Housing assembly and method

US10723082B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10723082-B2
Application numberUS-201815920310-A
CountryUS
Kind codeB2
Filing dateMar 13, 2018
Priority dateApr 7, 2017
Publication dateJul 28, 2020
Grant dateJul 28, 2020

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cover for a housing of a vehicle and a method of sealing a cover to the housing, where in at least one example, the cover comprises a cover body configured to cover an opening of the housing and to engage the housing at an interface around the opening. The cover may comprise a heating element embedded within the cover body and operable to at least partially melt a portion of the cover body as a part of a process for sealing the cover to the housing. The portion of the cover body may deform and conform to an interface feature at the mating surface of the housing due to the at least partial melting of the portion of the cover body, and, in some examples, the heating element may be configured to fail and be inoperable.

First claim

Opening claim text (preview).

The invention claimed is: 1. A cover for a housing within a vehicle, wherein the cover comprises: a cover body which covers an opening of the housing and engages with the housing at an interface around the opening, the cover body having a mating surface that engages a corresponding mating surface of the housing so as to form the interface; and a heating element comprising a resistive wire embedded within the cover body and operable to at least partially melt a portion of the cover body, such that the portion of the cover body deforms and conforms to an interface feature at the mating surface of the housing; wherein the resistive wire comprises a first portion having a first diameter and a second portion having a second diameter, wherein the first diameter is different from the second diameter. 2. The cover of claim 1 , wherein the interface extends at least partially around an edge of the cover body and the heating element is embedded at the edge of the cover body. 3. The cover of claim 1 , wherein the cover is configured such that the portion of the cover body that is to be at least partially melted by the heating element extends along a length of the interface when the heating element is operated. 4. The cover of claim 1 , wherein the portion of the cover body that is to be at least partially melted by the heating element has a greater thickness than an adjacent portion of the cover body that is not to be melted by the heating element. 5. A method of sealing a cover to a housing, comprising: aligning a cover mating surface and a corresponding housing mating surface; heating a heating element embedded within the cover, wherein the heating element comprises a first resistive wire embedded within the cover body; at least partially melting the cover mating surface; and deforming the cover mating surface to conform to the corresponding housing mating surface; wherein the heating element further comprises a second resistive wire, and wherein heating the heating element further comprises applying a second electric current to the second resistive wire, wherein a magnitude of the second electric current is different from that of a first electric current. 6. The method of claim 5 , wherein heating the heating element comprises inducing the first electric current within the first resistive wire via an electromagnetic coil arranged outside of the cover. 7. The method of claim 6 , wherein the heating element comprises the second resistive wire embedded within the cover mating surface, and wherein the step of heating the cover comprises inducing the second electric current within the second resistive wire, wherein the magnitude of the second electric current is different from that of the first electric current. 8. The method of claim 5 , wherein deforming the cover mating surface comprises applying a force to the cover to press the cover mating surface against the corresponding housing mating surface while the cover mating surface is at least partially melted. 9. The method of claim 8 , further comprising breaking the heating element, wherein the heating element is inoperable after the heating element is broken. 10. The method of claim 9 , wherein the heating element is broken responsive to the heating element being heated to at least a predetermined temperature for at least a predetermined period of time.

Assignees

Inventors

Classifications

  • forming a specific polygon not provided for in B29C66/24241 - B29C66/24243 · CPC title

  • in the plane of the joint, e.g. along the joint line in the plane of the joint or perpendicular to the joint line in the plane of the joint · CPC title

  • Cooling · CPC title

  • by steps · CPC title

  • characterised by the means for supplying heat to said heated elements which remain in the join, e.g. special electrical connectors of windings (B29C65/3668 takes precedence) · CPC title

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Frequently asked questions

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What does patent US10723082B2 cover?
A cover for a housing of a vehicle and a method of sealing a cover to the housing, where in at least one example, the cover comprises a cover body configured to cover an opening of the housing and to engage the housing at an interface around the opening. The cover may comprise a heating element embedded within the cover body and operable to at least partially melt a portion of the cover body as…
Who is the assignee on this patent?
Ford Motor Co, Ford Global Tech Llc
What technology area does this patent fall under?
Primary CPC classification F16J15/02. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jul 28 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).