Heat-exchanging mold assemblies for infiltrated downhole tools

US10730106B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10730106-B2
Application numberUS-201815922683-A
CountryUS
Kind codeB2
Filing dateMar 15, 2018
Priority dateDec 2, 2014
Publication dateAug 4, 2020
Grant dateAug 4, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An example system for fabricating an infiltrated downhole tool includes a mold assembly having one or more component parts and defining an infiltration chamber to receive and contain matrix reinforcement materials and a binder material used to form the infiltrated downhole tool. One or more thermal conduits are positioned within the one or more component parts for circulating a thermal fluid through at least one of the one or more component parts and thereby placing the thermal fluid in thermal communication with the infiltration chamber.

First claim

Opening claim text (preview).

What is claimed is: 1. A method, comprising: circulating a thermal fluid through one or more thermal conduits positioned within one or more component parts of a mold assembly, the mold assembly defining an infiltration chamber; selectively placing the thermal fluid in thermal communication with contents disposed within the infiltration chamber as the thermal fluid circulates through the one or more thermal conduits; and regulating a thermal profile of the mold assembly with the thermal fluid, wherein the mold assembly includes a metal mandrel positioned within the infiltration chamber, the method further comprising retarding heat transfer between the metal mandrel and the one or more thermal conduits with insulation materials interposing the metal mandrel and the one or more thermal conduits. 2. The method of claim 1 , wherein the contents include matrix reinforcement materials and a binder material, and wherein selectively placing the thermal fluid in thermal communication with contents comprises heating the matrix reinforcement materials and the binder material and thereby assisting infiltration of the binder material into the matrix reinforcement materials. 3. The method of claim 1 , wherein the contents disposed within the infiltration chamber are molten contents and regulating the thermal profile of the mold assembly with the thermal fluid comprises selectively cooling portions of the molten contents with the thermal fluid and thereby facilitating directional solidification of the molten contents. 4. The method of claim 3 , wherein selectively cooling portions of the molten contents with the thermal fluid comprises generating a thermal gradient along an axial height of at least a portion of the mold assembly with the thermal fluid.

Assignees

Inventors

Classifications

  • Aspects linked to processes or compositions used in powder metallurgy · CPC title

  • of composite workpieces or articles from parts, e.g. to form tipped tools {(B22F7/002 takes precedence)} · CPC title

  • of moulds · CPC title

  • for manufacturing or repairing tools · CPC title

  • Cores; Manufacture or installation of cores {(breaker cores B22C9/084)} · CPC title

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What does patent US10730106B2 cover?
An example system for fabricating an infiltrated downhole tool includes a mold assembly having one or more component parts and defining an infiltration chamber to receive and contain matrix reinforcement materials and a binder material used to form the infiltrated downhole tool. One or more thermal conduits are positioned within the one or more component parts for circulating a thermal fluid th…
Who is the assignee on this patent?
Halliburton Energy Services Inc
What technology area does this patent fall under?
Primary CPC classification B22D27/045. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 04 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).