower portion of the cylindrical outer body to pressurize the underfill solution; and
a gas supply guide extending upwardly from the plate and having the through hole of the plunger.

17. The dispenser of claim 12 , further comprising a fluid supply line connected to a hole of the syringe container, the hole formed at a second end of the syringe container opposite to the first end of the syringe container, the fluid supply line configured to supply the underfill solution to a pump of the dispenser, wherein the pump is configured to dispense the underfill solution outside the dispenser through a dispenser nozzle.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Han Seong-Chan
• Lee Young-rock
• Kim Han-Ju
• Han Hun

Classifications

• H10W72/072

  of bump connectors · CPC title

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10W72/07236

  Soldering or alloying · CPC title