High-frequency module

Patent metadata

Field	Value
Publication number	US-10732367-B2
Application number	US-201816199456-A
Country	US
Kind code	B2
Filing date	Nov 26, 2018
Priority date	Jan 16, 2018
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

A high-frequency module includes a first board on which an electronic device is mounted, a second board on which at least wiring is formed, and a radio-wave absorber disposed between the first board and the second board. Multiple slits are formed in the radio-wave absorber.

First claim

What is claimed is:

1. A high-frequency module, comprising:
a first board including an upper surface and a lower surface, an electronic device being mounted on the upper surface of the first board;
a second board including an upper surface on which at least wiring is formed; and
a radio-wave absorber disposed between the lower surface of the first board and the upper surface of the second board,
wherein the radio-wave absorber includes multiple slits formed therein.

2. The high-frequency module as claimed in claim 1 , wherein
the electronic device is configured to operate at a predetermined frequency; and
the slits are arranged at a pitch greater than or equal to 0.16λ and less than or equal to 0.41λ, where λ indicates a wavelength of the predetermined frequency.

3. The high-frequency module as claimed in claim 1 , further comprising:
a light emitter and a light receiver disposed on the upper surface of the first board;
a driving circuit disposed on the upper surface of the first board and configured to drive the light emitter; and
a conversion circuit disposed on the upper surface of the first board and configured to convert an electric current output from the light receiver into a voltage;
wherein the radio-wave absorber is disposed in an area corresponding to an area on the first board where at least one of the light emitter, the light receiver, the driving circuit, and the conversion circuit is mounted.

Assignees

• Fujitsu Component Ltd

Inventors

• Kurashima Shigemi
• Kanda Mitsuki
• Yagisawa Takatoshi
• Yanagi Masahiro

Classifications

• H05K9/0058 Primary

  specially adapted for optoelectronic applications · CPC title

• H01Q17/008

  with a particular shape (H01Q17/007 takes precedence) · CPC title

• H01Q17/004

  using non-directional dissipative particles, e.g. ferrite powders (H01Q17/005 takes precedence; flake-like H01Q17/002) · CPC title

• G02B6/4292 Primary

  the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

• G02B6/4277

  Protection against electromagnetic interference [EMI], e.g. shielding means (shielding of electric apparatus H05K9/00, of instruments G12B17/00) · CPC title