Electronic component and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10734141-B2
Application number	US-201916298394-A
Country	US
Kind code	B2
Filing date	Mar 11, 2019
Priority date	Sep 17, 2018
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

First claim

What is claimed is:

1. An electronic component comprising:
a substrate;
a conductor pattern portion disposed on the substrate and extending in a first direction;
a first electrode pattern and a second electrode pattern disposed at opposite ends of the conductor pattern portion in the first direction, respectively, and disposed on the conductor pattern portion;
at least one dummy conductor pattern spaced apart from the conductor pattern portion and disposed on the substrate; and
at least one dummy electrode pattern spaced apart from the first electrode pattern and the second electrode pattern and disposed on the at least one dummy conductor pattern,
wherein a width, in a second direction different from the first direction, of the first electrode pattern is substantially the same as a width, in the second direction different from the first direction, of a portion of the conductor pattern portion in contact with the first electrode pattern, and
a width, in the second direction different from the first direction, of the second electrode pattern is substantially the same as a width, in the second direction different from the first direction, of a portion of the conductor pattern portion in contact with the second electrode pattern.

2. The electronic component of claim 1 , wherein the at least one dummy conductor pattern includes:
a first dummy conductor pattern disposed on one side of the conductor pattern in the second direction; and
a second dummy conductor pattern disposed on the other side of the conductor pattern portion in the second direction.

3. The electronic component of claim 2 , wherein the at least one dummy electrode pattern includes:
a first dummy electrode pattern disposed on one side of the first electrode pattern in the second direction and disposed on the first dummy conductor pattern;
a second dummy electrode pattern disposed on the other side of the first electrode pattern in the second direction and disposed on the second dummy conductor pattern;
a third dummy electrode pattern disposed on one side of the second electrode pattern in the second direction and disposed on the first dummy conductor pattern; and
a fourth dummy electrode pattern disposed on the other side of the second electrode pattern in the second direction and disposed on the second dummy conductor pattern.

4. The electronic component of claim 1 , further comprising a protective film disposed on the conductor pattern portion and having substantially the same width as a width of the conductor pattern portion.

5. The electronic component of claim 4 , wherein the conductor pattern portion is a resistance portion including at least one pattern groove, and
the protective film includes the same pattern groove as the at least one pattern groove disposed in the conductor pattern portion.

6. The electronic component of claim 1 , further comprising at least one open pattern extending from one side surface of the conductor pattern to the at least one dummy conductor pattern and disconnecting the conductor pattern from the at least one dummy electrode pattern.

7. A manufacturing method of an electronic component, the manufacturing method comprising:
forming a conductor film extending from one edge to another edge of a substrate in a second direction of the substrate;
forming at least one paste portion extending from one edge to another edge of the conductor film in the second direction;
forming an electrode film extending, in the second direction, from the one edge to the another edge of the conductor film on the substrate on which the conductor film and the at least one paste portion are formed; and
forming a plurality of primary electrode patterns by removing the at least one paste portion,
wherein the plurality of primary electrode patterns are spaced apart from each other in a first direction of the substrate crossing the second direction.

8. The manufacturing method of claim 7 , wherein the at least one paste portion is formed by a printing method, and
the conductor film and the electrode film are formed by a film sputtering method.

9. The manufacturing method of claim 7 , further comprising forming a conductor pattern portion extending in the first direction by forming a groove extending in the first direction, at least one dummy conductor pattern spaced apart from the conductor pattern portion, a first electrode pattern and a second electrode pattern disposed at opposite ends of the conductor pattern in the first direction, respectively, and at least one dummy electrode pattern spaced apart from the first electrode pattern and the second electrode pattern.

10. The manufacturing method of claim 9 , further comprising forming an open pattern extending from one side surface of the conductor pattern portion to the at least one dummy conductor pattern and disconnecting the conductor pattern from the at least one dummy electrode pattern.

11. The manufacturing method of claim 7 , further comprising:
forming a first protective film on portions of the conductor film on which the plurality of primary electrode patterns are not formed; and
forming a conductor pattern portion extending in the second direction by forming a groove extending in the first after forming the first protective film, at least one dummy conductor pattern spaced apart from the conductor pattern portion, a first electrode pattern and a second electrode pattern disposed at opposite ends of the conductor pattern in the first direction, respectively, and at least one dummy electrode pattern spaced apart from the first electrode pattern and the second electrode pattern.

12. The manufacturing method of claim 11 , further comprising forming at least one pattern groove in the conductor pattern portion.

13. The manufacturing method of claim 12 , further comprising forming a secondary protective film on the primary protective film and a surface of the pattern groove.

14. A manufacturing method of an electronic component, the manufacturing method comprising:
forming a conductor film on a substrate;
forming at least one paste portion extending in a second direction on the substrate on which the conductor film is formed;
after forming the at least one paste portion, forming an electrode film to cover the conductor film and the at least one paste portion; and
forming a plurality of primary electrode patterns, by removing the at least one paste portion and a portion of the electrode film covering the at least one paste portion.

15. The manufacturing method of claim 14 , wherein the at least one paste portion is formed by a printing method, and
the conductor film and the electrode film are formed by a film sputtering method.

16. The manufacturing method of claim 14 , further comprising forming a conductor pattern portion extending in a first direction by forming a groove extending in the first direction different from the second direction, at least one dummy conductor pattern spaced apart from the conductor pattern portion, a first electrode pattern and a second electrode pattern disposed at opposite ends of the conductor pattern in the first direction, respectively, and at least one dummy electrode pattern spaced apart from the first electrode pattern and the second electrode pattern.

17. The manufacturing method of claim 16 , further comprising forming an open pattern extending from one side surface of the conductor pattern portion to the at least one dummy conductor pattern and disconnecting the conductor pattern from the at least one dummy electrode pattern.

18. The manufacturing method of claim 14

Assignees

• Samsung Electro Mech

Inventors

• Lee Jong Pil
• Yoo Doo Ho
• Kim Hyung Gon
• Kim Jung Il
• Choi Hyun Jun
• Roh Hyung Seok

Classifications

• H01C17/28

  adapted for applying terminals · CPC title

• H01C17/065 Primary

  by thick film techniques, e.g. serigraphy · CPC title

• H01C7/003

  Thick film resistors · CPC title

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• H01C3/12

  lying in one plane · CPC title