Methods and apparatus for making elastic laminates

Patent metadata

Field	Value
Publication number	US-10729593-B2
Application number	US-201514974205-A
Country	US
Kind code	B2
Filing date	Dec 18, 2015
Priority date	Nov 27, 2012
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

Methods and apparatuses provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to elastic material positioned on an advancing substrate, wherein the elastic material may be in various forms.

First claim

What is claimed is:

1. A method for applying adhesive discharged from a slot die applicator to a substrate and an elastic material, the slot die applicator including a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip; wherein the substrate has a first surface disposed opposite of a second surface and an unconstrained caliper, Hs, and wherein the elastic material has a maximum thickness, Et, the method comprising the steps of:
stretching the elastic material;
positioning the elastic material on the second surface of the substrate;
engaging the substrate with a substrate carrier, the substrate carrier comprising: a non-compliant support surface and a pattern element, the pattern element including a pattern surface, the substrate carrier positioned adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip of the slot die applicator that is less than the sum of the unconstrained caliper, Hs, of the substrate and the maximum thickness, Et, of the elastic material;
intermittently deflecting a first portion of the pattern surface toward the non-compliant support surface by advancing the substrate and the elastic material between the pattern element and the first lip, the slot opening, and the second lip of the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; and
discharging adhesive from the slot opening of the slot die applicator onto the elastic material.

2. The method of claim 1 , wherein the pattern element extends away from the non-compliant support surface to define a first minimum distance, R1, between the pattern surface and the non-compliant support surface, and wherein the step of intermittently deflecting further comprises defining a second minimum distance, R2, between the pattern surface and the non-compliant surface, wherein R2 is less than R1.

3. The method of claim 2 , further comprising the step of: intermittently deflecting a second portion of the pattern surface toward the non-compliant support surface such to define a third minimum distance, R3, between the pattern surface and the non-compliant surface, wherein R3 is less than R1, and wherein R3 is greater than R2, by advancing the substrate between the pattern element and the first lip, the slot opening, and the second lip of the slot die applicator while the first surface of the substrate is disposed on the substrate carrier.

4. The method of claim 1 , wherein the minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip of the slot die applicator is less than the unconstrained caliper, Hs, of the substrate.

5. The method of claim 1 , wherein the substrate carrier comprises a roller.

6. The method of claim 1 , wherein the elastic material comprises an elastic strand.

7. The method of claim 1 , wherein the elastic material comprises an elastic ribbon.

8. The method of claim 1 , wherein the substrate comprises a nonwoven.

9. The method of claim 1 , wherein the substrate comprises a nonwoven layer and a film layer.

10. A method for applying adhesive discharged from a slot die applicator to a substrate and an elastic material, the slot die applicator including a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip of the slot die applicator; wherein the substrate has a first surface disposed opposite of a second surface and an unconstrained caliper, Hs, and wherein the elastic material has a maximum thickness, Et, the method comprising the steps of:
stretching the elastic material;
engaging the substrate with a substrate carrier, the substrate carrier comprising: a pattern element including a pattern surface, the substrate carrier positioned adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip that is less than the sum of the unconstrained caliper, Hs, of the substrate and the maximum thickness, Et, of the elastic material;
intermittently deflecting a first portion of the pattern surface away from the slot die applicator by advancing the substrate and the elastic material between the pattern element and the first lip, the slot opening, and the second lip of the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; and
discharging adhesive from the slot opening of the slot die applicator onto the elastic material.

11. The method of claim 10 , wherein the minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip of the slot die applicator is less than the unconstrained caliper, Hs, of the substrate.

12. The method of claim 10 , wherein the substrate carrier comprises a roller.

13. The method of claim 10 , wherein the substrate carrier comprises an endless belt.

14. The method of claim 10 , wherein the elastic material comprises an elastic strand.

15. The method of claim 10 , wherein the elastic material comprises an elastic ribbon.

16. The method of claim 10 , wherein the substrate comprises a nonwoven.

17. The method of claim 10 , wherein the substrate comprises a nonwoven layer and a film layer.

18. A method for making an elastic laminate, the method comprising the steps of:
advancing a substrate, the substrate comprising a first surface disposed opposite of a second surface;
stretching the elastic material;
engaging the substrate with a substrate carrier, the substrate carrier comprising: a pattern element including a pattern surface, the substrate carrier positioned adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip of the slot die applicator that is less than the sum of the unconstrained caliper, Hs, of the substrate and the maximum thickness, Et, of the elastic material;
advancing the second surface of the substrate and the elastic material past the slot die applicator while the first surface of the substrate is disposed on the substrate carrier;
intermittently deflecting a first portion of the pattern surface away from the slot die applicator by advancing the substrate and the elastic material between the pattern element and the first lip, the slot opening, and the second lip of the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; and
discharging adhesive from the slot opening of the slot die applicator onto the elastic material.

19. The method of claim 18 , further comprising the step of: folding a first portion of the second surface the substrate onto the elastic material.

20. The method of claim 18 , further comprising the step of: adhering a second substrate with the second surface of the substrate and the elastic material.

Assignees

• Procter & Gamble

Inventors

• Brown Darrell Ian
• Strasemeier John Andrew

Classifications

• A61F13/15699 Primary

  Forming webs by bringing together several webs, e.g. by laminating or folding several webs, with or without additional treatment of the webs · CPC title

• B32B2262/0253

  Polyolefin fibres · CPC title

• B05C1/0808

  Details thereof, e.g. surface characteristics · CPC title

• B32B5/26

  another layer {next to it} also being fibrous or filamentary {(relative arrangement of fibres or filaments of different layers B32B5/12)} · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title