Neutron-detecting apparatuses and methods of fabrication
US-2015380593-A1 · Dec 31, 2015 · US
US10727258B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10727258-B2 |
| Application number | US-201716082899-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 31, 2017 |
| Priority date | May 12, 2017 |
| Publication date | Jul 28, 2020 |
| Grant date | Jul 28, 2020 |
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This application provides a display device and an active array switch substrate thereof. The active array switch substrate includes: a substrate; active array switches, formed on the substrate, where the active array switch includes a source electrode; at least one solar structure, disposed on the source electrode, where the solar structure includes a solar cell; and a transparent electrode, covered on the solar cell. The solar cell includes an N-type layer, an I-type layer of a microcrystalline silicon structure, and a P-type layer sequentially stacked in a direction away from the source electrode.
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What is claimed is: 1. An active array switch substrate, comprising: a substrate; active array switches, formed on the substrate, wherein the active array switch comprises a source electrode; at least one solar structure, disposed on the source electrode, wherein the solar structure comprises a solar cell; and a transparent electrode, covered on the solar cell, wherein the solar cell comprises an N-type layer, an I-type layer of a microcrystalline silicon structure, and a P-type layer sequentially stacked in a direction away from the source electrode; wherein suitable spacing enables the transparent electrode to be partially exposed without being totally covered by the solar structure. 2. The active array switch substrate according to claim 1 , wherein the I-type layer of the microcrystalline silicon structure is manufactured by performing plasma enhanced chemical vapor deposition (PECVD) on silane (SiH 4 ) and hydrogen (H 2 ), wherein a mixed ratio of the H 2 to the SiH 4 is in a range of 40 to 200. 3. The active array switch substrate according to claim 1 , wherein a material of the transparent electrode is one selected from zinc oxide (ZnO), stannic oxide (SnO 2 ), indium tin oxide (ITO), and indium oxide (In 2 O 3 ). 4. The active array switch substrate according to claim 1 , wherein the I-type layer of the microcrystalline silicon structure is a main area for optical-to-electrical conversion. 5. An active array switch substrate, comprising: a substrate; active array switches, formed on the substrate, wherein the active array switch comprises a source electrode; a first solar structure, disposed on the source electrode, wherein the first solar structure comprises a first solar cell; a second solar structure, disposed on the first solar structure, wherein the second solar structure comprises a second solar cell; and a transparent electrode, covered on the second solar cell, wherein the first solar cell comprises an N-type layer, an I-type layer of a microcrystalline silicon structure, and a P-type layer sequentially stacked in a direction away from the source electrode, and the second solar cell comprises an N-type layer, an I-type layer of an amorphous silicon (a-Si) structure, and a P-type layer sequentially stacked in a direction away from the source electrode; wherein suitable spacing enables the transparent electrode to be partially exposed without being totally covered by the second solar structure. 6. The active array switch substrate according to claim 5 , wherein the I-type layer of the microcrystalline silicon structure is manufactured by performing PECVD on SiH 4 and H 2 , and a mixed ratio of the H 2 to the SiH 4 is in a range of 40 to 200. 7. The active array switch substrate according to claim 5 , wherein a material of the transparent electrode is one selected from ZnO, SnO 2 , ITO, and In 2 O 3 . 8. The active array switch substrate according to claim 5 , wherein the I-type layer of the microcrystalline silicon structure and the I-type layer of the a-Si structure are main areas for optical-to-electrical conversion. 9. A display device, comprising: a display panel; at least one tandem solar structure, disposed on a periphery of the display panel, and configured to absorb and convert a ray of light to electric energy for the display device; and active array switches, disposed on one side of the display panel, and configured to control an image-display function of the display panel; wherein the tandem solar structure comprises: a transparent substrate; a plurality of transparent electrodes, disposed on the transparent substrate at equal spacing; a plurality of solar structures, respectively deposited on the corresponding transparent electrodes at suitable spacing, to define each transparent electrode and a corresponding solar structure as a solar cell unit; and a plurality of metal electrodes, respectively formed on the corresponding solar structures, wherein the solar structure comprises a first solar cell and a second solar cell, wherein the suitable spacing enables the transparent electrode to be partially exposed without being totally covered by the solar structure. 10. The display device according to claim 9 , wherein a material of the transparent electrode is one selected from ZnO, SnO 2 , ITO, and In 2 O 3 . 11. The display device according to claim 9 , wherein a material of the metal electrode is one selected from aluminum (Al), silver (Ag), molybdenum (Mo), copper (Cu), titanium (Ti), and an alloy thereof. 12. The display device according to claim 9 , wherein the I-type layer of the microcrystalline silicon structure and the I-type layer of the a-Si structure are main areas for optical-to-electrical conversion.
including microcrystalline silicon · CPC title
wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices · CPC title
comprising zinc oxide [ZnO] · CPC title
comprising indium tin oxide [ITO] · CPC title
Photovoltaic cells having only PIN junction potential barriers · CPC title
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