Halogen-free epoxy resin composition and a prepreg and a laminate using the same

Patent metadata

Field	Value
Publication number	US-10723875-B2
Application number	US-201715744686-A
Country	US
Kind code	B2
Filing date	Aug 14, 2017
Priority date	Jun 5, 2017
Publication date	Jul 28, 2020
Grant date	Jul 28, 2020

Abstract

The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.

First claim

The invention claimed is:

1. A halogen-free epoxy resin composition comprising the following components:
(A) a halogen-free epoxy resin;
(B) an active ester resin;
(C) a reactive phosphorous-containing flame retardant;
wherein the reactive phosphorous-containing flame retardant has the following structure:

wherein R is

X is

wherein Y is a substituted phenyl, an unsubstituted phenyl, a substituted naphthyl or an unsubstituted naphthyl; Z does not exist or is a group selected from —CH 2 or

n and m are integers independently selected from 0 to 2, and n+m is an integer greater than or equal to 1.

2. The halogen-free epoxy resin composition according to claim 1 , wherein the halogen-free epoxy resin is any one or a mixture of at least two of biphenyl novolac epoxy resin, dicyclopentadiene (DCPD) novolac epoxy resin, alkylene novolac epoxy resin or bisphenol A novolac epoxy resin.

3. The halogen-free epoxy resin composition according to claim 1 , wherein the active ester resin has the following structure:

wherein X is phenyl or naphthyl; j is 0 or 1; k is 0 or 1; n represents a repeating unit and is from 0.25 to 1.25.

4. The halogen-free epoxy resin composition according to claim 3 , wherein based on 100 parts by weight of the halogen-free epoxy resin, the active ester resin is added in an amount of 11 to 37 parts by weight;
wherein based on 100 parts by weight of the halogen-free epoxy resin, the reactive phosphorous-containing flame retardant is added in an amount of 40 to 66 parts by weight.

5. The halogen-free epoxy resin composition according to claim 1 , wherein the halogen-free epoxy resin composition further comprises a cyanate ester or a prepolymer thereof.

6. The halogen-free epoxy resin composition according to claim 5 , wherein based on 100 parts by weight of the sum of the halogen-free epoxy resin, the active ester resin and the reactive phosphorous-containing flame retardant, the cyanate ester or the prepolymer thereof is added in an amount of 10 to 20 parts by weight.

7. The halogen-free epoxy resin composition according to claim 1 , wherein the halogen-free epoxy resin composition further comprises a curing accelerator.

8. The halogen-free epoxy resin composition according to claim 7 , wherein based on 100 parts by weight of the sum of the halogen-free epoxy resin, the active ester resin and the reactive phosphorous-containing flame retardant, the curing accelerator is added in an amount of 0.05 to 1 part by weight.

9. The halogen-free epoxy resin composition according to claim 7 , wherein the curing accelerator is any one or a mixture of at least two of 4-dimethylaminopyridine, 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole or zinc isocaprylate.

10. The halogen-free epoxy resin composition according to claim 1 , wherein the halogen-free epoxy resin composition further comprises a flame-retardant compound.

11. The halogen-free epoxy resin composition according to claim 10 , wherein the flame-retardant compound is a flame-retardant salt.

12. The halogen-free epoxy resin composition according to claim 11 , wherein the flame-retardant compound is a phosphate compound or a nitrogen-containing phosphate compound.

13. The halogen-free epoxy resin composition according to claim 10 , wherein based on 100 parts by weight of the sum of the halogen-free epoxy resin, the active ester resin and the reactive phosphorous-containing flame retardant, the flame-retardant compound is added in an amount of 0 to 50 parts by weight and 0 is excluded.

14. The halogen-free epoxy resin composition according to claim 1 , wherein the halogen-free epoxy resin composition further comprises a filler.

15. The halogen-free epoxy resin composition according to claim 14 , wherein the filler is an organic and/or an inorganic filler.

16. The halogen-free epoxy resin composition according to claim 14 , wherein based on 100 parts by weight of the sum of the halogen-free epoxy resin, the active ester resin and the reactive phosphorous-containing flame retardant, the filler is added in an amount of 0 to 100 parts by weight and 0 is excluded.

17. The halogen-free epoxy resin composition according to claim 15 , wherein the inorganic filler is any one or a mixture of at least two of fused silica, crystalline silica, spherical silica, hollow silica, aluminum hydroxide, alumina, talc powder, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica or glass fiber powder;
wherein the organic filler is any one or a mixture of at least two of polytetrafluoroethylene powder, polyphenylene sulfide or polyether sulfone powder.

18. The halogen-free epoxy resin composition according to claim 14 , wherein the filler is silica, the median particle size of the filler is from 1 to 15 μm.

19. A prepreg comprising a reinforcing material and a halogen-free epoxy resin composition according to claim 1 adhered thereon after being impregnated and dried.

20. A laminate comprising at least one prepreg according to claim 19 .

Assignees

• Shengyi Technology Co Ltd

Inventors

• Zeng Xianping
• He Liexiang

Classifications

• C08J5/249

  characterised by the additives used in the prepolymer mixture · CPC title

• C08J5/244

  using glass fibres · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B2307/748

  Releasability · CPC title

• B32B2307/308

  Heat stability · CPC title