Method and device for stripping a cable having a multi-layered sheath

US10727654B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10727654-B2
Application numberUS-201715785521-A
CountryUS
Kind codeB2
Filing dateOct 17, 2017
Priority dateOct 18, 2016
Publication dateJul 28, 2020
Grant dateJul 28, 2020

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

In a method for stripping a cable having a multi-layered sheath, first, an initial layer of the sheath of the cable is cut in a stripping device using at least one stripping blade. This is followed by cutting an inner layer of the sheath located opposite the first layer using a laser beam of a laser cutting device. The stripping process is completed by removal of the sheath that was cut using the stripping blade and the laser beam.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for stripping a cable having a multi-layered sheath comprising the steps of: at least partly mechanically separating at least one layer of the sheath of the cable; and at least partly separating another layer of the sheath of the cable by a thermal separation process; performing the mechanically separating step using at least one stripping blade of a stripping device and performing the thermal separation process step using a laser beam of a laser cutting device; the method for stripping a cable further comprising: a) cutting a first layer of the sheath by performing one of the mechanically separating step and the thermal separation process step; b) cutting an inner layer of the sheath located opposite the first layer by performing another one of the mechanically separating step and the thermal separation step; and c) removing from the cable a portion of the sheath cut by the at least one stripping blade and the laser beam. 2. The method for stripping a cable according to claim 1 including repeating at least one of the mechanically separating step and the thermal separation step before performing the step c). 3. The method according to claim 1 including, after the step a) is performed, displacing a cut portion of the first layer to form a split exposing the inner layer to be cut. 4. The method according to claim 1 including between performing the steps a) and b), transferring the cable from the stripping device to the laser cutting device using a transfer device. 5. The method according to claim 4 including after the step b) is performed, returning the cable to the stripping device using the transfer device and moving the least one stripping blade of the stripping device to partly or fully remove the portion of the sheath. 6. The method according to claim 5 including forming a slit by the partly removing the portion of the sheath, and introducing into the slit the laser beam of the laser cutting device to cut an additional layer of the sheath. 7. A device for stripping a cable having a multi-layered sheath comprising: a stripping device with at least one stripping blade; and a laser cutting device wherein the stripping device and the laser cutting device are each positioned for selectively cutting different layers of the sheath by performing the method according to claim 1 . 8. The device according to claim 7 including a control device connected to the stripping device and to the laser cutting device for controlling the stripping device to cut at least one layer of the sheath and for controlling the laser cutting device to cut at least another layer of the sheath. 9. The device according to claim 7 including a transfer device for transferring the cable between the stripping device and the laser cutting device. 10. The device according to claim 9 wherein the control device automatically feeds the cable from the stripping device to the laser cutting device after the cutting of the at least one layer or feeds the cable from the laser cutting device to the stripping device after the cutting of the at least another layer.

Assignees

Inventors

Classifications

  • Features relating to cutting elements · CPC title

  • using wire or cable-clamping means · CPC title

  • H02G1/128Primary

    using radiant energy, e.g. a laser beam · CPC title

  • the cutting element rotating about the wire or cable (making longitudinal and transverse or helical cut H02G1/1268) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10727654B2 cover?
In a method for stripping a cable having a multi-layered sheath, first, an initial layer of the sheath of the cable is cut in a stripping device using at least one stripping blade. This is followed by cutting an inner layer of the sheath located opposite the first layer using a laser beam of a laser cutting device. The stripping process is completed by removal of the sheath that was cut using t…
Who is the assignee on this patent?
Komax Holding Ag
What technology area does this patent fall under?
Primary CPC classification H02G1/128. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 28 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).