Positioning and fixing device

Patent metadata

Field	Value
Publication number	US-10732220-B2
Application number	US-201715428062-A
Country	US
Kind code	B2
Filing date	Feb 8, 2017
Priority date	Aug 13, 2014
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

Provided is a prober capable of suppressing the increase in installation area and the increase in device cost, and also improving the throughput, while maintaining the accuracy of the moving position of an alignment device shared by each of measuring units. The prober includes: a plurality of measuring units, each of which has a probe card electrically connected to a test head; a wafer chuck that holds a wafer in which a plurality of chips are formed; an alignment device which performs relative alignment between the probe card and the wafer held by the wafer chuck; a moving device which moves the alignment device among the measuring units; and a positioning and fixing device which is provided for every of the measuring units, and positions and fixes the alignment device which is moved to each of the measuring units.

First claim

What is claimed is:

1. A positioning and fixing device which positions and fixes an alignment device, the alignment device being configured to be movable along guide rails among a plurality of measuring units and being configured to perform relative alignment between a measurement target and each of the plurality of measuring units, the positioning and fixing device comprising
a plurality of positioning and fixing units respectively provided for the plurality of measuring units, each of the positioning and fixing units being configured to position and fix in a horizontal direction and a vertical direction, a base of the alignment device which is moved to each of the plurality of measuring units, wherein
the plurality of positioning and fixing units includes a plurality of engaging members provided for each measuring unit and configured to define and fix a position of the base of the alignment device in the horizontal direction and the vertical direction, and
the base of the alignment device includes a plurality of engaged members to be mechanically engaged with the plurality of engaging members, the plurality of engaging members being provided at positions other than the guide rails.

2. The positioning and fixing device according to claim 1 , wherein each of the positioning and fixing units includes a clamp mechanism which is configured to position at least three places of the base of the alignment device, and is configured to grip and fix the base of the alignment device attachably and detachably.

3. The positioning and fixing device according to claim 1 , wherein each of the positioning and fixing units includes a positioning unit configured to position at least three places of the base of the alignment device.

4. The positioning and fixing device according to claim 3 , wherein each of the positioning and fixing units includes a holding unit which is provided separately from the positioning unit and is configured to attachably and detachably hold the base of the alignment device at one or more places.

5. The positioning and fixing device according to claim 1 , wherein each of the positioning and fixing units includes a height adjusting unit configured to adjust a horizontal direction of the base of the alignment device.

Assignees

• Tokyo Seimitsu Co Ltd

Inventors

• Tamura Hiroo
• Tomotaki Katsura
• Yokoyama Yoshiyuki
• Yoshimochi Tomohiro
• Takatori Masami

Classifications

• G01R1/0491

  for testing integrated circuits on wafers, e.g. wafer-level test cartridge · CPC title

• G01R31/2865

  Holding devices, e.g. chucks; Handlers or transport devices (having contacts G01R31/2863) · CPC title

• G01R31/2891 Primary

  related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05) · CPC title